SG11202007956YA - Cu alloy bonding wire for semiconductor device - Google Patents

Cu alloy bonding wire for semiconductor device

Info

Publication number
SG11202007956YA
SG11202007956YA SG11202007956YA SG11202007956YA SG11202007956YA SG 11202007956Y A SG11202007956Y A SG 11202007956YA SG 11202007956Y A SG11202007956Y A SG 11202007956YA SG 11202007956Y A SG11202007956Y A SG 11202007956YA SG 11202007956Y A SG11202007956Y A SG 11202007956YA
Authority
SG
Singapore
Prior art keywords
semiconductor device
bonding wire
alloy bonding
alloy
wire
Prior art date
Application number
SG11202007956YA
Other languages
English (en)
Inventor
Tetsuya Oyamada
Tomohiro Uno
Takashi Yamada
Daizo Oda
Original Assignee
Nippon Steel Chemical & Material Co Ltd
Nippon Micrometal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical & Material Co Ltd, Nippon Micrometal Corp filed Critical Nippon Steel Chemical & Material Co Ltd
Publication of SG11202007956YA publication Critical patent/SG11202007956YA/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Wire Bonding (AREA)
SG11202007956YA 2018-09-21 2019-09-20 Cu alloy bonding wire for semiconductor device SG11202007956YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018177261 2018-09-21
PCT/JP2019/037023 WO2020059856A1 (fr) 2018-09-21 2019-09-20 Fil de connexion en alliage de cuivre pour dispositif à semi-conducteur

Publications (1)

Publication Number Publication Date
SG11202007956YA true SG11202007956YA (en) 2020-09-29

Family

ID=69887171

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202007956YA SG11202007956YA (en) 2018-09-21 2019-09-20 Cu alloy bonding wire for semiconductor device

Country Status (7)

Country Link
US (1) US10985130B2 (fr)
EP (1) EP3745450A4 (fr)
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KR20200121847A (ko) 2020-10-26
CN111886685A (zh) 2020-11-03
CN111886685B (zh) 2021-10-08
PH12020551276A1 (en) 2021-05-31
EP3745450A1 (fr) 2020-12-02
WO2020059856A1 (fr) 2020-03-26
EP3745450A4 (fr) 2023-06-14
WO2020059856A9 (fr) 2020-06-18
KR102208869B1 (ko) 2021-01-27
US10985130B2 (en) 2021-04-20

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