SG11202007405TA - Method and apparatus for cleaning substrates - Google Patents

Method and apparatus for cleaning substrates

Info

Publication number
SG11202007405TA
SG11202007405TA SG11202007405TA SG11202007405TA SG11202007405TA SG 11202007405T A SG11202007405T A SG 11202007405TA SG 11202007405T A SG11202007405T A SG 11202007405TA SG 11202007405T A SG11202007405T A SG 11202007405TA SG 11202007405T A SG11202007405T A SG 11202007405TA
Authority
SG
Singapore
Prior art keywords
cleaning substrates
substrates
cleaning
Prior art date
Application number
SG11202007405TA
Other languages
English (en)
Inventor
Hui Wang
Xi Wang
Fuping Chen
Xiaoyan Zhang
Fufa Chen
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11202007405TA publication Critical patent/SG11202007405TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2220/00—Type of materials or objects being removed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2240/00—Type of materials or objects being cleaned

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11202007405TA 2018-02-07 2018-02-07 Method and apparatus for cleaning substrates SG11202007405TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/075550 WO2019153134A1 (en) 2018-02-07 2018-02-07 Method and apparatus for cleaning substrates

Publications (1)

Publication Number Publication Date
SG11202007405TA true SG11202007405TA (en) 2020-09-29

Family

ID=67547762

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202007405TA SG11202007405TA (en) 2018-02-07 2018-02-07 Method and apparatus for cleaning substrates

Country Status (6)

Country Link
US (1) US11911807B2 (zh)
JP (1) JP7373492B2 (zh)
KR (1) KR102512832B1 (zh)
CN (1) CN111656486A (zh)
SG (1) SG11202007405TA (zh)
WO (1) WO2019153134A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114657571A (zh) * 2022-04-08 2022-06-24 中国大唐集团科学技术研究院有限公司中南电力试验研究院 一种仿生超疏水表面协同物理场的新型阻垢方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719765B2 (ja) * 1986-01-17 1995-03-06 松下電器産業株式会社 処理方法
JPH0795541B2 (ja) 1986-07-02 1995-10-11 松下電器産業株式会社 処理方法
JPH04311035A (ja) * 1991-04-10 1992-11-02 Fujitsu Ltd 半導体装置の製造方法
US5427622A (en) * 1993-02-12 1995-06-27 International Business Machines Corporation Method for uniform cleaning of wafers using megasonic energy
US6058945A (en) 1996-05-28 2000-05-09 Canon Kabushiki Kaisha Cleaning methods of porous surface and semiconductor surface
TW355815B (en) * 1996-05-28 1999-04-11 Canon Kasei Kk Cleaning methods of porous surface and semiconductor surface
US6138698A (en) * 1997-11-20 2000-10-31 Tokyo Electron Limited Ultrasonic cleaning apparatus
JP4917651B2 (ja) * 1999-08-12 2012-04-18 アクアサイエンス株式会社 レジスト膜除去装置及びレジスト膜除去方法
TW498471B (en) * 2001-07-13 2002-08-11 Taiwan Semiconductor Mfg Manufacturing method for solder bump
JP4187540B2 (ja) * 2003-01-31 2008-11-26 大日本スクリーン製造株式会社 基板処理方法
JP4311035B2 (ja) 2003-02-17 2009-08-12 セイコーエプソン株式会社 印刷装置、印刷方法、印刷用コンピュータプログラム、印刷用コンピュータシステム、および印刷用補正用パターン
US7718009B2 (en) * 2004-08-30 2010-05-18 Applied Materials, Inc. Cleaning submicron structures on a semiconductor wafer surface
US7879783B2 (en) * 2007-01-11 2011-02-01 Air Products And Chemicals, Inc. Cleaning composition for semiconductor substrates
JP5413016B2 (ja) * 2008-07-31 2014-02-12 東京エレクトロン株式会社 基板の洗浄方法、基板の洗浄装置及び記憶媒体
US20100224215A1 (en) 2009-03-06 2010-09-09 Imec Method for Reducing the Damage Induced by a Physical Force Assisted Cleaning
US9455139B2 (en) * 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US20120052204A1 (en) * 2010-08-31 2012-03-01 Applied Materials, Inc. Workpiece wetting and cleaning
US10714436B2 (en) * 2012-12-12 2020-07-14 Lam Research Corporation Systems and methods for achieving uniformity across a redistribution layer
US9613833B2 (en) * 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
CN107636799B (zh) 2015-05-20 2021-12-03 盛美半导体设备(上海)股份有限公司 清洗半导体衬底的方法和装置
JP2017216443A (ja) * 2016-05-20 2017-12-07 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 再配線層における均一性を実現するためのシステム及び方法

Also Published As

Publication number Publication date
JP7373492B2 (ja) 2023-11-02
US20210394239A1 (en) 2021-12-23
US11911807B2 (en) 2024-02-27
WO2019153134A1 (en) 2019-08-15
CN111656486A (zh) 2020-09-11
KR20200118459A (ko) 2020-10-15
KR102512832B1 (ko) 2023-03-23
JP2021517733A (ja) 2021-07-26

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