SG11201909037TA - Substrate cleaning apparatus - Google Patents

Substrate cleaning apparatus

Info

Publication number
SG11201909037TA
SG11201909037TA SG11201909037TA SG11201909037TA SG 11201909037T A SG11201909037T A SG 11201909037TA SG 11201909037T A SG11201909037T A SG 11201909037TA SG 11201909037T A SG11201909037T A SG 11201909037TA
Authority
SG
Singapore
Prior art keywords
shanghai
substrate
bld
international
ultra
Prior art date
Application number
Other languages
English (en)
Inventor
Hui Wang
Jun Wu
Cheng Cheng
Xi Wang
Zhenming Chu
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11201909037TA publication Critical patent/SG11201909037TA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Detergent Compositions (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201909037T 2017-03-30 2017-03-30 Substrate cleaning apparatus SG11201909037TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/078732 WO2018176306A1 (en) 2017-03-30 2017-03-30 Substrate cleaning apparatus

Publications (1)

Publication Number Publication Date
SG11201909037TA true SG11201909037TA (en) 2019-10-30

Family

ID=63673935

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201909037T SG11201909037TA (en) 2017-03-30 2017-03-30 Substrate cleaning apparatus

Country Status (6)

Country Link
US (1) US11298727B2 (ko)
JP (1) JP7056969B2 (ko)
KR (1) KR102415678B1 (ko)
CN (1) CN110461484B (ko)
SG (1) SG11201909037TA (ko)
WO (1) WO2018176306A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116494270B (zh) * 2023-06-29 2023-09-12 苏州安田丰科技有限公司 一种光掩膜版清洗用上下料机械手

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166517A (ja) * 1986-01-20 1987-07-23 Hitachi Electronics Eng Co Ltd 半導体製造装置のスピンヘツド
JP3455722B2 (ja) * 1994-06-03 2003-10-14 大日本スクリーン製造株式会社 ブラシ、基板処理装置及び基板処理方法
JPH09199458A (ja) * 1996-01-22 1997-07-31 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH1154471A (ja) * 1997-08-05 1999-02-26 Tokyo Electron Ltd 処理装置及び処理方法
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
EP1204139A4 (en) * 2000-04-27 2010-04-28 Ebara Corp SUPPORT AND ROTATION DEVICE AND SEMICONDUCTOR SUBSTRATE PROCESSING DEVICE
US20020066475A1 (en) * 2000-06-26 2002-06-06 Steven Verhaverbeke Chuck for holding wafer
JP3865669B2 (ja) 2002-08-30 2007-01-10 東京エレクトロン株式会社 液処理装置及び液処理方法
KR100526192B1 (ko) * 2003-05-28 2005-11-03 삼성전자주식회사 웨이퍼 세정장치 및 세정방법
US7578886B2 (en) * 2003-08-07 2009-08-25 Ebara Corporation Substrate processing apparatus, substrate processing method, and substrate holding apparatus
JP4407944B2 (ja) 2004-12-21 2010-02-03 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4734063B2 (ja) 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
JP4652959B2 (ja) 2005-11-30 2011-03-16 芝浦メカトロニクス株式会社 基板の処理装置
JP2007258240A (ja) * 2006-03-20 2007-10-04 Tokyo Electron Ltd 表面処理方法
TWI421933B (zh) * 2007-05-16 2014-01-01 Lam Res Corp 板狀物件之超音波濕式處理的裝置與方法
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing
KR101424622B1 (ko) * 2007-07-05 2014-08-01 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼의 세정 장치 및 세정 방법
JP5156488B2 (ja) * 2007-08-21 2013-03-06 大日本スクリーン製造株式会社 基板洗浄装置および基板洗浄方法
US7958899B2 (en) * 2007-08-21 2011-06-14 Dainippon Screen Mfg. Co., Ltd. Substrate cleaning apparatus and substrate cleaning method
JP5276420B2 (ja) * 2008-01-31 2013-08-28 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR101546660B1 (ko) 2008-12-12 2015-08-25 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼 세척 방법 및 장치
JP5388810B2 (ja) * 2009-11-18 2014-01-15 住友重機械工業株式会社 樹脂封止装置及び樹脂封止方法
JP2011210933A (ja) 2010-03-30 2011-10-20 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
US9153462B2 (en) * 2010-12-09 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Spin chuck for thin wafer cleaning
CN102810459B (zh) * 2011-06-03 2015-04-08 中国科学院微电子研究所 化学机械平坦化后清洗晶圆的方法
JP2013168422A (ja) 2012-02-14 2013-08-29 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP5646528B2 (ja) * 2012-03-09 2014-12-24 東京エレクトロン株式会社 液処理装置
KR101963851B1 (ko) * 2012-03-28 2019-07-31 에이씨엠 리서치 (상하이) 인코포레이티드 진공 척
KR20150046148A (ko) * 2012-09-27 2015-04-29 가부시키가이샤 스크린 홀딩스 처리액 공급 장치, 기판 처리 장치, 처리액 공급 방법, 기판 처리 방법, 처리액 처리 장치 및 처리액 처리 방법
JP5438191B2 (ja) 2012-09-27 2014-03-12 東京エレクトロン株式会社 超音波現像処理方法及び超音波現像処理装置
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KR102308587B1 (ko) * 2014-03-19 2021-10-01 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법
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Also Published As

Publication number Publication date
JP2020516076A (ja) 2020-05-28
JP7056969B2 (ja) 2022-04-19
KR20190135022A (ko) 2019-12-05
KR102415678B1 (ko) 2022-07-04
WO2018176306A1 (en) 2018-10-04
CN110461484A (zh) 2019-11-15
US20210187563A1 (en) 2021-06-24
US11298727B2 (en) 2022-04-12
CN110461484B (zh) 2022-12-27

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