SG10201706446VA - An Apparatus and Method for Transferring Electronic Devices - Google Patents
An Apparatus and Method for Transferring Electronic DevicesInfo
- Publication number
- SG10201706446VA SG10201706446VA SG10201706446VA SG10201706446VA SG10201706446VA SG 10201706446V A SG10201706446V A SG 10201706446VA SG 10201706446V A SG10201706446V A SG 10201706446VA SG 10201706446V A SG10201706446V A SG 10201706446VA SG 10201706446V A SG10201706446V A SG 10201706446VA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic devices
- transferring electronic
- transferring
- devices
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Operations Research (AREA)
- Specific Conveyance Elements (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/243,640 US10056278B2 (en) | 2016-08-22 | 2016-08-22 | Apparatus and method for transferring electronic devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201706446VA true SG10201706446VA (en) | 2018-03-28 |
Family
ID=61192096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201706446VA SG10201706446VA (en) | 2016-08-22 | 2017-08-08 | An Apparatus and Method for Transferring Electronic Devices |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10056278B2 (en) |
| KR (1) | KR102047221B1 (en) |
| CN (1) | CN107771024B (en) |
| MY (1) | MY184932A (en) |
| SG (1) | SG10201706446VA (en) |
| TW (1) | TWI646033B (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10996308B2 (en) * | 2018-04-17 | 2021-05-04 | Asm Technology Singapore Pte Ltd | Apparatus and method for authentication of electronic device test stations |
| MY192110A (en) * | 2018-07-26 | 2022-07-28 | Mi Equipment M Sdn Bhd | Method for automatic alignment of an electronic component during die sorting process |
| JP6727568B2 (en) * | 2018-10-16 | 2020-07-22 | 上野精機株式会社 | Electronic component transport facility |
| CN109808227A (en) * | 2019-03-21 | 2019-05-28 | 浙江新立机械有限公司 | Double disc paper cup machine |
| US11592477B2 (en) * | 2019-04-29 | 2023-02-28 | Asmpt Singapore Pte. Ltd. | Test handler having multiple testing sectors |
| DE102019004470B4 (en) * | 2019-06-25 | 2021-12-09 | Mühlbauer Gmbh & Co. Kg | Component conveying device with a setting unit and method for setting a component conveying device |
| US10748794B1 (en) * | 2019-07-09 | 2020-08-18 | Asm Technology Singapore Pte Ltd | Apparatus for transferring electronic devices |
| KR20220097920A (en) | 2019-11-08 | 2022-07-08 | 세미컨덕터 테크놀로지스 앤드 인스트루먼츠 피티이 엘티디 | component handler |
| KR102386337B1 (en) * | 2019-11-08 | 2022-04-13 | 세메스 주식회사 | Die transfer module and die bonding apparatus having the same |
| JP2021106263A (en) * | 2019-12-26 | 2021-07-26 | サトーホールディングス株式会社 | Ic chip-mounting device and ic chip-mounting method |
| CN111343847B (en) * | 2020-04-26 | 2021-06-11 | 方强 | Ultra-high-speed chip mounting method and chip mounting head |
| WO2021228403A1 (en) * | 2020-05-14 | 2021-11-18 | Cohu Gmbh | An automated test system for testing singulated electronic components and a method of testing singulated electronic components |
| JP6836816B1 (en) * | 2020-05-28 | 2021-03-03 | 上野精機株式会社 | Electronic component processing equipment |
| CN113644015B (en) * | 2021-10-15 | 2021-12-24 | 四川晶辉半导体有限公司 | Semiconductor frame glues core device |
| JP7492221B1 (en) | 2024-01-15 | 2024-05-29 | 上野精機株式会社 | Conveyor |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6171049B1 (en) | 1996-02-29 | 2001-01-09 | Alphasem Ag | Method and device for receiving, orientating and assembling of components |
| SG104292A1 (en) * | 2002-01-07 | 2004-06-21 | Advance Systems Automation Ltd | Flip chip bonder and method therefor |
| TW200419640A (en) * | 2003-02-25 | 2004-10-01 | Matsushita Electric Ind Co Ltd | Electronic component placement machine and electronic component placement method |
| JP4296914B2 (en) * | 2003-12-08 | 2009-07-15 | アシスト テクノロジーズ ジャパン株式会社 | Position teaching device and transport system including the same |
| WO2007057291A1 (en) | 2005-11-15 | 2007-05-24 | Ismeca Semiconductor Holding Sa | Device and method of inverting electronic components |
| JP2009154889A (en) * | 2007-12-25 | 2009-07-16 | Canon Machinery Inc | Part feeding device and taping apparatus |
| JP5448096B2 (en) | 2010-11-30 | 2014-03-19 | 上野精機株式会社 | Rotary pickup mechanism and semiconductor processing apparatus having the same |
| CN102751169A (en) * | 2011-04-19 | 2012-10-24 | 亿广科技(上海)有限公司 | Chip taking and placing device |
| KR20140144121A (en) * | 2013-06-07 | 2014-12-18 | (주)제이티 | Device Handler |
| EP3115796A1 (en) * | 2013-11-11 | 2017-01-11 | Rasco GmbH | A carrier, assembly & method for handling components |
| KR102231146B1 (en) * | 2014-04-22 | 2021-03-23 | (주)제이티 | Transfer tool module, needle pin assembly, and device handler having the same |
-
2016
- 2016-08-22 US US15/243,640 patent/US10056278B2/en active Active
-
2017
- 2017-08-04 TW TW106126300A patent/TWI646033B/en active
- 2017-08-07 MY MYPI2017001155A patent/MY184932A/en unknown
- 2017-08-08 SG SG10201706446VA patent/SG10201706446VA/en unknown
- 2017-08-18 CN CN201710713850.XA patent/CN107771024B/en active Active
- 2017-08-21 KR KR1020170105626A patent/KR102047221B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| US10056278B2 (en) | 2018-08-21 |
| CN107771024B (en) | 2020-12-01 |
| US20180053671A1 (en) | 2018-02-22 |
| CN107771024A (en) | 2018-03-06 |
| TW201806842A (en) | 2018-03-01 |
| KR102047221B1 (en) | 2019-11-21 |
| TWI646033B (en) | 2019-01-01 |
| KR20180021652A (en) | 2018-03-05 |
| MY184932A (en) | 2021-04-30 |
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