SG11202001687YA - Interface element for a testing apparatus of electronic devices and corresponding manufacturing method - Google Patents
Interface element for a testing apparatus of electronic devices and corresponding manufacturing methodInfo
- Publication number
- SG11202001687YA SG11202001687YA SG11202001687YA SG11202001687YA SG11202001687YA SG 11202001687Y A SG11202001687Y A SG 11202001687YA SG 11202001687Y A SG11202001687Y A SG 11202001687YA SG 11202001687Y A SG11202001687Y A SG 11202001687YA SG 11202001687Y A SG11202001687Y A SG 11202001687YA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic devices
- interface element
- testing apparatus
- corresponding manufacturing
- manufacturing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/025—General constructional details concerning dedicated user interfaces, e.g. GUI, or dedicated keyboards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000100522A IT201700100522A1 (it) | 2017-09-07 | 2017-09-07 | Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
PCT/EP2018/073187 WO2019048299A1 (en) | 2017-09-07 | 2018-08-29 | INTERFACE MEMBER FOR ELECTRONIC DEVICE TESTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202001687YA true SG11202001687YA (en) | 2020-03-30 |
Family
ID=61024852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202001687YA SG11202001687YA (en) | 2017-09-07 | 2018-08-29 | Interface element for a testing apparatus of electronic devices and corresponding manufacturing method |
Country Status (10)
Country | Link |
---|---|
US (1) | US11293941B2 (zh) |
EP (1) | EP3679381A1 (zh) |
JP (1) | JP2020533571A (zh) |
KR (1) | KR102608053B1 (zh) |
CN (1) | CN111051897B (zh) |
IT (1) | IT201700100522A1 (zh) |
PH (1) | PH12020500440A1 (zh) |
SG (1) | SG11202001687YA (zh) |
TW (1) | TWI717632B (zh) |
WO (1) | WO2019048299A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI638168B (zh) * | 2018-04-03 | 2018-10-11 | 中華精測科技股份有限公司 | 探針卡裝置及探針座 |
Family Cites Families (43)
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SU1187229A1 (ru) * | 1982-12-20 | 1985-10-23 | Akopyan Robert A | Электрический соединитель |
JP3400051B2 (ja) * | 1993-11-10 | 2003-04-28 | ザ ウィタカー コーポレーション | 異方性導電膜、その製造方法及びそれを使用するコネクタ |
JP3640268B2 (ja) * | 1995-10-06 | 2005-04-20 | ザ ウィタカー コーポレーション | コネクタ及びコネクタ製造方法 |
US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
US5892245A (en) * | 1996-11-11 | 1999-04-06 | Emulation Technology, Inc. | Ball grid array package emulator |
EP1061608A3 (en) * | 1999-05-10 | 2002-10-02 | Hirose Electric Co., Ltd. | Board to board electrical connectors |
JP3350479B2 (ja) * | 1999-05-10 | 2002-11-25 | ヒロセ電機株式会社 | 中間電気コネクタ |
US6524115B1 (en) * | 1999-08-20 | 2003-02-25 | 3M Innovative Properties Company | Compliant interconnect assembly |
TW498707B (en) * | 1999-11-26 | 2002-08-11 | Matsushita Electric Ind Co Ltd | Wiring substrate and production method thereof |
US7083436B2 (en) * | 2001-03-06 | 2006-08-01 | International Business Machines Corporation | Particle distribution interposer and method of manufacture thereof |
JP3616031B2 (ja) * | 2001-05-10 | 2005-02-02 | 富士通株式会社 | 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置 |
JP4607417B2 (ja) * | 2001-11-15 | 2011-01-05 | 株式会社フジクラ | 両面接点コネクタ |
US6574114B1 (en) * | 2002-05-02 | 2003-06-03 | 3M Innovative Properties Company | Low contact force, dual fraction particulate interconnect |
CN100493291C (zh) * | 2002-10-24 | 2009-05-27 | 国际商业机器公司 | 内插件及其制造方法 |
JP2004172588A (ja) * | 2002-10-28 | 2004-06-17 | Jsr Corp | シート状コネクターおよびその製造方法並びにプローブ装置 |
JP3753145B2 (ja) * | 2003-04-21 | 2006-03-08 | Jsr株式会社 | 異方導電性シートおよびその製造方法、アダプター装置およびその製造方法並びに回路装置の電気的検査装置 |
US6994570B2 (en) * | 2004-01-28 | 2006-02-07 | International Business Machines Corporation | High performance interposer for a chip package using deformable button contacts |
KR100968184B1 (ko) * | 2004-12-16 | 2010-07-05 | 인터내셔널 비지네스 머신즈 코포레이션 | 금속화 엘라스토머 전기 접점 |
US7442049B2 (en) * | 2005-02-09 | 2008-10-28 | International Business Machines Corporation | Electrical connecting device and method of forming same |
TWI406449B (zh) * | 2005-02-16 | 2013-08-21 | Jsr Corp | Composite conductive sheet and manufacturing method thereof, electrical inspection device for an electrically conductive connector, a connector device, and a circuit device |
US7825512B2 (en) * | 2005-09-12 | 2010-11-02 | Hewlett-Packard Development Company, L.P. | Electronic package with compliant electrically-conductive ball interconnect |
CN101467051B (zh) * | 2006-06-08 | 2012-03-28 | 日本发条株式会社 | 探针卡 |
US7759951B2 (en) * | 2007-05-29 | 2010-07-20 | Touchdown Technologies, Inc. | Semiconductor testing device with elastomer interposer |
JP2009074823A (ja) * | 2007-09-19 | 2009-04-09 | Ngk Spark Plug Co Ltd | 電子部品検査装置用配線基板およびその製造方法 |
KR100952712B1 (ko) * | 2007-12-27 | 2010-04-13 | 주식회사 아이에스시테크놀러지 | 판형 도전입자를 포함한 실리콘 콘택터 |
KR100978549B1 (ko) * | 2007-12-28 | 2010-08-27 | 티에스씨멤시스(주) | 프로브 구조물 및 프로브 구조물 제조 방법 |
CN101971037A (zh) * | 2008-03-14 | 2011-02-09 | 富士胶片株式会社 | 探针卡 |
JP5253972B2 (ja) * | 2008-04-28 | 2013-07-31 | 富士フイルム株式会社 | 構造体およびその製造方法 |
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JP5448675B2 (ja) * | 2009-09-25 | 2014-03-19 | パナソニック株式会社 | プローブカード及びそれを用いた半導体ウェーハの検査方法 |
TWI534432B (zh) * | 2010-09-07 | 2016-05-21 | 瓊斯科技國際公司 | 用於微電路測試器之電氣傳導針腳 |
US8832933B2 (en) * | 2011-09-15 | 2014-09-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of fabricating a semiconductor test probe head |
US8917106B2 (en) * | 2011-11-09 | 2014-12-23 | Advantest America, Inc. | Fine pitch microelectronic contact array and method of making same |
KR101215375B1 (ko) * | 2011-11-25 | 2012-12-26 | (주)기가레인 | 컨택트 필름, 상기 컨택트 필름의 제조방법, 프로브 유닛 및 lcd 패널 검사장치 |
US9263817B2 (en) * | 2013-06-12 | 2016-02-16 | Ironwood Electronics, Inc. | Adapter apparatus with suspended conductive elastomer interconnect |
US9459285B2 (en) * | 2013-07-10 | 2016-10-04 | Globalfoundries Inc. | Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assembly |
KR101544844B1 (ko) * | 2014-02-28 | 2015-08-20 | 김형익 | 와이어드 러버 컨택트 및 그 제조방법 |
WO2015132747A1 (en) * | 2014-03-06 | 2015-09-11 | Technoprobe S.P.A. | High-planarity probe card for a testing apparatus for electronic devices |
KR101706331B1 (ko) * | 2014-10-17 | 2017-02-15 | 주식회사 아이에스시 | 검사용 소켓 |
JP2016178121A (ja) * | 2015-03-18 | 2016-10-06 | タツタ電線株式会社 | ストレッチャブルケーブルおよびストレッチャブル回路基板 |
WO2016156003A1 (en) * | 2015-03-31 | 2016-10-06 | Technoprobe S.P.A. | Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications |
JP6918518B2 (ja) * | 2017-02-27 | 2021-08-11 | デクセリアルズ株式会社 | 電気特性の検査冶具 |
-
2017
- 2017-09-07 IT IT102017000100522A patent/IT201700100522A1/it unknown
-
2018
- 2018-08-29 WO PCT/EP2018/073187 patent/WO2019048299A1/en unknown
- 2018-08-29 JP JP2020513536A patent/JP2020533571A/ja active Pending
- 2018-08-29 EP EP18759326.4A patent/EP3679381A1/en active Pending
- 2018-08-29 SG SG11202001687YA patent/SG11202001687YA/en unknown
- 2018-08-29 KR KR1020207009666A patent/KR102608053B1/ko active IP Right Grant
- 2018-08-29 CN CN201880058238.6A patent/CN111051897B/zh active Active
- 2018-08-30 TW TW107130331A patent/TWI717632B/zh active
-
2020
- 2020-03-03 US US16/808,305 patent/US11293941B2/en active Active
- 2020-03-05 PH PH12020500440A patent/PH12020500440A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20200200795A1 (en) | 2020-06-25 |
KR20200051007A (ko) | 2020-05-12 |
WO2019048299A1 (en) | 2019-03-14 |
TW201930892A (zh) | 2019-08-01 |
JP2020533571A (ja) | 2020-11-19 |
KR102608053B1 (ko) | 2023-11-29 |
CN111051897A (zh) | 2020-04-21 |
EP3679381A1 (en) | 2020-07-15 |
TWI717632B (zh) | 2021-02-01 |
CN111051897B (zh) | 2023-01-24 |
IT201700100522A1 (it) | 2019-03-07 |
US11293941B2 (en) | 2022-04-05 |
PH12020500440A1 (en) | 2021-01-25 |
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