JP5438191B2 - Ultrasonic development processing method and ultrasonic development processing apparatus - Google Patents

Description

  The present invention relates to an ultrasonic development processing method and apparatus for a substrate such as a glass substrate for a mask.

  In general, in the manufacture of a semiconductor device, a photolithography technique is used to form a circuit pattern on a substrate such as a semiconductor wafer or an LCD glass substrate. In this photolithographic technique, a photoresist is applied to a substrate, the resist film formed thereby is exposed according to a predetermined circuit pattern, and this exposure pattern is developed to form a circuit pattern on the resist film. ing.

  In recent years, the circuit line width has been miniaturized, and a nanoimprint lithography (NIL) method has been developed in place of the conventional exposure method in the manufacture of semiconductor devices having circuit patterns of 32 nm and 22 nm. ing. In this nanoimprint lithography system, as shown in FIG. 14, a quartz glass mold c processed with a circuit pattern b is opposed to a surface of a semiconductor wafer W coated with a photocurable resin a (hereinafter referred to as wafer W). {Refer to FIG. 14 (a)} Next, the mold c is pressed against the surface of the wafer W {refer to FIG. 14 (b)}. In this state, ultraviolet rays are irradiated from the ultraviolet irradiation means, for example, an ultrahigh pressure mercury lamp d through the mold c. The wafer W is irradiated {see FIG. 14C), then the mold c is separated from the wafer W {see FIG. 14D}, and the circuit pattern b is transferred to the surface of the wafer W.

  In the nanoimprint lithography system, the shape of the mold c and the faithful transfer of the mold shape are important for the definition of the circuit pattern.

  As a means for forming a circuit pattern on the mold, a photolithography method in a semiconductor manufacturing process, that is, a coating / exposure / development method, is adopted. A resist is applied to the substrate on which the mold is formed, exposed, and then the developer is added to the liquid. Then, development processing is performed to form a circuit pattern on the mold.

  In this case, in the development process, as a means for uniformly diffusing and dispersing the developing solution over the entire substrate, an ultrasonic oscillator that ultrasonically vibrates a diffusion member that diffuses the developing solution supplied (discharged) from the nozzle to the substrate is provided. Are known (for example, see Patent Document 1).

  As another method, a method of attaching an ultrasonic device to a rotating part of a chuck that holds a substrate is known (for example, see Patent Document 2).

Japanese Patent Laid-Open No. 8-22952 (Claims, paragraph 0043, FIG. 10) JP-A-9-139345 (Claims, FIG. 1)

  However, since all of the ones described in Patent Documents 1 and 2 diffuse or disperse the entire developer on the surface of the substrate by ultrasonic vibration, the ultrasonic vibration is evenly applied to unnecessary portions other than the circuit pattern. Thus, not only wasteful energy is consumed, but a long time is required for development processing, and there is a concern that the effect of removing scum remaining on the circuit pattern portion may be reduced. In addition, since the entire developing solution on the substrate surface is diffused or dispersed by ultrasonic vibration, there is a concern that the apparatus becomes large.

  In addition, since the line width of the circuit pattern formed on the mold is fine, it is necessary to reduce the impact on the substrate when supplying the developer (at the time of discharge) and to suppress damage to the circuit pattern. In organic development, a certain degree of impact is necessary.

  The present invention has been made in view of the above circumstances, and enables development with low impact, shortens development time and improves development accuracy, and removes scum remaining in the circuit pattern portion. It is an object of the present invention to provide an ultrasonic development processing method and apparatus capable of being improved.

  In order to solve the above-mentioned problem, the invention described in claim 1 is a development processing method in which a developing solution is brought into contact with the circuit pattern surface of the substrate subjected to the exposure processing, and the developing processing is performed. The surface of the ultrasonic transducer is brought into contact with the side surface of the substrate near the circuit pattern on the substrate, and the ultrasonic vibration generated by the ultrasonic transducer propagates to the developer on the circuit pattern through the substrate. The development processing is performed while the operation is being performed.

  According to a second aspect of the present invention, in the ultrasonic development processing method according to the first aspect, the development processing is repeated a plurality of times.

  Further, the invention described in claim 3 embodies the ultrasonic development processing method described in claim 1, and performs development processing by bringing a developer into contact with the circuit pattern surface of the exposed substrate. An apparatus comprising: an ultrasonic vibrator having an oscillation surface in contact with a side surface of a substrate in the vicinity of a circuit pattern of the substrate in contact with a developer; and a driving power source for the ultrasonic vibrator, Development processing is performed while ultrasonic vibration generated from the ultrasonic transducer propagates to the developer on the circuit pattern through the substrate. In this case, it is preferable to further include a contact / separation moving mechanism for moving the ultrasonic transducer in contact with and away from the side surface of the substrate and the holding means for holding the substrate.

  According to the first, third, and fourth aspects of the invention, in a state where the oscillation surface of the ultrasonic vibrator is in contact with the side surface of the substrate in the vicinity of the circuit pattern of the substrate in contact with the developer, The development process is performed while the ultrasonic vibration generated from the ultrasonic vibrator propagates to the developer on the circuit pattern through the substrate, thereby promoting the convection of the developer itself and developing the developer in the groove direction along the circuit pattern. Therefore, it is possible to increase the effect of removing the scum remaining in the circuit pattern by positively contacting the developer, and improve the accuracy of the developing process.

  According to the second aspect of the invention, in the ultrasonic development processing method according to the first aspect, the development process is repeated a plurality of times, so that a new developer is brought into contact with the circuit pattern, and thus further remains in the circuit pattern. The scum removal effect can be further enhanced.

  According to the present invention, since it is configured as described above, it is possible to perform development with low impact, shorten development time, improve development accuracy, and remain in the circuit pattern portion. The scum removal effect can be improved. Further, since the developer on the circuit pattern is positively brought into contact with the circuit pattern, the ultrasonic vibration can be effectively used for the developing process, so that labor can be saved and the apparatus can be miniaturized.

1 is a schematic sectional view showing a development processing apparatus according to a first embodiment of the present invention. It is a schematic plan view of the development processing apparatus. It is the top view (a) and side view (b) which show the use condition of the ultrasonic transducer | vibrator in 1st Embodiment. It is a schematic sectional drawing which shows the development processing apparatus of the modification of 1st Embodiment. FIG. 5 is a schematic plan view of FIG. 4. It is a schematic sectional drawing which shows another modification of 1st Embodiment. FIG. 7 is a schematic plan view of FIG. 6. It is a schematic sectional drawing which shows the image development processing apparatus of 2nd Embodiment concerning this invention. It is a schematic sectional drawing which shows the principal part of the development processing apparatus of 3rd Embodiment concerning this invention. FIG. 10 is a schematic plan view of FIG. 9. It is a schematic plan view which shows the principal part of the modification of 3rd Embodiment. FIG. 10 is a schematic cross-sectional view (a) showing a development processing state of the development processing apparatus according to the fourth embodiment, an enlarged I-sectional view (b) of (a), and a schematic cross-sectional view (c) showing a rinse processing state. Schematic plan view (a) showing an essential part of the development processing apparatus according to the fifth embodiment of the present invention, (a) an enlarged view of part II (b), and a sectional view taken along line III-III (b) (c) ). It is a schematic sectional drawing which shows the manufacturing process of a nanoimprint lithography system.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, the case where the ultrasonic development processing apparatus according to the present invention is applied to development of a glass substrate for a mask of a square mold will be described.

<First Embodiment>
FIG. 1 is a schematic sectional view showing a development processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a schematic plan view of the development processing apparatus.

  The development processing apparatus according to the present invention has a casing 1, a rotating base 2 that is a holding means for rotatably holding a square glass substrate G (hereinafter referred to as a substrate G) in the casing 1, and the rotation A liquid film of the developing solution L that is continuous with the surface of the substrate G is formed on the same plane of the surface of the substrate G that can be rotated together with the base 2 and surrounds the outer periphery of the substrate G held on the rotating base 2. And a developing solution supply nozzle 5 (hereinafter referred to as a belt) that can move along the surface of the substrate G held on the rotating base 2 and supply (discharge) the developer L to the substrate G in a strip shape. And an ultrasonic vibrator 7 that can move to a position opposite to the rectangular circuit pattern P formed on the substrate G and propagate ultrasonic vibrations to the developer L on the circuit pattern P. ing. In addition, a loading / unloading port 1b for the substrate G is provided on one side wall 1a of the casing 1, and the loading / unloading port 1b can be opened and closed by a shutter 1c.

  The rotating base 2 and the run-up stage 3 are formed so as to be accommodated in the cup 6. On the outer side of the cup 6, a cleaning liquid (rinse) is directed toward the substrate G held on the rotating base 2. Liquid) A rinse liquid supply means 8 for supplying pure water, for example, is provided.

  In this case, as shown in FIGS. 1 and 2, the rotary base 2 has a rectangular opening recess 4 that accommodates the substrate G with a gap 9, and is provided at each corner of the opening recess 4. Are provided with positioning holding pins 10 for holding the corners of the substrate G. The rotation base 2 is connected to a rotation drive unit such as a servo motor 12 via a rotation shaft 11 and can rotate at a predetermined rotation speed with the rotation shaft 11 as a central axis. The positioning of the circuit pattern P on the substrate G held by the rotary base 2 is performed by adjusting the servo motor 12.

  Further, as shown in FIG. 2, the run-up stage 3 has a substantially circular thin plate shape in which the positions of the corners of the substrate G are cut out as viewed from above, and a square that accommodates the substrate G in the center. A shaped opening recess 4 is formed. Thus, by forming the outer shape of the run-up stage 3 in a substantially circular shape, turbulence is prevented from being formed near the outer periphery of the run-up stage 3 when the run-up stage 3 is rotated. In this case, the run-up stage 3 is fixed on the same plane as the surface of the substrate G or at a slightly lower position, for example, a position 200 to 400 μm lower. Thereby, a continuous liquid film can be formed on the same plane extending from the surface of the substrate G to the surface of the run-up stage 3.

  Further, as shown in FIG. 1, the rotary base 2 is provided with through-holes 13 penetrating in the vertical direction at three locations at the bottom of the opening recess 4. A support pin 14 that supports and lifts the substrate G is inserted into the through-hole 13 so as to be lifted and lowered. The support pin 14 can be moved up and down by a lift drive mechanism 15 such as a cylinder, for example, and can protrude on the rotary base 2 to deliver the substrate G to the rotary base 2.

  Further, the rotary base 2 is accommodated in a cup 6 for receiving and collecting the liquid scattered or dropped from the substrate G. For example, the cup 6 is formed in a cylindrical shape having a closed lower surface and an opened upper surface so as to cover the sides and the lower side of the rotating base 2 and the substrate holding table 4. An exhaust port 6a and a drainage port 6b are provided at the bottom of the cup 6, and an exhaust pipe 16 provided with an exhaust device such as an exhaust pump (not shown) is connected to the exhaust port 6a. 6b is connected to, for example, a discharge pipe 17 that communicates with a drainage section of a factory, and the liquid collected in the cup 6 can be discharged to the outside of the development processing apparatus.

  As shown in FIG. 2, a first standby portion 61 is provided on the negative side of the cup 6 in the Y direction (left direction in FIG. 2). In the first standby section 61, the developing nozzle 5 that supplies the developer L can be on standby. The developing nozzle 5 has, for example, a slit-like nozzle hole (not shown) that is at least equal to or longer than the dimension of the side of the substrate G, and has a substantially rectangular parallelepiped shape along the X direction. The developing nozzle 5 is supported by an inverted L-shaped head arm 18, and is moved at least from the first standby unit 61 by a horizontal moving mechanism 19 including, for example, a ball screw and its rotation motor to which the head arm 18 is attached. The cup 6 is formed to be horizontally movable (scannable) to the vicinity of the end portion on the Y direction positive direction (right direction in FIG. 2) side. Further, the developing nozzle 5 is formed to be movable in the vertical direction by an elevating mechanism (not shown) such as a cylinder attached to the head arm 18, for example. The developing nozzle 5 is connected to a developing solution supply source (not shown) via a developing solution supply pipe, and the developing solution L supplied from the developing solution supply source while scanning on the substrate G is placed on the substrate. A liquid film can be formed by piling up in a strip shape.

  Further, as shown in FIGS. 1 and 2, a second standby portion 62 is provided on the Y direction positive direction side of the cup 6. In the second standby section 62, a rinse liquid discharge nozzle 8 (hereinafter referred to as a rinse nozzle 8) that is a rinse liquid supply means can wait. The rinse nozzle 8 is supported by, for example, a tip end of a nozzle arm 8c attached to the rotation shaft 8b of the rotation drive unit 8a, and the substrate G in the cup 6 from the second standby unit 62 is rotated by the rotation of the rotation shaft 8b. It can move to the upper center part. The rinsing nozzle 8 is connected to, for example, a rinsing liquid supply source (not shown) installed outside the development processing apparatus 1 via a rinsing liquid supply pipe, and the rinsing liquid supplied from the rinsing liquid supply source. (Pure water) is discharged downward to rinse the substrate G.

  On the other hand, as shown in FIG. 3, the ultrasonic vibrator 7 is close to the circuit pattern P of the substrate G in the state where the developer L is in contact, that is, the state where the developer L is accumulated on the surface of the substrate G. Thus, the oscillating surface 7a has a region that is the same as or slightly larger than the region of the circuit pattern P. The ultrasonic transducer 7 is connected to a high frequency drive power source 31 via an ultrasonic oscillator 30 (see FIG. 1). In this case, the frequency of the ultrasonic transducer 7 is set to 400 kHz to 3 MHz, for example.

  Further, as shown in FIGS. 1 and 2, the ultrasonic vibrator 7 is a turning / lifting arm 21 connected to a moving mechanism 20 having a horizontal turning and lifting function disposed on the outer side of the cup 6. Is supported by. Therefore, when the moving mechanism 20 is driven, the ultrasonic vibrator 7 waits at an outer position of the cup 6 that does not interfere with the developing nozzle 5 when the developing liquid 5 is deposited by the developing nozzle 5. Then, after rotating to above the circuit pattern P of the substrate G, it descends and comes close to the circuit pattern P of the substrate G and comes into contact with the developer L, and the supersonic wave generated from the oscillation surface 7a of the ultrasonic vibrator 7 The development process can be performed while the sonic vibration propagates to the developer L on the circuit pattern P.

  In the above embodiment, the ultrasonic vibrator 7 is moved to the outside standby position of the cup 6 by the moving mechanism 20, the upper position of the circuit pattern P of the substrate G held by the rotating base 2, and the close position on the circuit pattern P. However, the ultrasonic transducer 7 may be brought close to the circuit pattern P of the substrate G using another moving mechanism.

  For example, as shown in FIGS. 4 and 5, the ultrasonic vibrator 7 disposed above the circuit pattern P of the substrate G held by the rotating base 2 is moved to the up-and-down moving mechanism 20A such as a cylinder. It is supported by an inverted L-shaped lifting arm 21A to be connected, and when the developing nozzle 5 is scanned (at the time of liquid piling) by driving the lifting / lowering moving mechanism 20A, it waits at an upper position where it does not interfere with the developing nozzle 5, You may comprise so that it may descend | fall to the proximity position of the circuit pattern P of the board | substrate G after liquid accumulation. 4 and 5, the other parts are the same as those in the first embodiment, so the same parts are denoted by the same reference numerals and description thereof is omitted.

  In the above-described embodiment, the case where the circuit pattern P is formed at one central portion of the substrate G has been described. However, for example, as shown in FIGS. Even in the case where the circuit pattern P is formed at a location, the development process can be performed by arranging the ultrasonic transducer 7 so as to face each other in the vicinity of each circuit pattern P in the same manner as described above.

  In this case, each ultrasonic transducer 7 is suspended by a support plate 22 connected to the elevating arm 21A, and is connected to the ultrasonic oscillator 30 and the high-frequency drive power source 31 via the support plate 22 (FIG. 6). reference). Even in this case, each circuit pattern P and each ultrasonic transducer 7 can be positioned by adjusting the servo motor 12.

  In the above description, the case where the four ultrasonic transducers 7 suspended by the support plate 22 are opposed to the adjacent positions on each circuit pattern P by the lifting / lowering moving mechanism 20A has been described. It is also possible to move the four ultrasonic transducers 7 suspended by the support plate 22 by the moving mechanism 20 having the lifting function to the standby position outside the cup 6 and the proximity position on each circuit pattern P.

  Next, development processing of the development processing apparatus according to the first embodiment configured as described above will be described. First, when the substrate G transported by a transport arm (not shown) outside the development processing apparatus is loaded into the casing 1 via the loading / unloading port 1b, the substrate G is transferred to the support pins 14 that have been raised in advance. The support pin 14 is lowered and placed on the rotary base 2 and positioned by the positioning pin 10.

  Next, the developing nozzle 5 that has been waiting in the first standby section 61 moves to the run-up stage 3 on the Y direction negative direction side from the substrate G and is arranged on the run-up stage 3. Then, the developing nozzle 5 descends and comes close to the surface of the run-up stage 3 that is the start position, and moves to the positive direction side in the Y direction while supplying (discharging) the developer L in a strip shape, and the developer L on the substrate G surface. Pour up.

  After the developer L is deposited on the surface of the substrate G, the ultrasonic transducer 7 descends from above the circuit pattern P of the substrate G by driving the moving mechanism 20 (or the lifting / lowering moving mechanism 20A). It moves to a position close to the pattern P and comes into contact with the developer L. In this state, the high frequency driving power source 31 is driven, and the development process is performed while the ultrasonic vibration generated from the oscillation surface 7a of the ultrasonic vibrator 7 propagates to the developer L on the circuit pattern P. As a result, the developer molecules on the circuit pattern P can be diffused and dispersed throughout the circuit pattern P while oscillating, thereby preventing the occurrence of scum during the organic development process. In other words, the fluid of the developing solution itself is promoted, and the flow of the developing solution in the groove direction along the circuit pattern is promoted. Therefore, the effect of removing the scum remaining in the circuit pattern by positively contacting the developing solution (scum of the scum) The effect of suppressing deposition) can be enhanced.

  After the development processing is completed as described above, the ultrasonic transducer 7 is retracted from the proximity position of the circuit pattern P on the substrate G and retracted to the standby position above the substrate G or outside the cup 6.

  Subsequently, the rinse nozzle 8 that has been waiting in the second standby unit 62 moves to above the center of the substrate G, and the substrate G is rotated together with the running stage 3 by the rotation base 2. A rinse liquid is discharged onto the substrate G rotated from the rinse nozzle 8 to clean the substrate G.

  As described above, after the substrate G is cleaned for a predetermined time, the substrate G is rotated at a high speed by driving the servo motor 12 to dry the substrate G.

  When the substrate G is dried, the support pins 14 are raised again to lift the substrate G, and a transfer arm (not shown) that enters the casing 1 receives the substrate G and carries it out of the development processing apparatus.

  In the above description, the case where the development process is performed once has been described, but the development process may be repeated a plurality of times. By repeating the development process a plurality of times, the dissolved product generated by the previous development process can be removed, and then the developer L can be newly added to perform the development process, further improving the accuracy of the development process. Can be achieved.

Second Embodiment
FIG. 8 is a schematic sectional view showing an example of the development processing apparatus according to the second embodiment of the present invention.

  In the second embodiment, the substrate G is held by the transport chuck 25 that is a holding unit, the substrate G is immersed in the developer L in the developer tank 24, and the ultrasonic vibrator 7 provided on the transport chuck 25 is used. This is a case where development processing is performed while propagating the generated ultrasonic vibration to the developer L on the circuit pattern P of the substrate G.

  As shown in FIG. 8, the transport chuck 25 in the development processing apparatus according to the second embodiment includes a plurality of substantially L-shaped holding claws 27 that hang from the side end of the horizontal base 26, and The ultrasonic transducer 7A is provided at a portion facing the circuit pattern P of the substrate G on the lower surface (in this case, one is provided at the center of the substrate G). In this case, the ultrasonic transducer 7A has the oscillation surface 7a in the same or slightly larger area than the area of the circuit pattern P, as in the first embodiment. The ultrasonic vibrator 7 is connected to a high frequency drive power supply 31 via an ultrasonic oscillator 30.

  A drain port 28 is provided at the bottom of the developer tank 24, and a drain pipe 29 having an open / close valve V is connected to the drain port 28.

  According to the development processing apparatus of the second embodiment configured as described above, the transport chuck 25 receives the substrate G placed in a state of being positioned on a substrate holding table (not shown), and the inside of the developer tank 24 The high frequency driving power source 31 is driven in the state of being immersed in the developing solution L, and the ultrasonic vibration generated from the oscillation surface 7a of the ultrasonic vibrator 7 is propagated to the developing solution L on the circuit pattern P to perform the developing process. It can be carried out.

  In the above description, the case where there is one circuit pattern P has been described, but the circuit on the lower surface of the horizontal base portion 26 of the transport chuck 25 even when the circuit pattern P is formed at a plurality of places, for example, four places on the substrate G. By disposing the ultrasonic vibrator 7 at a portion facing the pattern P, the ultrasonic vibration generated from the oscillation surface 7a of each ultrasonic vibrator 7 is developed while propagating to the developer L on each circuit pattern P. Processing can be performed.

<Third Embodiment>
FIG. 9 is a schematic cross-sectional view showing the main part of the development processing apparatus according to the third embodiment of the present invention, and FIG. 10 is a schematic plan view of FIG.

  In the third embodiment, the oscillation surface 7b of the ultrasonic transducer 7B is brought into contact with the side surface of the substrate G in the vicinity of the circuit pattern P of the substrate G in contact with the developer L, and the ultrasonic transducer 7B This is a case where the generated ultrasonic vibration propagates to the developer L on the circuit pattern P through the substrate G to perform development processing.

  For example, when one circuit pattern P is formed in the center of the substrate G, the side surfaces Ga on the four sides of the substrate G held on the rotating base 2 face each other as shown in FIGS. The oscillation surface 7b of the ultrasonic vibrator 7B is brought into contact with the center portion, and the ultrasonic vibration generated from the ultrasonic vibrator 7B propagates to the developing solution L on the circuit pattern P through the substrate G to perform development processing. Do.

  In this case, each ultrasonic transducer 7B is formed in a rod shape having an oscillation surface 7b at the tip, and is movably fitted in a through hole 2b provided in the side wall 2a of the rotary base 2. The tip oscillation surface 7b is formed so as to be able to move toward and away from the side surface Ga of the substrate G by a contact and separation mechanism 40 such as a cylinder connected to the end. That is, during the development process in which the developer L is accumulated on the surface of the substrate, the oscillation surface 7b contacts the side surface Ga of the substrate G by the extension operation of the contact / separation moving mechanism 40, and in this state, the high-frequency drive power source 31 is driven. Thus, development processing is performed while ultrasonic vibration generated from the oscillation surface 7a of the ultrasonic transducer 7B propagates through the substrate G to the developer L on the circuit pattern P. Further, at the time of the rinsing process, the oscillation surface 7b is moved away from the side surface Ga of the substrate G by the contraction operation of the contact / separation moving mechanism 40 and retracted to the outer side of the rotating base 2 to Rotation is possible.

  In the third embodiment, the oscillation surface 7b of the ultrasonic transducer 7B is preferably in contact with a position as close as possible to the circuit pattern P, and preferably in contact with the upper side surface Ga of the substrate G.

  In the third embodiment, the other parts are the same as those in the first embodiment. Therefore, the same parts are denoted by the same reference numerals and description thereof is omitted.

  In the above description, the case where one circuit pattern P is formed at the center of the substrate G has been described. However, when the circuit pattern P is formed at a plurality of locations on the substrate G, for example, four locations on concentric circles, FIG. 11, the oscillation surface 7b of the ultrasonic transducer 7B is brought into contact with positions near the two outer sides of each circuit pattern P on the side surface Ga of the substrate G.

  With this configuration, during the development process in which the developer L is accumulated on the surface of the substrate, the oscillation surface 7b is brought into contact with the side surface Ga of the substrate G by the extension operation of the contact / separation moving mechanism 40. The drive power supply 31 is driven, and the development process can be performed while the ultrasonic vibration generated from the oscillation surface 7a of each ultrasonic vibrator 7B propagates through the substrate G to the developer L on each circuit pattern P. .

  Also in the third embodiment, by repeatedly performing the developing process, the new developer L can be brought into contact with the circuit pattern P, so that the effect of removing scum remaining on the circuit pattern P can be further enhanced. it can.

<Fourth embodiment>
FIG. 12 is a schematic cross-sectional view (a) showing the development processing state of the development processing apparatus according to the fourth embodiment, an enlarged sectional view (b) of I part of (a), and a schematic cross-sectional view (c) showing the rinsing processing state. is there.

  In the fourth embodiment, an ultrasonic vibrator 7C is disposed at a position near the circuit pattern P of the substrate G in the rotating base 2 that holds the substrate G in contact with the developer L, and the ultrasonic vibrator In this case, 7C is brought into contact with the lower surface Gb of the substrate G, and the development process is performed while the ultrasonic vibration generated from the ultrasonic vibrator 7C propagates to the developer L on the circuit pattern P through the substrate G.

  In this case, the ultrasonic transducer 7C is disposed on the lower surface Gb of the bottom of the rotary base 2 close to the circuit pattern P of the substrate G, and a plurality of needles protruding from the upper surface of the ultrasonic transducer 7C. Each piece 7c penetrates through a plurality of through-holes 2c provided at the bottom of the rotary base 2 and is in contact (contact) with the lower surface of the substrate G (see FIG. 12B).

  With this configuration, during the development process in which the developer L is deposited on the surface of the substrate, the high frequency driving power source 31 is driven, and the ultrasonic vibration generated from the needle-like piece 7c of the ultrasonic transducer 7C is generated. Development processing can be performed while propagating through G to the developer L on the circuit pattern P.

  In the fourth embodiment, after the development processing is performed as described above, the rinse nozzle 8 is moved above the central portion of the substrate G as shown in FIG. On the other hand, a rinsing process is performed while supplying (discharging) pure water (DIW) as a rinsing liquid from the rinsing nozzle 8. Also in this case, the high frequency driving power source 31 is driven, and the ultrasonic vibration generated from the needle-like piece 7c of the ultrasonic vibrator 7C is transmitted through the substrate G to the pure water (DIW) on the circuit pattern P. A rinsing process can be performed. Thereby, the removal effect of the scum remaining on the circuit pattern can be further enhanced.

  In the fourth embodiment, the other parts are the same as those in the first embodiment, and therefore the same parts are denoted by the same reference numerals and description thereof is omitted.

  Also in the fourth embodiment, when the circuit patterns P are formed at a plurality of locations on the substrate G, for example, at four locations on the concentric circles, the bottom surface of the rotary base 2 adjacent to each circuit pattern P is similarly applied to the bottom surface. An ultrasonic transducer 7C may be provided.

  Also in the fourth embodiment, by repeatedly performing the developing process, the new developer L can be brought into contact with the circuit pattern P, so that the effect of removing scum remaining on the circuit pattern P can be further enhanced. it can.

<Fifth Embodiment>
FIG. 13: is a schematic plan view (a) which shows the principal part of the developing processing apparatus of 5th Embodiment based on this invention, the II section enlarged view of (a), and the III-III line of (b). It is sectional drawing (c).

  In the fifth embodiment, a positioning pin, which is a substrate holding member provided on the rotary base 2 that holds the substrate G in contact with the developer L, is formed by the ultrasonic vibrator 7D, and the ultrasonic vibrator This is a case where the ultrasonic vibration generated from 7D propagates through the substrate G to the developer L on the circuit pattern P (in this case, formed at four locations on the concentric circles of the substrate) to perform development processing. .

  In this case, the ultrasonic transducer 7D also serving as a positioning pin is disposed at a position as close as possible to the outer side of the circuit pattern P from the corner of the opening recess 4 of the rotation base 2, and each ultrasonic vibration The child 7D is connected to a high-frequency drive power source 31 via an ultrasonic oscillator 30.

  In the fifth embodiment, the other parts are the same as those in the first embodiment, and therefore the same parts are denoted by the same reference numerals and description thereof is omitted.

  When developing the substrate G using the development processing apparatus of the fifth embodiment, as in the first embodiment, the developer G is moved while being supplied (discharged) in a strip shape from the developing nozzle 5 and moved to the surface of the substrate G. After the developer L is deposited, the high-frequency drive power source 31 is driven, and the ultrasonic vibration generated from the ultrasonic vibrator 7D propagates through the substrate G to the developer L on the circuit pattern P while developing. Processing can be performed.

  Also in the fifth embodiment, after the development processing is performed as described above, the rinse nozzle 8 is moved above the central portion of the substrate G, and the rinse liquid is supplied from the rinse nozzle 8 to the rotating substrate G. Rinsing is performed while supplying (discharging) pure water (DIW). Also in this case, the high frequency drive power supply 31 is driven, and the rinsing process is performed while the ultrasonic vibration generated from the ultrasonic vibrator 7D propagates through the substrate G to the pure water (DIW) on the circuit pattern P. Can do.

  Also in the fifth embodiment, by repeatedly performing the developing process, the new developer L can be brought into contact with the circuit pattern P, so that the effect of removing scum remaining on the circuit pattern P can be further enhanced. it can.

  In the above description, the case where the circuit pattern P is formed at four locations on the concentric circles of the substrate G has been described, but the case where one circuit pattern P is formed at the center of the substrate G is also the fifth embodiment. A form of development can be applied.

G substrate Ga substrate side surface Gb substrate lower surface 2 Rotating base (holding means)
5 Development nozzle (Developer supply nozzle)
7, 7A, 7B, 7C Ultrasonic vibrator 7D Ultrasonic vibrator serving as positioning pin 7a, 7b Oscillating surface 7c Needle piece 8 Rinsing nozzle (rinsing liquid supply means)
12 Servo motor (rotary drive)
DESCRIPTION OF SYMBOLS 20 Moving mechanism 20A Elevating / moving mechanism 21 Rotating / elevating arm 21A Elevating arm 24 Developer tank 25 Conveying chuck (holding means)
30 Ultrasonic oscillator 31 High frequency drive power supply 40 Contact / separation moving mechanism

Claims (4)

A development processing method in which a developer is brought into contact with a circuit pattern surface of a substrate subjected to exposure processing to perform development processing,
The oscillation surface of the ultrasonic transducer is brought into contact with the side surface of the substrate in the vicinity of the circuit pattern of the substrate in contact with the developer, and the ultrasonic vibration generated by the ultrasonic transducer is passed through the substrate through the circuit pattern. An ultrasonic development processing method, wherein development processing is performed while propagating to the developer above. The ultrasonic development processing method according to claim 1,
An ultrasonic development method, wherein the development treatment is repeated a plurality of times. A development processing apparatus that performs a development process by bringing a developer into contact with a circuit pattern surface of an exposed substrate,
An ultrasonic transducer in which an oscillation surface is in contact with the side surface of the substrate in the vicinity of the circuit pattern of the substrate in contact with the developer, and a driving power source for the ultrasonic transducer,
An ultrasonic development processing apparatus, wherein development processing is performed while ultrasonic vibration generated from the ultrasonic transducer propagates to a developer on a circuit pattern through the substrate. In the ultrasonic development processing device according to claim 3,
An ultrasonic development processing apparatus, further comprising a contact / separation moving mechanism for moving the ultrasonic transducer toward and away from a side surface of the substrate and a holding means for holding the substrate.

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