SG11202003738VA - Ceramic, probe guiding member, probe card, and socket for package inspection - Google Patents

Ceramic, probe guiding member, probe card, and socket for package inspection

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Publication number
SG11202003738VA
SG11202003738VA SG11202003738VA SG11202003738VA SG11202003738VA SG 11202003738V A SG11202003738V A SG 11202003738VA SG 11202003738V A SG11202003738V A SG 11202003738VA SG 11202003738V A SG11202003738V A SG 11202003738VA SG 11202003738V A SG11202003738V A SG 11202003738VA
Authority
SG
Singapore
Prior art keywords
probe
socket
ceramic
guiding member
package inspection
Prior art date
Application number
SG11202003738VA
Inventor
Wataru Yamagishi
Kazumasa Mori
Shunichi Eto
Original Assignee
Ferrotec Material Tech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferrotec Material Tech Corporation filed Critical Ferrotec Material Tech Corporation
Publication of SG11202003738VA publication Critical patent/SG11202003738VA/en

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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C04B35/593Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering
    • C04B35/5935Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering obtained by gas pressure sintering
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    • GPHYSICS
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    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • GPHYSICS
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    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
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  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
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SG11202003738VA 2017-11-10 2018-11-07 Ceramic, probe guiding member, probe card, and socket for package inspection SG11202003738VA (en)

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JP7148472B2 (en) * 2019-09-27 2022-10-05 株式会社フェローテックマテリアルテクノロジーズ Ceramic part and method for manufacturing ceramic part
JP7373651B2 (en) * 2020-04-10 2023-11-02 株式会社フェローテックマテリアルテクノロジーズ Ceramics, probe guide components, probe cards and package inspection sockets
JPWO2022024888A1 (en) * 2020-07-27 2022-02-03
CN214473542U (en) * 2021-01-08 2021-10-22 迪科特测试科技(苏州)有限公司 Probe card device
CN214473541U (en) * 2021-01-08 2021-10-22 迪科特测试科技(苏州)有限公司 Test probe module
JP7068539B1 (en) * 2021-11-15 2022-05-16 黒崎播磨株式会社 Silicon Nitride Composites and Probe Guide Parts
CN117286387A (en) 2022-06-20 2023-12-26 财团法人工业技术研究院 Composite material and composite material structure of low-melting-point alloy

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JPWO2019093370A1 (en) 2020-12-03
TW201922674A (en) 2019-06-16
US20210188714A1 (en) 2021-06-24
US11485686B2 (en) 2022-11-01
KR102505460B1 (en) 2023-03-03
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KR20200080292A (en) 2020-07-06
JP7010967B2 (en) 2022-01-26

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