SG11202003327UA - Ceramic, probe guiding member, probe card, and socket for package inspection - Google Patents

Ceramic, probe guiding member, probe card, and socket for package inspection

Info

Publication number
SG11202003327UA
SG11202003327UA SG11202003327UA SG11202003327UA SG11202003327UA SG 11202003327U A SG11202003327U A SG 11202003327UA SG 11202003327U A SG11202003327U A SG 11202003327UA SG 11202003327U A SG11202003327U A SG 11202003327UA SG 11202003327U A SG11202003327U A SG 11202003327UA
Authority
SG
Singapore
Prior art keywords
probe
socket
ceramic
guiding member
package inspection
Prior art date
Application number
SG11202003327UA
Other languages
English (en)
Inventor
Wataru Yamagishi
Kazumasa Mori
Shunichi Eto
Original Assignee
Ferrotec Material Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferrotec Material Tech Corporation filed Critical Ferrotec Material Tech Corporation
Publication of SG11202003327UA publication Critical patent/SG11202003327UA/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • C—CHEMISTRY; METALLURGY
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/583—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on boron nitride
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    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/486—Fine ceramics
    • C04B35/488—Composites
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    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
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    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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    • G01R31/2896—Testing of IC packages; Test features related to IC packages
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    • C04B2235/94—Products characterised by their shape
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/94—Products characterised by their shape
    • C04B2235/945—Products containing grooves, cuts, recesses or protusions
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Composite Materials (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)
SG11202003327UA 2017-10-20 2018-10-19 Ceramic, probe guiding member, probe card, and socket for package inspection SG11202003327UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017203052 2017-10-20
PCT/JP2018/039052 WO2019078364A1 (ja) 2017-10-20 2018-10-19 セラミックス、プローブ案内部品、プローブカードおよびパッケージ検査用ソケット

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SG11202003327UA true SG11202003327UA (en) 2020-05-28

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US (1) US11940466B2 (ko)
EP (1) EP3699160A4 (ko)
JP (1) JP6961008B2 (ko)
KR (1) KR102419954B1 (ko)
CN (2) CN115626828A (ko)
PH (1) PH12020550262A1 (ko)
SG (1) SG11202003327UA (ko)
TW (1) TWI683796B (ko)
WO (1) WO2019078364A1 (ko)

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Publication number Priority date Publication date Assignee Title
JP7148472B2 (ja) * 2019-09-27 2022-10-05 株式会社フェローテックマテリアルテクノロジーズ セラミックス部品およびセラミックス部品の製造方法
WO2021206148A1 (ja) * 2020-04-10 2021-10-14 株式会社フェローテックマテリアルテクノロジーズ セラミックス、プローブ案内部品、プローブカードおよびパッケージ検査用ソケット
KR102453341B1 (ko) 2020-06-15 2022-10-11 현대모비스 주식회사 차량용 배터리 마운트 구조
KR102606892B1 (ko) * 2021-06-15 2023-11-29 (주)포인트엔지니어링 검사 소켓용 지지 플레이트, 검사 소켓용 소켓핀 및 이들을 구비하는 검사 소켓

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Publication number Publication date
KR20200072524A (ko) 2020-06-22
TWI683796B (zh) 2020-02-01
KR102419954B1 (ko) 2022-07-12
WO2019078364A1 (ja) 2019-04-25
EP3699160A4 (en) 2021-08-18
CN111247115A (zh) 2020-06-05
EP3699160A1 (en) 2020-08-26
CN115626828A (zh) 2023-01-20
TW201922673A (zh) 2019-06-16
US11940466B2 (en) 2024-03-26
JP6961008B2 (ja) 2021-11-05
US20200241047A1 (en) 2020-07-30
JPWO2019078364A1 (ja) 2020-11-19
PH12020550262A1 (en) 2021-03-01

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