SG11201709953TA - Conductive probe for inspection and semiconductor inspection device - Google Patents

Conductive probe for inspection and semiconductor inspection device

Info

Publication number
SG11201709953TA
SG11201709953TA SG11201709953TA SG11201709953TA SG11201709953TA SG 11201709953T A SG11201709953T A SG 11201709953TA SG 11201709953T A SG11201709953T A SG 11201709953TA SG 11201709953T A SG11201709953T A SG 11201709953TA SG 11201709953T A SG11201709953T A SG 11201709953TA
Authority
SG
Singapore
Prior art keywords
inspection
conductive probe
semiconductor
inspection device
semiconductor inspection
Prior art date
Application number
SG11201709953TA
Inventor
Kohei Hironaka
Kazuya Souma
Satoshi Shoji
Ryosuke Yamaguchi
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of SG11201709953TA publication Critical patent/SG11201709953TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201709953TA 2016-02-15 2017-02-01 Conductive probe for inspection and semiconductor inspection device SG11201709953TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016026041 2016-02-15
PCT/JP2017/003586 WO2017141706A1 (en) 2016-02-15 2017-02-01 Conductive contact for inspection, and semiconductor inspecting device

Publications (1)

Publication Number Publication Date
SG11201709953TA true SG11201709953TA (en) 2018-01-30

Family

ID=59626041

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709953TA SG11201709953TA (en) 2016-02-15 2017-02-01 Conductive probe for inspection and semiconductor inspection device

Country Status (6)

Country Link
US (1) US10274517B2 (en)
JP (1) JP6243584B1 (en)
PH (1) PH12017502189B1 (en)
SG (1) SG11201709953TA (en)
TW (1) TWI629484B (en)
WO (1) WO2017141706A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018084438A (en) * 2016-11-21 2018-05-31 株式会社エンプラス Electric contactor and socket for electric component
KR102212346B1 (en) * 2019-12-17 2021-02-04 주식회사 제네드 A probe pin

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174148A (en) * 1977-12-16 1979-11-13 Amerace Corporation Electrical terminal clamp assembly
US4417206A (en) * 1981-03-09 1983-11-22 Virginia Panel Corporation Electrical contact probe and method of manufacturing
JPS5896259U (en) * 1981-12-22 1983-06-30 富士通株式会社 contact pin
US4571540A (en) 1983-09-14 1986-02-18 Virginia Panel Corporation Electrical contact probe
JPS6179273U (en) * 1984-10-29 1986-05-27
JPH10214649A (en) 1997-01-30 1998-08-11 Yokowo Co Ltd Spring connector and device using spring connector
JP2000329789A (en) 1999-03-12 2000-11-30 Sony Chem Corp Needle-shaped contact probe
US6759858B2 (en) * 1999-10-20 2004-07-06 Intel Corporation Integrated circuit test probe having ridge contact
US8253430B2 (en) * 2005-04-22 2012-08-28 Hewlett-Packard Development Company Circuit board testing using a probe
JP2008157904A (en) 2006-12-25 2008-07-10 Shuichi Ikeda Contact for electric test
JP2009198238A (en) 2008-02-20 2009-09-03 Totoku Electric Co Ltd Probe needle and method of manufacturing the same
WO2011071082A1 (en) * 2009-12-11 2011-06-16 日本発條株式会社 Contact probe
JP5597108B2 (en) * 2010-11-29 2014-10-01 株式会社精研 Contact inspection jig
JP5783715B2 (en) 2010-12-20 2015-09-24 ユニテクノ株式会社 Contact probe for inspection
WO2013018809A1 (en) 2011-08-02 2013-02-07 日本発條株式会社 Probe unit
JP2013130516A (en) * 2011-12-22 2013-07-04 Yamaichi Electronics Co Ltd Contact probe and semiconductor element socket provided with the same
JP2014085207A (en) * 2012-10-23 2014-05-12 Renesas Electronics Corp Probe pin for semiconductor device test

Also Published As

Publication number Publication date
TW201802479A (en) 2018-01-16
US10274517B2 (en) 2019-04-30
WO2017141706A1 (en) 2017-08-24
US20180238932A1 (en) 2018-08-23
PH12017502189A1 (en) 2018-06-11
JPWO2017141706A1 (en) 2018-02-22
PH12017502189B1 (en) 2018-06-11
JP6243584B1 (en) 2017-12-06
TWI629484B (en) 2018-07-11

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