SG11201911734SA - Contact element system - Google Patents

Contact element system

Info

Publication number
SG11201911734SA
SG11201911734SA SG11201911734SA SG11201911734SA SG11201911734SA SG 11201911734S A SG11201911734S A SG 11201911734SA SG 11201911734S A SG11201911734S A SG 11201911734SA SG 11201911734S A SG11201911734S A SG 11201911734SA SG 11201911734S A SG11201911734S A SG 11201911734SA
Authority
SG
Singapore
Prior art keywords
contact element
element system
contact
Prior art date
Application number
SG11201911734SA
Other languages
English (en)
Inventor
Gunther Böhm
Matthias Schnaithmann
Achim Weiland
Original Assignee
Feinmetall Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Feinmetall Gmbh filed Critical Feinmetall Gmbh
Publication of SG11201911734SA publication Critical patent/SG11201911734SA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/0675Needle-like
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/20Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
SG11201911734SA 2017-06-06 2018-06-05 Contact element system SG11201911734SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017209510.5A DE102017209510A1 (de) 2017-06-06 2017-06-06 Kontaktelementsystem
PCT/EP2018/064683 WO2018224458A1 (de) 2017-06-06 2018-06-05 Kontaktelementsystem

Publications (1)

Publication Number Publication Date
SG11201911734SA true SG11201911734SA (en) 2020-01-30

Family

ID=62620832

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201911734SA SG11201911734SA (en) 2017-06-06 2018-06-05 Contact element system

Country Status (7)

Country Link
US (1) US11519937B2 (zh)
EP (1) EP3635413B1 (zh)
CN (1) CN110709710B (zh)
DE (1) DE102017209510A1 (zh)
SG (1) SG11201911734SA (zh)
TW (1) TWI695549B (zh)
WO (1) WO2018224458A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI736361B (zh) * 2020-07-15 2021-08-11 中華精測科技股份有限公司 探針卡裝置及其柵欄狀探針
TWI745182B (zh) * 2020-11-30 2021-11-01 中華精測科技股份有限公司 探針卡裝置及雙臂式探針
TWI817426B (zh) * 2022-03-31 2023-10-01 中華精測科技股份有限公司 模組化垂直式探針卡的探針頭
TWI805298B (zh) * 2022-03-31 2023-06-11 中華精測科技股份有限公司 多針形垂直式探針卡
TWI802353B (zh) * 2022-03-31 2023-05-11 中華精測科技股份有限公司 探針頭及其柵欄狀探針
TWI831328B (zh) * 2022-08-15 2024-02-01 思達科技股份有限公司 探針陣列及探針結構

Family Cites Families (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4963822A (en) * 1988-06-01 1990-10-16 Manfred Prokopp Method of testing circuit boards and the like
JPH07109780B2 (ja) * 1991-02-19 1995-11-22 山一電機株式会社 電気部品用ソケットにおけるコンタクト
US5385477A (en) * 1993-07-30 1995-01-31 Ck Technologies, Inc. Contactor with elastomer encapsulated probes
US6246247B1 (en) * 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
FR2722617B1 (fr) * 1994-07-12 1998-06-12 Everett Charles Tech Contacts electriques a ressort plein pour des connecteurs et des sondes electriques
ATE260470T1 (de) * 1997-11-05 2004-03-15 Feinmetall Gmbh Prüfkopf für mikrostrukturen mit schnittstelle
JP3323449B2 (ja) 1998-11-18 2002-09-09 日本碍子株式会社 半導体用ソケット
US20020048973A1 (en) * 1998-11-30 2002-04-25 Yu Zhou Contact structure and production method thereof and probe contact assembly using same
JP2002531915A (ja) * 1998-12-02 2002-09-24 フォームファクター,インコーポレイテッド リソグラフィ接触要素
US6672875B1 (en) * 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US6419500B1 (en) * 1999-03-08 2002-07-16 Kulicke & Soffa Investment, Inc. Probe assembly having floatable buckling beam probes and apparatus for abrading the same
US6196866B1 (en) * 1999-04-30 2001-03-06 International Business Machines Corporation Vertical probe housing
US6414504B2 (en) * 1999-05-20 2002-07-02 Delaware Capital Formation, Inc. Coaxial tilt pin fixture for testing high frequency circuit boards
US7435108B1 (en) * 1999-07-30 2008-10-14 Formfactor, Inc. Variable width resilient conductive contact structures
US6676438B2 (en) * 2000-02-14 2004-01-13 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6276973B1 (en) 2000-03-01 2001-08-21 Hon Hai Precision Ind. Co., Ltd. Contact of electrical connector
IT1317517B1 (it) * 2000-05-11 2003-07-09 Technoprobe S R L Testa di misura per microstrutture
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
US7265565B2 (en) * 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
WO2004112451A1 (en) * 2003-06-11 2004-12-23 Neoconix, Inc. Land grid array connector
US8988091B2 (en) * 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
TWI397696B (zh) * 2006-02-19 2013-06-01 Gunsei Kimoto Probe assembly
US7782072B2 (en) 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
US8907689B2 (en) * 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
JP2008203036A (ja) * 2007-02-19 2008-09-04 Micronics Japan Co Ltd 電気的接続装置
JP5099487B2 (ja) * 2007-08-03 2012-12-19 軍生 木本 複数梁合成型接触子
KR100859120B1 (ko) * 2008-03-11 2008-09-18 주식회사 파이컴 전기부품의 검사를 위한 접속소자
JP2009270880A (ja) * 2008-05-02 2009-11-19 Micronics Japan Co Ltd 電子デバイスの電気的試験用接触子、その製造方法及びプローブ組立体
DE102008023761B9 (de) 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
IT1395336B1 (it) * 2009-01-20 2012-09-14 Rise Technology S R L Dispositivo di contatto elastico per componenti elettronici a colonne collassanti
US7749032B1 (en) * 2009-06-25 2010-07-06 Cheng Uei Precision Industry Co., Ltd. Probe connector
JP5325085B2 (ja) * 2009-12-24 2013-10-23 日本碍子株式会社 接続装置
KR101141836B1 (ko) * 2010-05-28 2012-05-07 송원호 침압완화부가 형성된 미세 수직형 프로브
JP2012093127A (ja) * 2010-10-25 2012-05-17 Advanced Systems Japan Inc バーチカルプローブヘッド
JP5693266B2 (ja) * 2011-01-31 2015-04-01 富士通コンポーネント株式会社 コネクタ
US9702904B2 (en) * 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
US8884640B2 (en) * 2011-04-28 2014-11-11 Mpi Corporation Integrated high-speed probe system
JP2013007700A (ja) 2011-06-27 2013-01-10 Japan Electronic Materials Corp 電気的接触子
JP5847663B2 (ja) * 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
KR101363367B1 (ko) * 2012-09-04 2014-02-25 주식회사 에스피에스테크 인쇄회로기판 검사장치
US10359447B2 (en) * 2012-10-31 2019-07-23 Formfactor, Inc. Probes with spring mechanisms for impeding unwanted movement in guide holes
CN108333394B (zh) 2012-12-04 2020-06-09 日本电子材料株式会社 接触探针
JP6475238B2 (ja) * 2013-07-09 2019-02-27 フォームファクター, インコーポレイテッド 導電性ガイド板を通る信号経路及び導電性ガイド板の間の2次経路を備えるマルチパス電気プローブ並びにプローブ・アセンブリ
US20150061719A1 (en) * 2013-09-05 2015-03-05 Soulbrain Eng Co., Ltd. Vertical probe card for micro-bump probing
TW201537181A (zh) * 2014-03-25 2015-10-01 Mpi Corp 垂直式探針裝置及使用於該垂直式探針裝置之支撐柱
US20160178663A1 (en) * 2014-12-23 2016-06-23 Intel Corporation Formed wire probe interconnect for test die contactor
DE102015001926B4 (de) * 2015-02-13 2023-03-09 Feinmetall Gmbh Elektrisches Kontaktelement
CN107430150B (zh) 2015-03-13 2020-08-21 泰克诺探头公司 特别用于高频应用的具有竖向探针的测试头
CN107430151B (zh) * 2015-03-31 2021-06-15 泰克诺探头公司 特别适用于高频应用的竖向接触探针和包含其的测试头
US10256564B2 (en) * 2015-03-31 2019-04-09 Enplas Corporation Electric component socket and manufacturing method for the same
CN107580681B (zh) * 2015-05-07 2020-06-19 泰克诺探头公司 尤其用于减小节距的应用的、具有竖直探针的测试头
JP6654061B2 (ja) * 2016-02-23 2020-02-26 日本電子材料株式会社 プローブガイド、プローブカード及びプローブガイドの製造方法
JP6832661B2 (ja) * 2016-09-28 2021-02-24 株式会社日本マイクロニクス プローブカード及び接触検査装置
CN108572265A (zh) * 2017-03-14 2018-09-25 旺矽科技股份有限公司 微机电探针及其制造方法以及具有该微机电探针的探针头
US10644458B2 (en) * 2017-03-31 2020-05-05 Intel Corporation Shielded interconnect array
DE102020102302A1 (de) * 2020-01-30 2021-08-05 Ingun Prüfmittelbau Gmbh Hochfrequenz-Prüfkontaktelement und Prüfstiftvorrichtung

Also Published As

Publication number Publication date
US20200166541A1 (en) 2020-05-28
EP3635413A1 (de) 2020-04-15
TWI695549B (zh) 2020-06-01
WO2018224458A1 (de) 2018-12-13
DE102017209510A1 (de) 2018-12-06
CN110709710A (zh) 2020-01-17
CN110709710B (zh) 2022-03-29
US11519937B2 (en) 2022-12-06
EP3635413B1 (de) 2023-08-23
TW201904136A (zh) 2019-01-16

Similar Documents

Publication Publication Date Title
IL263833A (en) Aneurysm device and delivery system
PT3600950T (pt) Sistema de contacto em subsolo
IL261000B (en) Cyber security system
PL3350883T3 (pl) Element stykowy przyłącza przewodu
IL247302B (en) Systems for releasing materials based on polymer emulsions
EP3695118C0 (en) MICRO DRIVE SYSTEM
SG11201911734SA (en) Contact element system
GB2569335B (en) Chatbot system
PL3706970T3 (pl) Instalacja do przetwarzania obrzeży
HK1246742A1 (zh) 滑接線裝置
EP3598407C0 (en) SYSTEM
GB201713486D0 (en) Collision-warning system
RS60806B1 (sr) Kontaktni sistem
RS61318B1 (sr) Element za promenu pravca
PL3576885T3 (pl) System wytłaczania
PL3464736T3 (pl) Układ elementu zużywalnego
GB201705629D0 (en) Electrical system
EP3398881C0 (en) SYSTEM
GB201719724D0 (en) Trolleycar system
GB201718121D0 (en) Telescopic-lateral system
GB201716560D0 (en) System
GB201712189D0 (en) System
GB201710304D0 (en) Communuications system
SI3323943T1 (sl) Sistem ograje
GB201714152D0 (en) Connection system