SG11201911734SA - Contact element system - Google Patents
Contact element systemInfo
- Publication number
- SG11201911734SA SG11201911734SA SG11201911734SA SG11201911734SA SG11201911734SA SG 11201911734S A SG11201911734S A SG 11201911734SA SG 11201911734S A SG11201911734S A SG 11201911734SA SG 11201911734S A SG11201911734S A SG 11201911734SA SG 11201911734S A SG11201911734S A SG 11201911734SA
- Authority
- SG
- Singapore
- Prior art keywords
- contact element
- element system
- contact
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017209510.5A DE102017209510A1 (de) | 2017-06-06 | 2017-06-06 | Kontaktelementsystem |
PCT/EP2018/064683 WO2018224458A1 (de) | 2017-06-06 | 2018-06-05 | Kontaktelementsystem |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201911734SA true SG11201911734SA (en) | 2020-01-30 |
Family
ID=62620832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201911734SA SG11201911734SA (en) | 2017-06-06 | 2018-06-05 | Contact element system |
Country Status (7)
Country | Link |
---|---|
US (1) | US11519937B2 (zh) |
EP (1) | EP3635413B1 (zh) |
CN (1) | CN110709710B (zh) |
DE (1) | DE102017209510A1 (zh) |
SG (1) | SG11201911734SA (zh) |
TW (1) | TWI695549B (zh) |
WO (1) | WO2018224458A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI736361B (zh) * | 2020-07-15 | 2021-08-11 | 中華精測科技股份有限公司 | 探針卡裝置及其柵欄狀探針 |
TWI745182B (zh) * | 2020-11-30 | 2021-11-01 | 中華精測科技股份有限公司 | 探針卡裝置及雙臂式探針 |
TWI817426B (zh) * | 2022-03-31 | 2023-10-01 | 中華精測科技股份有限公司 | 模組化垂直式探針卡的探針頭 |
TWI805298B (zh) * | 2022-03-31 | 2023-06-11 | 中華精測科技股份有限公司 | 多針形垂直式探針卡 |
TWI802353B (zh) * | 2022-03-31 | 2023-05-11 | 中華精測科技股份有限公司 | 探針頭及其柵欄狀探針 |
TWI831328B (zh) * | 2022-08-15 | 2024-02-01 | 思達科技股份有限公司 | 探針陣列及探針結構 |
Family Cites Families (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4963822A (en) * | 1988-06-01 | 1990-10-16 | Manfred Prokopp | Method of testing circuit boards and the like |
JPH07109780B2 (ja) * | 1991-02-19 | 1995-11-22 | 山一電機株式会社 | 電気部品用ソケットにおけるコンタクト |
US5385477A (en) * | 1993-07-30 | 1995-01-31 | Ck Technologies, Inc. | Contactor with elastomer encapsulated probes |
US6246247B1 (en) * | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6741085B1 (en) * | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
FR2722617B1 (fr) * | 1994-07-12 | 1998-06-12 | Everett Charles Tech | Contacts electriques a ressort plein pour des connecteurs et des sondes electriques |
ATE260470T1 (de) * | 1997-11-05 | 2004-03-15 | Feinmetall Gmbh | Prüfkopf für mikrostrukturen mit schnittstelle |
JP3323449B2 (ja) | 1998-11-18 | 2002-09-09 | 日本碍子株式会社 | 半導体用ソケット |
US20020048973A1 (en) * | 1998-11-30 | 2002-04-25 | Yu Zhou | Contact structure and production method thereof and probe contact assembly using same |
JP2002531915A (ja) * | 1998-12-02 | 2002-09-24 | フォームファクター,インコーポレイテッド | リソグラフィ接触要素 |
US6672875B1 (en) * | 1998-12-02 | 2004-01-06 | Formfactor, Inc. | Spring interconnect structures |
US6419500B1 (en) * | 1999-03-08 | 2002-07-16 | Kulicke & Soffa Investment, Inc. | Probe assembly having floatable buckling beam probes and apparatus for abrading the same |
US6196866B1 (en) * | 1999-04-30 | 2001-03-06 | International Business Machines Corporation | Vertical probe housing |
US6414504B2 (en) * | 1999-05-20 | 2002-07-02 | Delaware Capital Formation, Inc. | Coaxial tilt pin fixture for testing high frequency circuit boards |
US7435108B1 (en) * | 1999-07-30 | 2008-10-14 | Formfactor, Inc. | Variable width resilient conductive contact structures |
US6676438B2 (en) * | 2000-02-14 | 2004-01-13 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6276973B1 (en) | 2000-03-01 | 2001-08-21 | Hon Hai Precision Ind. Co., Ltd. | Contact of electrical connector |
IT1317517B1 (it) * | 2000-05-11 | 2003-07-09 | Technoprobe S R L | Testa di misura per microstrutture |
US7254889B1 (en) * | 2000-09-08 | 2007-08-14 | Gabe Cherian | Interconnection devices |
US7265565B2 (en) * | 2003-02-04 | 2007-09-04 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components and methods for making such probes |
US6945827B2 (en) * | 2002-12-23 | 2005-09-20 | Formfactor, Inc. | Microelectronic contact structure |
WO2004112451A1 (en) * | 2003-06-11 | 2004-12-23 | Neoconix, Inc. | Land grid array connector |
US8988091B2 (en) * | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
TWI397696B (zh) * | 2006-02-19 | 2013-06-01 | Gunsei Kimoto | Probe assembly |
US7782072B2 (en) | 2006-09-27 | 2010-08-24 | Formfactor, Inc. | Single support structure probe group with staggered mounting pattern |
US8907689B2 (en) * | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
JP2008203036A (ja) * | 2007-02-19 | 2008-09-04 | Micronics Japan Co Ltd | 電気的接続装置 |
JP5099487B2 (ja) * | 2007-08-03 | 2012-12-19 | 軍生 木本 | 複数梁合成型接触子 |
KR100859120B1 (ko) * | 2008-03-11 | 2008-09-18 | 주식회사 파이컴 | 전기부품의 검사를 위한 접속소자 |
JP2009270880A (ja) * | 2008-05-02 | 2009-11-19 | Micronics Japan Co Ltd | 電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体 |
DE102008023761B9 (de) | 2008-05-09 | 2012-11-08 | Feinmetall Gmbh | Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung |
IT1395336B1 (it) * | 2009-01-20 | 2012-09-14 | Rise Technology S R L | Dispositivo di contatto elastico per componenti elettronici a colonne collassanti |
US7749032B1 (en) * | 2009-06-25 | 2010-07-06 | Cheng Uei Precision Industry Co., Ltd. | Probe connector |
JP5325085B2 (ja) * | 2009-12-24 | 2013-10-23 | 日本碍子株式会社 | 接続装置 |
KR101141836B1 (ko) * | 2010-05-28 | 2012-05-07 | 송원호 | 침압완화부가 형성된 미세 수직형 프로브 |
JP2012093127A (ja) * | 2010-10-25 | 2012-05-17 | Advanced Systems Japan Inc | バーチカルプローブヘッド |
JP5693266B2 (ja) * | 2011-01-31 | 2015-04-01 | 富士通コンポーネント株式会社 | コネクタ |
US9702904B2 (en) * | 2011-03-21 | 2017-07-11 | Formfactor, Inc. | Non-linear vertical leaf spring |
US8884640B2 (en) * | 2011-04-28 | 2014-11-11 | Mpi Corporation | Integrated high-speed probe system |
JP2013007700A (ja) | 2011-06-27 | 2013-01-10 | Japan Electronic Materials Corp | 電気的接触子 |
JP5847663B2 (ja) * | 2012-08-01 | 2016-01-27 | 日本電子材料株式会社 | プローブカード用ガイド板の製造方法 |
KR101363367B1 (ko) * | 2012-09-04 | 2014-02-25 | 주식회사 에스피에스테크 | 인쇄회로기판 검사장치 |
US10359447B2 (en) * | 2012-10-31 | 2019-07-23 | Formfactor, Inc. | Probes with spring mechanisms for impeding unwanted movement in guide holes |
CN108333394B (zh) | 2012-12-04 | 2020-06-09 | 日本电子材料株式会社 | 接触探针 |
JP6475238B2 (ja) * | 2013-07-09 | 2019-02-27 | フォームファクター, インコーポレイテッド | 導電性ガイド板を通る信号経路及び導電性ガイド板の間の2次経路を備えるマルチパス電気プローブ並びにプローブ・アセンブリ |
US20150061719A1 (en) * | 2013-09-05 | 2015-03-05 | Soulbrain Eng Co., Ltd. | Vertical probe card for micro-bump probing |
TW201537181A (zh) * | 2014-03-25 | 2015-10-01 | Mpi Corp | 垂直式探針裝置及使用於該垂直式探針裝置之支撐柱 |
US20160178663A1 (en) * | 2014-12-23 | 2016-06-23 | Intel Corporation | Formed wire probe interconnect for test die contactor |
DE102015001926B4 (de) * | 2015-02-13 | 2023-03-09 | Feinmetall Gmbh | Elektrisches Kontaktelement |
CN107430150B (zh) | 2015-03-13 | 2020-08-21 | 泰克诺探头公司 | 特别用于高频应用的具有竖向探针的测试头 |
CN107430151B (zh) * | 2015-03-31 | 2021-06-15 | 泰克诺探头公司 | 特别适用于高频应用的竖向接触探针和包含其的测试头 |
US10256564B2 (en) * | 2015-03-31 | 2019-04-09 | Enplas Corporation | Electric component socket and manufacturing method for the same |
CN107580681B (zh) * | 2015-05-07 | 2020-06-19 | 泰克诺探头公司 | 尤其用于减小节距的应用的、具有竖直探针的测试头 |
JP6654061B2 (ja) * | 2016-02-23 | 2020-02-26 | 日本電子材料株式会社 | プローブガイド、プローブカード及びプローブガイドの製造方法 |
JP6832661B2 (ja) * | 2016-09-28 | 2021-02-24 | 株式会社日本マイクロニクス | プローブカード及び接触検査装置 |
CN108572265A (zh) * | 2017-03-14 | 2018-09-25 | 旺矽科技股份有限公司 | 微机电探针及其制造方法以及具有该微机电探针的探针头 |
US10644458B2 (en) * | 2017-03-31 | 2020-05-05 | Intel Corporation | Shielded interconnect array |
DE102020102302A1 (de) * | 2020-01-30 | 2021-08-05 | Ingun Prüfmittelbau Gmbh | Hochfrequenz-Prüfkontaktelement und Prüfstiftvorrichtung |
-
2017
- 2017-06-06 DE DE102017209510.5A patent/DE102017209510A1/de not_active Ceased
-
2018
- 2018-06-01 TW TW107118893A patent/TWI695549B/zh active
- 2018-06-05 EP EP18731375.4A patent/EP3635413B1/de active Active
- 2018-06-05 CN CN201880037039.7A patent/CN110709710B/zh active Active
- 2018-06-05 SG SG11201911734SA patent/SG11201911734SA/en unknown
- 2018-06-05 US US16/618,855 patent/US11519937B2/en active Active
- 2018-06-05 WO PCT/EP2018/064683 patent/WO2018224458A1/de unknown
Also Published As
Publication number | Publication date |
---|---|
US20200166541A1 (en) | 2020-05-28 |
EP3635413A1 (de) | 2020-04-15 |
TWI695549B (zh) | 2020-06-01 |
WO2018224458A1 (de) | 2018-12-13 |
DE102017209510A1 (de) | 2018-12-06 |
CN110709710A (zh) | 2020-01-17 |
CN110709710B (zh) | 2022-03-29 |
US11519937B2 (en) | 2022-12-06 |
EP3635413B1 (de) | 2023-08-23 |
TW201904136A (zh) | 2019-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL263833A (en) | Aneurysm device and delivery system | |
PT3600950T (pt) | Sistema de contacto em subsolo | |
IL261000B (en) | Cyber security system | |
PL3350883T3 (pl) | Element stykowy przyłącza przewodu | |
IL247302B (en) | Systems for releasing materials based on polymer emulsions | |
EP3695118C0 (en) | MICRO DRIVE SYSTEM | |
SG11201911734SA (en) | Contact element system | |
GB2569335B (en) | Chatbot system | |
PL3706970T3 (pl) | Instalacja do przetwarzania obrzeży | |
HK1246742A1 (zh) | 滑接線裝置 | |
EP3598407C0 (en) | SYSTEM | |
GB201713486D0 (en) | Collision-warning system | |
RS60806B1 (sr) | Kontaktni sistem | |
RS61318B1 (sr) | Element za promenu pravca | |
PL3576885T3 (pl) | System wytłaczania | |
PL3464736T3 (pl) | Układ elementu zużywalnego | |
GB201705629D0 (en) | Electrical system | |
EP3398881C0 (en) | SYSTEM | |
GB201719724D0 (en) | Trolleycar system | |
GB201718121D0 (en) | Telescopic-lateral system | |
GB201716560D0 (en) | System | |
GB201712189D0 (en) | System | |
GB201710304D0 (en) | Communuications system | |
SI3323943T1 (sl) | Sistem ograje | |
GB201714152D0 (en) | Connection system |