SG11201909037TA - Substrate cleaning apparatus - Google Patents
Substrate cleaning apparatusInfo
- Publication number
- SG11201909037TA SG11201909037TA SG11201909037TA SG11201909037TA SG 11201909037T A SG11201909037T A SG 11201909037TA SG 11201909037T A SG11201909037T A SG 11201909037TA SG 11201909037T A SG11201909037T A SG 11201909037TA
- Authority
- SG
- Singapore
- Prior art keywords
- shanghai
- substrate
- bld
- international
- ultra
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Plasma & Fusion (AREA)
- Environmental & Geological Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Detergent Compositions (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 04 October 2018 (04.10.2018) W I PO I ~~ll~~~~~~~~ 011101010VIIIOH olo olo milo111111 mom ow (10) International Publication Number WO 2018/176306 Al PCT 1-1 O Cr) 1-1 00 O C 1-1 (51) International Patent Classification: BO8B 1/04 (2006.01) BO8B 7/04 (2006.01) BO8B 3/02 (2006.01) H01L 21/304 (2006.01) (21) International Application Number: PCT/CN2017/078732 (22) International Filing Date: 30 March 2017 (30.03.2017) (25) Filing Language: English (26) Publication Language: English (71) Applicant: ACM RESEARCH (SHANGHAI) INC. [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang High- tech Park, Shanghai 201203 (CN). (72) Inventors: WANG, Hui; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). WU, Jun; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). CHENG, Cheng; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). WANG, Xi; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). CHU, Zhenming; Bld. 4, No. 1690 Cailun Road, Shanghai Pilot Free Trade Zone, Shanghai 201203 (CN). (74) Agent: SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC; 435 Guiping Road, Shanghai 200233 (CN). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, (54) Title: SUBSTRATE CLEANING APPARATUS Fig 1 (57) : A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (107,207), and an ultra or mega sonic device (206,306). The chuck assembly is configured to receive and clamp a substrate. The at least one first nozzle (107,207) is configured to spray liquid onto the top surface of the substrate. The ultra or mega sonic device (206,306) is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate. A gap is formed between the ultra or mega sonic device (206,306) and the top surface of the substrate, and the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device (206,306) is filled with the liquid all the time during the cleaning process. [Continued on next page] WO 2018/176306 Al IMEDIMOM0101011MENOMMEN0111001101 110INVOIMIE SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2017/078732 WO2018176306A1 (en) | 2017-03-30 | 2017-03-30 | Substrate cleaning apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201909037TA true SG11201909037TA (en) | 2019-10-30 |
Family
ID=63673935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201909037T SG11201909037TA (en) | 2017-03-30 | 2017-03-30 | Substrate cleaning apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US11298727B2 (en) |
JP (1) | JP7056969B2 (en) |
KR (1) | KR102415678B1 (en) |
CN (1) | CN110461484B (en) |
SG (1) | SG11201909037TA (en) |
WO (1) | WO2018176306A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116494270B (en) * | 2023-06-29 | 2023-09-12 | 苏州安田丰科技有限公司 | Unloading manipulator is washd with going up to photomask version |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62166517A (en) | 1986-01-20 | 1987-07-23 | Hitachi Electronics Eng Co Ltd | Spin head for semiconductor manufacturing apparatus |
JP3455722B2 (en) * | 1994-06-03 | 2003-10-14 | 大日本スクリーン製造株式会社 | Brush, substrate processing apparatus and substrate processing method |
JPH09199458A (en) * | 1996-01-22 | 1997-07-31 | Dainippon Screen Mfg Co Ltd | Substrate treatment device |
JPH1154471A (en) * | 1997-08-05 | 1999-02-26 | Tokyo Electron Ltd | Treatment device and treatment method |
EP0898301B1 (en) * | 1997-08-18 | 2006-09-27 | Tokyo Electron Limited | Apparatus for cleaning both sides of a substrate |
WO2001084621A1 (en) * | 2000-04-27 | 2001-11-08 | Ebara Corporation | Rotation holding device and semiconductor substrate processing device |
US20020066475A1 (en) * | 2000-06-26 | 2002-06-06 | Steven Verhaverbeke | Chuck for holding wafer |
JP3865669B2 (en) * | 2002-08-30 | 2007-01-10 | 東京エレクトロン株式会社 | Liquid processing apparatus and liquid processing method |
KR100526192B1 (en) * | 2003-05-28 | 2005-11-03 | 삼성전자주식회사 | Apparatus and Method For Cleaning Wafer |
EP1652222A1 (en) * | 2003-08-07 | 2006-05-03 | Ebara Corporation | Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
JP4407944B2 (en) * | 2004-12-21 | 2010-02-03 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
JP4734063B2 (en) * | 2005-08-30 | 2011-07-27 | 東京エレクトロン株式会社 | Substrate cleaning apparatus and substrate cleaning method. |
JP4652959B2 (en) | 2005-11-30 | 2011-03-16 | 芝浦メカトロニクス株式会社 | Substrate processing equipment |
JP2007258240A (en) * | 2006-03-20 | 2007-10-04 | Tokyo Electron Ltd | Surface processing method |
TWI421933B (en) * | 2007-05-16 | 2014-01-01 | Lam Res Corp | Apparatus and method for ultrasonic wet treatment of plate-like articles |
JP2009004765A (en) * | 2007-05-21 | 2009-01-08 | Applied Materials Inc | Method and apparatus for using rolling backing pad for substrate polishing |
JP5466638B2 (en) * | 2007-07-05 | 2014-04-09 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | Apparatus and method for cleaning semiconductor substrate |
JP5156488B2 (en) * | 2007-08-21 | 2013-03-06 | 大日本スクリーン製造株式会社 | Substrate cleaning apparatus and substrate cleaning method |
US7958899B2 (en) * | 2007-08-21 | 2011-06-14 | Dainippon Screen Mfg. Co., Ltd. | Substrate cleaning apparatus and substrate cleaning method |
JP5276420B2 (en) * | 2008-01-31 | 2013-08-28 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate processing method |
JP5367840B2 (en) | 2008-12-12 | 2013-12-11 | エーシーエム リサーチ (シャンハイ) インコーポレーテッド | Semiconductor wafer cleaning method and apparatus |
JP5388810B2 (en) * | 2009-11-18 | 2014-01-15 | 住友重機械工業株式会社 | Resin sealing device and resin sealing method |
JP2011210933A (en) | 2010-03-30 | 2011-10-20 | Dainippon Screen Mfg Co Ltd | Substrate processing method and substrate processing apparatus |
US9153462B2 (en) * | 2010-12-09 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spin chuck for thin wafer cleaning |
CN102810459B (en) * | 2011-06-03 | 2015-04-08 | 中国科学院微电子研究所 | Method for cleaning wafer after chemical mechanical planarization |
JP2013168422A (en) | 2012-02-14 | 2013-08-29 | Dainippon Screen Mfg Co Ltd | Substrate processing method and substrate processing apparatus |
JP5646528B2 (en) | 2012-03-09 | 2014-12-24 | 東京エレクトロン株式会社 | Liquid processing equipment |
US9558985B2 (en) * | 2012-03-28 | 2017-01-31 | Acm Research (Shanghai) Inc. | Vacuum chuck |
JP5438191B2 (en) | 2012-09-27 | 2014-03-12 | 東京エレクトロン株式会社 | Ultrasonic development processing method and ultrasonic development processing apparatus |
CN104662644B (en) * | 2012-09-27 | 2018-11-27 | 斯克林集团公司 | Handle liquid supplying device and method, treatment fluid and substrate board treatment and method |
KR102229920B1 (en) * | 2013-10-25 | 2021-03-19 | 어플라이드 머티어리얼스, 인코포레이티드 | Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning |
KR102308587B1 (en) * | 2014-03-19 | 2021-10-01 | 가부시키가이샤 스크린 홀딩스 | Substrate processing apparatus and substrate processing method |
US9895711B2 (en) * | 2015-02-03 | 2018-02-20 | Tokyo Electron Limited | Substrate liquid processing apparatus, substrate liquid processing method and substrate processing apparatus |
US10037902B2 (en) | 2015-03-27 | 2018-07-31 | SCREEN Holdings Co., Ltd. | Substrate processing device and substrate processing method |
WO2016183707A1 (en) | 2015-05-15 | 2016-11-24 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
US10794872B2 (en) * | 2015-11-16 | 2020-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Acoustic measurement of fabrication equipment clearance |
-
2017
- 2017-03-30 SG SG11201909037T patent/SG11201909037TA/en unknown
- 2017-03-30 US US16/499,705 patent/US11298727B2/en active Active
- 2017-03-30 WO PCT/CN2017/078732 patent/WO2018176306A1/en active Application Filing
- 2017-03-30 CN CN201780089141.7A patent/CN110461484B/en active Active
- 2017-03-30 JP JP2019553937A patent/JP7056969B2/en active Active
- 2017-03-30 KR KR1020197031665A patent/KR102415678B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR102415678B1 (en) | 2022-07-04 |
US11298727B2 (en) | 2022-04-12 |
WO2018176306A1 (en) | 2018-10-04 |
JP2020516076A (en) | 2020-05-28 |
US20210187563A1 (en) | 2021-06-24 |
CN110461484B (en) | 2022-12-27 |
JP7056969B2 (en) | 2022-04-19 |
CN110461484A (en) | 2019-11-15 |
KR20190135022A (en) | 2019-12-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201808990QA (en) | Compositions for topical application of compounds | |
SG11201808125RA (en) | Methods for solid tumor treatment | |
SG11201806322QA (en) | Maytansinoid derivatives, conjugates thereof, and methods of use | |
SG11201903402YA (en) | Method and apparatus for creating channels in workpieces | |
SG11201811225RA (en) | Ar+ breast cancer treatment methods | |
SG11201807421TA (en) | The use of glucocorticoid receptor modulators to potentiate checkpoint inhibitors | |
SG11201908238SA (en) | Anti-c5 antibodies and uses thereof | |
SG11201407650VA (en) | Composition and process for stripping photoresist from a surface including titanium nitride | |
SG11201807827VA (en) | Process for the preparation of pegylated drug-linkers and intermediates thereof | |
SG11201807720TA (en) | Methods and systems for determining antibiotic susceptibility | |
SG11201808705XA (en) | Particle manipulation | |
SG11201811336TA (en) | Method for producing an electrode catalyst from a perovskite metal oxide | |
SG11201809374VA (en) | Cd40l-fc fusion polypeptides and methods of use thereof | |
SG11201408451WA (en) | Use of vacuum chucks to hold a wafer or wafer sub-stack | |
SG11201900609PA (en) | Method and system for providing buffer solutions | |
SG11201407294UA (en) | Contamination identification system | |
SG11201407800SA (en) | Selective binding of biological targets to solid phase ureides | |
SG11201407341TA (en) | Surface features mapping | |
SG11201810965YA (en) | 1h-pyrazolo[4,3-b]pyridines as pde1 inhibitors | |
SG11201810333UA (en) | Combination of anti-cd20 antibody, p13 kinase-delta selective inhibitor, and btk inhibitor to treat b-cell proliferative disorders | |
SG11201805898RA (en) | Liquid composition comprising a multistage polymer, its method of preparation and its use | |
SG11201809630RA (en) | Nicotine particles | |
SG11201811778PA (en) | Substrate supporting apparatus | |
SG11201901272WA (en) | Mesenchymal cell-derived exosomes to treat neurological disorders | |
SG11201903602RA (en) | Use of beta-catenin as a biomarker for treating cancers using anti-dkk-1 antibody |