SG11201909842PA - Method for manufacturing polycrystalline silicon fragment and method for managing surface metal concentration of polycrystalline silicon fragment - Google Patents

Method for manufacturing polycrystalline silicon fragment and method for managing surface metal concentration of polycrystalline silicon fragment

Info

Publication number
SG11201909842PA
SG11201909842PA SG11201909842PA SG11201909842PA SG 11201909842P A SG11201909842P A SG 11201909842PA SG 11201909842P A SG11201909842P A SG 11201909842PA SG 11201909842P A SG11201909842P A SG 11201909842PA
Authority
SG
Singapore
Prior art keywords
polycrystalline silicon
silicon fragment
surface metal
metal concentration
cleaning
Prior art date
Application number
Other languages
English (en)
Inventor
Shigeki Nishimura
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of SG11201909842PA publication Critical patent/SG11201909842PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/037—Purification
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C1/00—Crushing or disintegrating by reciprocating members
    • B02C1/02—Jaw crushers or pulverisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C13/00—Disintegrating by mills having rotary beater elements ; Hammer mills
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/66—Crystals of complex geometrical shape, e.g. tubes, cylinders
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/08—Etching
    • C30B33/10—Etching in solutions or melts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Food Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Silicon Compounds (AREA)
  • Crushing And Grinding (AREA)
  • Crushing And Pulverization Processes (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SG11201909842P 2017-04-24 2018-04-19 Method for manufacturing polycrystalline silicon fragment and method for managing surface metal concentration of polycrystalline silicon fragment SG11201909842PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017085404 2017-04-24
PCT/JP2018/016217 WO2018198947A1 (ja) 2017-04-24 2018-04-19 多結晶シリコン破砕物の製造方法、及び、多結晶シリコン破砕物の表面金属濃度を管理する方法

Publications (1)

Publication Number Publication Date
SG11201909842PA true SG11201909842PA (en) 2019-11-28

Family

ID=63918278

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201909842P SG11201909842PA (en) 2017-04-24 2018-04-19 Method for manufacturing polycrystalline silicon fragment and method for managing surface metal concentration of polycrystalline silicon fragment

Country Status (9)

Country Link
US (1) US11214892B2 (zh)
EP (1) EP3617144A4 (zh)
JP (1) JP7107922B2 (zh)
KR (1) KR102415059B1 (zh)
CN (1) CN110621619B (zh)
MY (1) MY191007A (zh)
SG (1) SG11201909842PA (zh)
TW (1) TWI768033B (zh)
WO (1) WO2018198947A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220281751A1 (en) 2019-08-02 2022-09-08 Tokuyama Corporation Silicon Core Wire for Depositing Polycrystalline Silicon and Production Method Therefor
EP4021849B1 (de) 2019-08-29 2024-01-03 Wacker Chemie AG Verfahren zur herstellung von siliciumbruchstücken
WO2021251095A1 (ja) 2020-06-09 2021-12-16 株式会社トクヤマ ポリシリコン破砕物およびその製造方法
CN112390259B (zh) * 2020-11-17 2022-01-28 江苏鑫华半导体材料科技有限公司 电子级多晶硅清洗方法
CN115445704A (zh) * 2022-09-22 2022-12-09 新特能源股份有限公司 多晶硅破碎筛分系统的金属处理方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121390A (ja) * 1991-10-29 1993-05-18 Koujiyundo Silicon Kk 酸の除去方法
JPH0867511A (ja) * 1994-08-31 1996-03-12 Tokuyama Corp 多結晶シリコンの製造方法
US6874713B2 (en) * 2002-08-22 2005-04-05 Dow Corning Corporation Method and apparatus for improving silicon processing efficiency
JP4093480B2 (ja) * 2003-10-31 2008-06-04 株式会社資生堂 液晶分散組成物
US7223303B2 (en) * 2004-08-26 2007-05-29 Mitsubishi Materials Corporation Silicon cleaning method for semiconductor materials and polycrystalline silicon chunk
JP4554435B2 (ja) 2005-05-23 2010-09-29 株式会社大阪チタニウムテクノロジーズ 多結晶シリコン洗浄方法
DE102006031105A1 (de) * 2006-07-05 2008-01-10 Wacker Chemie Ag Verfahren zur Reinigung von Polysilicium-Bruch
DE102006035081A1 (de) * 2006-07-28 2008-01-31 Wacker Chemie Ag Verfahren und Vorrichtung zur Herstellung von klassiertem polykristallinen Siliciumbruch in hoher Reinheit
JP5035923B2 (ja) 2009-04-27 2012-09-26 株式会社大阪チタニウムテクノロジーズ 多結晶シリコン洗浄方法
JP5751748B2 (ja) * 2009-09-16 2015-07-22 信越化学工業株式会社 多結晶シリコン塊群および多結晶シリコン塊群の製造方法
DE102011080105A1 (de) * 2011-07-29 2013-01-31 Wacker Chemie Ag Verfahren zur Reinigung von polykristallinen Siliciumbruchstücken
JP6175909B2 (ja) * 2013-05-31 2017-08-09 三菱マテリアル株式会社 多結晶シリコン洗浄方法及び多結晶シリコン洗浄装置
MY177061A (en) * 2014-02-14 2020-09-03 Tokuyama Corp Device for producing cleaned crushed product of polycrystalline silicon blocks, and method for producing cleaning crushed product of polycrystalline silicone blocks using same
JP6200857B2 (ja) * 2014-06-03 2017-09-20 信越化学工業株式会社 多結晶シリコンロッドの製造方法、多結晶シリコンロッド、および、多結晶シリコン塊
JP6403525B2 (ja) 2014-10-01 2018-10-10 信越化学工業株式会社 多結晶シリコンの表面清浄度評価方法および品質保証方法
JP2016222470A (ja) * 2015-05-27 2016-12-28 信越化学工業株式会社 多結晶シリコン片

Also Published As

Publication number Publication date
TWI768033B (zh) 2022-06-21
US11214892B2 (en) 2022-01-04
JPWO2018198947A1 (ja) 2020-03-12
JP7107922B2 (ja) 2022-07-27
EP3617144A1 (en) 2020-03-04
WO2018198947A1 (ja) 2018-11-01
US20200299860A1 (en) 2020-09-24
CN110621619B (zh) 2023-08-01
CN110621619A (zh) 2019-12-27
TW201843361A (zh) 2018-12-16
KR20190141151A (ko) 2019-12-23
EP3617144A4 (en) 2021-02-17
MY191007A (en) 2022-05-27
KR102415059B1 (ko) 2022-06-30

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