SG11202106472PA - Method for slicing workpiece and wire saw - Google Patents

Method for slicing workpiece and wire saw

Info

Publication number
SG11202106472PA
SG11202106472PA SG11202106472PA SG11202106472PA SG11202106472PA SG 11202106472P A SG11202106472P A SG 11202106472PA SG 11202106472P A SG11202106472P A SG 11202106472PA SG 11202106472P A SG11202106472P A SG 11202106472PA SG 11202106472P A SG11202106472P A SG 11202106472PA
Authority
SG
Singapore
Prior art keywords
wire saw
slicing
workpiece
slicing workpiece
saw
Prior art date
Application number
SG11202106472PA
Other languages
English (en)
Inventor
Kenji Kobayashi
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of SG11202106472PA publication Critical patent/SG11202106472PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
SG11202106472PA 2019-01-15 2019-12-25 Method for slicing workpiece and wire saw SG11202106472PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019004381A JP6969579B2 (ja) 2019-01-15 2019-01-15 ワークの切断方法及びワイヤソー
PCT/JP2019/050777 WO2020149125A1 (ja) 2019-01-15 2019-12-25 ワークの切断方法及びワイヤソー

Publications (1)

Publication Number Publication Date
SG11202106472PA true SG11202106472PA (en) 2021-07-29

Family

ID=71614327

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202106472PA SG11202106472PA (en) 2019-01-15 2019-12-25 Method for slicing workpiece and wire saw

Country Status (8)

Country Link
US (1) US20220016802A1 (de)
JP (1) JP6969579B2 (de)
KR (1) KR20210113204A (de)
CN (1) CN113226640B (de)
DE (1) DE112019005935T5 (de)
SG (1) SG11202106472PA (de)
TW (1) TWI838449B (de)
WO (1) WO2020149125A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113478665A (zh) * 2021-07-14 2021-10-08 山西汇智博科科技发展有限公司 一种高精度半导体加工用单线切割机
JP7072180B1 (ja) * 2021-12-20 2022-05-20 有限会社サクセス 半導体結晶ウェハの製造方法および製造装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3656317B2 (ja) 1996-03-27 2005-06-08 信越半導体株式会社 ワイヤソーによるワーク切断方法及び装置
JP2000158319A (ja) * 1998-11-27 2000-06-13 Fujikoshi Mach Corp ダイヤモンドワイヤーソー及び切断加工方法
JP2002254327A (ja) * 2001-03-02 2002-09-10 Ngk Insulators Ltd ワイヤーソー用ソーワイヤーおよびそれを用いた加工方法
CN101502945B (zh) * 2009-03-16 2011-04-06 浙江工业大学 新型线锯
JP2011031386A (ja) * 2009-07-10 2011-02-17 Mitsubishi Chemicals Corp 電着式固定砥粒ワイヤーおよびこれを用いた結晶スライス方法
JP5263536B2 (ja) * 2009-07-14 2013-08-14 信越半導体株式会社 ワークの切断方法
JP5045765B2 (ja) * 2010-01-20 2012-10-10 信越半導体株式会社 インゴットの切断方法及びワイヤソー
CN102225593B (zh) * 2011-04-29 2014-03-05 桂林创源金刚石有限公司 金刚石线锯装置
DE102012201938B4 (de) * 2012-02-09 2015-03-05 Siltronic Ag Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück
JP2015147293A (ja) * 2014-01-09 2015-08-20 株式会社コベルコ科研 被加工物の切断方法
JP6272801B2 (ja) * 2015-07-27 2018-01-31 信越半導体株式会社 ワークホルダー及びワークの切断方法
JP6402700B2 (ja) * 2015-10-20 2018-10-10 信越半導体株式会社 ワークの切断方法及びワイヤソー
KR102476617B1 (ko) * 2017-05-02 2022-12-12 신에쯔 한도타이 가부시키가이샤 워크의 절단 방법 및 접합 부재

Also Published As

Publication number Publication date
WO2020149125A1 (ja) 2020-07-23
CN113226640A (zh) 2021-08-06
CN113226640B (zh) 2023-04-18
US20220016802A1 (en) 2022-01-20
TW202035090A (zh) 2020-10-01
JP2020110886A (ja) 2020-07-27
KR20210113204A (ko) 2021-09-15
DE112019005935T5 (de) 2021-08-19
TWI838449B (zh) 2024-04-11
JP6969579B2 (ja) 2021-11-24

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