JP2013115207A - Substrate cleaning device and substrate cleaning method - Google Patents

Substrate cleaning device and substrate cleaning method Download PDF

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JP2013115207A
JP2013115207A JP2011259432A JP2011259432A JP2013115207A JP 2013115207 A JP2013115207 A JP 2013115207A JP 2011259432 A JP2011259432 A JP 2011259432A JP 2011259432 A JP2011259432 A JP 2011259432A JP 2013115207 A JP2013115207 A JP 2013115207A
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cleaning
substrate
unit
back surface
brush
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JP5637974B2 (en
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Masahiro Fukuda
昌弘 福田
Akihiro Kubo
明広 久保
Akihiro Fujimoto
昭浩 藤本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cleaning device and a substrate cleaning method for cleaning the back surface of a substrate, which can also clean cleaning means for cleaning the back surface of a substrate and substrate holding means for holding a substrate.SOLUTION: The substrate cleaning device for cleaning the back surface of a substrate includes first substrate holding means for holding a substrate by coming into contact with a first region of the back surface, second substrate holding means for holding the substrate by coming into contact with a second region of the back surface other than the first region, first cleaning means for cleaning the back surface of a substrate held by the first substrate holding means or the second substrate holding means, and second cleaning means for cleaning the contact surface of the second substrate holding means coming into contact with the substrate.

Description

本発明は、半導体ウエハ、フラットディスプレイ用のガラス基板（ＦＰＤ基板）、液晶ディスプレイ用のガラス基板（ＬＣＤ基板）及びその他の基板を洗浄する基板洗浄装置及び基板洗浄方法に関する。   The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a semiconductor wafer, a glass substrate for flat display (FPD substrate), a glass substrate for liquid crystal display (LCD substrate), and other substrates.

半導体ウエハ等の基板を製造する工程（基板製造工程）においては、基板の表面を清浄な状態に保つことが必要である。このため、基板製造工程に含まれる製造プロセス及び処理プロセスに、基板の表面を洗浄するプロセスを含む場合がある。   In a process of manufacturing a substrate such as a semiconductor wafer (substrate manufacturing process), it is necessary to keep the surface of the substrate in a clean state. For this reason, the manufacturing process and the processing process included in the substrate manufacturing process may include a process of cleaning the surface of the substrate.

また、基板製造工程において、基板処理の微細化のために液浸露光やダブルパターニングなどの処理を行なう場合には、基板の表面だけでなく裏面にも汚染物（パーティクルなど）が付着することがあった。このため、基板製造工程においては、基板の裏面も洗浄する必要がある。   Also, in the substrate manufacturing process, when processing such as immersion exposure or double patterning is performed in order to make the substrate processing finer, contaminants (particles, etc.) may adhere not only to the surface of the substrate but also to the back surface. there were. For this reason, it is necessary to clean the back surface of the substrate in the substrate manufacturing process.

特許文献１は、基板の裏面を保持する２つの基板保持手段（吸着パッド、スピンチャック）により、基板を保持する位置が重ならないようにしながら、２つの基板保持手段の間で基板を持ち替えることにより、基板の裏面の全域を洗浄することができる技術を開示している。   In Patent Document 1, two substrates holding means (suction pad, spin chuck) for holding the back surface of a substrate are used so that the positions where the substrates are held are not overlapped, and the substrate is changed between the two substrate holding means. Discloses a technique capable of cleaning the entire back surface of the substrate.

特許文献２は、基板を洗浄する洗浄手段（洗浄部材）を洗浄する洗浄バス部（ブラシ洗浄体）と、洗浄手段を基板と洗浄バス部との間で移動することができる移動手段とにより、一定期間基板を洗浄したことによって汚染された洗浄手段を洗浄することができる技術を開示している。   Patent Document 2 discloses a cleaning bath unit (brush cleaning body) that cleans a cleaning unit (cleaning member) that cleans a substrate, and a moving unit that can move the cleaning unit between the substrate and the cleaning bath unit. A technique capable of cleaning a cleaning means contaminated by cleaning a substrate for a certain period of time is disclosed.

特開２００８−１７７５４１号公報JP 2008-177541 A 特開２００９−２２４３８３号公報JP 2009-224383 A

基板を保持する基板保持手段及び基板を洗浄する洗浄手段は、一定期間使用すると、基板に付着していた汚染物により汚染される。このため、基板洗浄装置は、基板保持手段等を洗浄する必要がある。   The substrate holding means for holding the substrate and the cleaning means for cleaning the substrate are contaminated by contaminants attached to the substrate when used for a certain period of time. For this reason, the substrate cleaning apparatus needs to clean the substrate holding means and the like.

特許文献１に開示されている技術では、ダミーウエハ（基板保持手段及び洗浄手段を洗浄するための洗浄用基板）を用いて、基板を洗浄する動作と同様の動作をすることにより、基板保持手段等を洗浄することができる。しかし、基板保持手段等を洗浄するために基板製造工程を一時中断することになり、基板製造工程の生産性が低下する場合があった。また、基板を洗浄する動作を実施して、ダミーウエハにより基板保持手段等を洗浄するため、短時間で効率的に基板保持手段等を洗浄することができない場合があった。   In the technique disclosed in Patent Document 1, a substrate holding unit or the like is obtained by performing an operation similar to the operation of cleaning a substrate using a dummy wafer (a cleaning substrate for cleaning the substrate holding unit and the cleaning unit). Can be washed. However, the substrate manufacturing process is temporarily interrupted to clean the substrate holding means and the like, and the productivity of the substrate manufacturing process may be reduced. In addition, since the operation of cleaning the substrate is performed and the substrate holding means and the like are cleaned by the dummy wafer, the substrate holding means and the like cannot be efficiently cleaned in a short time.

特許文献２に開示されている技術では、洗浄手段を洗浄バス部に移動することによって洗浄手段を洗浄することはできるが、基板保持手段を洗浄するができない。   In the technique disclosed in Patent Document 2, the cleaning unit can be cleaned by moving the cleaning unit to the cleaning bath, but the substrate holding unit cannot be cleaned.

本発明は、このような事情の下に為され、基板の裏面を洗浄する基板洗浄装置及び基板洗浄方法であって、基板を保持する基板保持手段を洗浄することができる基板洗浄装置及び基板洗浄方法を提供することを課題とする。   The present invention has been made under such circumstances, and is a substrate cleaning apparatus and a substrate cleaning method for cleaning the back surface of a substrate, which can clean a substrate holding means for holding a substrate. It is an object to provide a method.

本発明の一の態様によれば、基板の裏面を洗浄する基板洗浄装置であって、前記裏面の第１の領域に接触して、前記基板を保持する第１の基板保持手段と、前記第１の領域以外の前記裏面の第２の領域に接触して、前記基板を保持する第２の基板保持手段と、前記第１の基板保持手段又は前記第２の基板保持手段により保持された基板の裏面を洗浄する第１の洗浄手段と、前記基板と接触する前記第２の基板保持手段の接触面を洗浄する第２の洗浄手段とを有することを特徴とする基板洗浄装置が提供される。また、前記第１の洗浄手段と前記第２の洗浄手段とは、一つの洗浄支持部材に固定され、前記洗浄支持部材は、前記裏面に対向する該洗浄支持部材の一方の表面に前記第１の洗浄手段を搭載し、前記一方の表面の反対側の他方の表面に前記第２の洗浄手段を搭載している、ことを特徴とする、基板洗浄装置が提供される。   According to one aspect of the present invention, there is provided a substrate cleaning apparatus for cleaning a back surface of a substrate, wherein the first substrate holding means that holds the substrate in contact with the first region of the back surface; A second substrate holding means for holding the substrate in contact with the second area on the back surface other than the first area, and a substrate held by the first substrate holding means or the second substrate holding means. There is provided a substrate cleaning apparatus comprising: a first cleaning unit that cleans the back surface of the substrate; and a second cleaning unit that cleans a contact surface of the second substrate holding unit that contacts the substrate. . The first cleaning means and the second cleaning means are fixed to a single cleaning support member, and the cleaning support member is disposed on one surface of the cleaning support member facing the back surface. A substrate cleaning apparatus is provided, characterized in that the second cleaning means is mounted on the other surface opposite to the one surface.

本発明の他の態様によれば、前記第１の洗浄手段又は前記第２の洗浄手段に押圧され、前記第１の洗浄手段又は前記第２の洗浄手段と相対的に回転され得る、前記第１の洗浄手段及び前記第２の洗浄手段を洗浄する洗浄バス部を更に有することを特徴とする、基板洗浄装置が提供される。また、前記洗浄バス部は、前記第１の洗浄手段を洗浄する第１の洗浄バスと、前記第２の洗浄手段を洗浄する第２の洗浄バスとを含むことを特徴とする、基板洗浄装置が提供される。更に、前記第１の洗浄手段及び前記第２の洗浄手段を移動する移動手段を有し、前記移動手段は、前記第１の洗浄手段を前記基板の裏面に接触する該基板の下方に移動し、及び、前記第２の洗浄手段を前記第２の基板保持手段に接触する該第２の基板保持手段の上方に移動し、並びに、前記第１の洗浄手段を前記第１の洗浄バスに接触する位置に移動し、及び、前記第２の洗浄手段を前記第２の洗浄バスに接触する位置に移動する、ことを特徴とする、基板洗浄装置が提供される。   According to another aspect of the present invention, the first cleaning means or the second cleaning means may be pressed and rotated relative to the first cleaning means or the second cleaning means. A substrate cleaning apparatus is provided, further comprising a cleaning bath section for cleaning the first cleaning means and the second cleaning means. The substrate cleaning apparatus, wherein the cleaning bath section includes a first cleaning bath for cleaning the first cleaning means and a second cleaning bath for cleaning the second cleaning means. Is provided. Furthermore, it has moving means for moving the first cleaning means and the second cleaning means, and the moving means moves the first cleaning means below the substrate contacting the back surface of the substrate. And the second cleaning means is moved above the second substrate holding means in contact with the second substrate holding means, and the first cleaning means is brought into contact with the first cleaning bath. The substrate cleaning apparatus is provided, wherein the substrate cleaning apparatus is moved to a position where the second cleaning means is brought into contact with the second cleaning bath.

本発明のその他の態様によれば、第２の基板保持手段を基板の裏面の第２の領域に接触させて、前記第２の基板保持手段により前記基板を略水平に保持する第１の基板保持工程と、第１の領域を含む裏面の一部を洗浄する第１の基板洗浄工程と、第１の基板保持手段を前記第１の領域に接触させて、前記第１の基板保持手段により前記基板を保持する第２の基板保持工程と、前記第２の領域を含む裏面の一部を洗浄する第２の基板洗浄工程と、前記裏面と接触する前記第２の基板保持手段の接触面を洗浄する基板保持手段洗浄工程とを有することを特徴とする基板洗浄方法が提供される。また、前記第１の基板洗浄工程及び前記第２の基板洗浄工程は、第１の洗浄手段で前記裏面を洗浄し、前記基板保持手段洗浄工程は、第２の洗浄手段で前記接触面を洗浄する、ことを特徴とする基板洗浄方法が提供される。   According to another aspect of the present invention, the first substrate holding the substrate substantially horizontally by the second substrate holding means with the second substrate holding means in contact with the second region on the back surface of the substrate. A holding step, a first substrate cleaning step for cleaning a part of the back surface including the first region, and a first substrate holding unit in contact with the first region; A second substrate holding step for holding the substrate; a second substrate cleaning step for cleaning a part of the back surface including the second region; and a contact surface of the second substrate holding means in contact with the back surface. And a substrate holding means cleaning step for cleaning the substrate. In the first substrate cleaning step and the second substrate cleaning step, the back surface is cleaned by a first cleaning unit, and in the substrate holding unit cleaning step, the contact surface is cleaned by a second cleaning unit. A substrate cleaning method is provided.

本発明によれば、基板の裏面を洗浄する基板洗浄装置であって、基板を保持する基板保持手段を洗浄することができる。   According to the present invention, it is a substrate cleaning apparatus for cleaning the back surface of a substrate, and it is possible to clean a substrate holding means that holds the substrate.

本発明の実施形態に係る基板洗浄装置の概略斜視図である。1 is a schematic perspective view of a substrate cleaning apparatus according to an embodiment of the present invention. 本実施形態に係るブラシ部を説明する拡大図である。It is an enlarged view explaining the brush part which concerns on this embodiment. 本実施形態に係る洗浄バス部を説明する拡大図である。It is an enlarged view explaining the washing | cleaning bath part which concerns on this embodiment. 本実施形態に係る基板洗浄装置において、第２の基板保持手段（吸着パッド）を洗浄するときの洗浄部の配置を説明する説明図である。It is explanatory drawing explaining arrangement | positioning of the washing | cleaning part when wash | cleaning a 2nd board | substrate holding means (suction pad) in the board | substrate cleaning apparatus which concerns on this embodiment. 本実施形態に係る基板洗浄装置において、基板の裏面及びブラシ部を洗浄するときの洗浄部の配置を説明する説明図である。It is explanatory drawing explaining arrangement | positioning of the washing | cleaning part when wash | cleaning the back surface and brush part of a board | substrate in the board | substrate cleaning apparatus which concerns on this embodiment. 本実施形態に係る基板洗浄装置において、基板の裏面、第２の基板保持手段（吸着パッド）及びブラシ部を洗浄する動作を説明する説明図である。It is explanatory drawing explaining operation | movement which wash | cleans the back surface of a board | substrate, a 2nd board | substrate holding means (suction pad), and a brush part in the board | substrate cleaning apparatus which concerns on this embodiment. 本実施形態に係る基板洗浄装置において、ブラシ部の例を説明する説明図である。It is explanatory drawing explaining the example of a brush part in the board | substrate cleaning apparatus which concerns on this embodiment. 本実施形態に係る基板洗浄装置において、洗浄液供給系の一例を説明する説明図である。It is explanatory drawing explaining an example of the washing | cleaning liquid supply system in the board | substrate cleaning apparatus which concerns on this embodiment. 本実施形態に係る基板洗浄装置において、ブラシ部のその他の例を説明する説明図である。In the substrate cleaning apparatus according to the present embodiment, it is an explanatory view for explaining another example of the brush portion.

添付の図面を参照しながら、本発明の限定的でない例示の実施形態について説明する。添付の全図面の中の記載で、同一又は対応する部材又は部品には、同一又は対応する参照符号を付し、重複する説明を省略する。また、図面は部材もしくは部品間の相対比を示すことを目的としていない。したがって、図面の中の具体的な寸法は、以下の限定的でない実施形態に照らし、当業者により決定することができる。   Non-limiting exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In the description of all the attached drawings, the same or corresponding members or parts are denoted by the same or corresponding reference numerals, and redundant description is omitted. Also, the drawings are not intended to show the relative ratio between members or parts. Accordingly, specific dimensions in the drawings can be determined by one skilled in the art in light of the following non-limiting embodiments.

（基板洗浄装置の構成）
本発明の実施形態に係る基板洗浄装置の構成を、図１〜図５を用いて説明する。 (Configuration of substrate cleaning equipment)
A configuration of a substrate cleaning apparatus according to an embodiment of the present invention will be described with reference to FIGS.

図１は、本発明の実施形態に係る基板洗浄装置１００の概略斜視図を示す。   FIG. 1 is a schematic perspective view of a substrate cleaning apparatus 100 according to an embodiment of the present invention.

図１に示すように、本発明の実施形態に係る基板洗浄装置１００は、基板Ｗを保持して、基板Ｗの裏面を洗浄する装置である。基板洗浄装置１００は、本実施形態では、基板Ｗを水平に保持する基板保持部１０と、基板保持部１０に保持された基板Ｗを洗浄する洗浄部２０と、基板洗浄装置１００の各構成をその内部に納めることができる筐体部３０と、保持している基板Ｗ及び洗浄部２０を移動することができる駆動部４０とを有する。   As shown in FIG. 1, a substrate cleaning apparatus 100 according to an embodiment of the present invention is an apparatus that holds a substrate W and cleans the back surface of the substrate W. In this embodiment, the substrate cleaning apparatus 100 includes the substrate holding unit 10 that horizontally holds the substrate W, the cleaning unit 20 that cleans the substrate W held on the substrate holding unit 10, and the substrate cleaning apparatus 100. It has the housing | casing part 30 which can be accommodated in the inside, and the drive part 40 which can move the board | substrate W and the washing | cleaning part 20 which are hold | maintained.

ここで、洗浄する基板Ｗは、例えばシリコンからなる半導体ウエハ、フラットパネルディスプレイ用ガラス基板（ＦＰＤ基板）若しくは液晶ディスプレイ用ガラス基板（ＬＣＤ基板）又はその他の基板であってもよい。   Here, the substrate W to be cleaned may be, for example, a semiconductor wafer made of silicon, a glass substrate for flat panel display (FPD substrate), a glass substrate for liquid crystal display (LCD substrate), or another substrate.

基板保持部１０は、基板Ｗの裏面の一部に接触することにより基板Ｗを保持する。基板保持部１０は、本実施形態では、第１の基板保持手段として基板Ｗの裏面の第１の領域に接触して基板Ｗを保持するスピンチャック１１と、第２の基板保持手段として基板Ｗの裏面の第２の領域に接触して基板Ｗを保持する吸着パッド１２と、基板Ｗの裏面を３本のピンで支持する支持ピン１３とを有する。基板保持部１０は、スピンチャック１１、吸着パッド１２及び／又は支持ピン１３により、基板Ｗを保持することができる。ここで、第１の領域と第２の領域とは、基板Ｗの裏面において、夫々重複しない領域である。また、以後の説明において、第１の領域とは円形形状の基板Ｗの裏面の中心部とする。第２の領域とは円形形状の基板Ｗの裏面の外周部の一部とする。   The substrate holding unit 10 holds the substrate W by contacting a part of the back surface of the substrate W. In the present embodiment, the substrate holding unit 10 contacts the first region on the back surface of the substrate W as a first substrate holding unit and holds the substrate W, and the substrate W as a second substrate holding unit. The suction pad 12 that holds the substrate W in contact with the second region on the back surface of the substrate W and the support pin 13 that supports the back surface of the substrate W with three pins. The substrate holding unit 10 can hold the substrate W by the spin chuck 11, the suction pad 12 and / or the support pins 13. Here, the first region and the second region are regions that do not overlap each other on the back surface of the substrate W. In the following description, the first area is the center of the back surface of the circular substrate W. The second region is a part of the outer peripheral portion of the back surface of the circular substrate W.

スピンチャック１１は、第１の領域を下方から支持する略円柱形状の吸着手段（チャック）である。基板Ｗの裏面と接するスピンチャック１１の円形端面は、吸引管（不図示）に接続された吸着孔１１ａにより、基板Ｗの裏面を吸着しながら固定する保持機能（真空チャック機能）を備える。スピンチャック１１は、本実施形態では、後述する吸着パッド１２の２つの吸着部１２ｐの中間に設置されている。すなわち、スピンチャック１１及び吸着パッド１２は、基板Ｗの裏面の各々異なる領域（第１の領域及び第２の領域）を吸着して、基板Ｗを保持することができる。   The spin chuck 11 is a substantially cylindrical suction means (chuck) that supports the first region from below. The circular end surface of the spin chuck 11 in contact with the back surface of the substrate W has a holding function (vacuum chuck function) for fixing the back surface of the substrate W while adsorbing it by an adsorption hole 11a connected to a suction tube (not shown). In this embodiment, the spin chuck 11 is installed in the middle of two suction portions 12p of a suction pad 12 described later. That is, the spin chuck 11 and the suction pad 12 can hold different substrates (first region and second region) on the back surface of the substrate W to hold the substrate W.

また、スピンチャック１１は、基板Ｗを回転可能及び昇降可能に保持する。具体的には、スピンチャック１１は、後述する駆動部４０の回転機構（スピンチャックモータ）４４Ｍの駆動により、吸着孔１１ａの吸引力によってスピンチャック１１に保持（固定）した基板Ｗを第１の領域を回転中心に回転することができる。また、スピンチャック１１は、図示しない昇降機構により、スピンチャック１１に保持された基板Ｗを鉛直方向に移動（昇降）させることができる。   Further, the spin chuck 11 holds the substrate W so as to be rotatable and movable up and down. Specifically, the spin chuck 11 drives the rotation mechanism (spin chuck motor) 44M of the driving unit 40, which will be described later, to hold the substrate W held (fixed) on the spin chuck 11 by the suction force of the suction hole 11a. The region can be rotated around the center of rotation. Further, the spin chuck 11 can move (lift) the substrate W held by the spin chuck 11 in the vertical direction by an elevator mechanism (not shown).

吸着パッド１２は、第２の領域を下方から支持する吸着手段（チャック）である。吸着パッド１２は、本実施形態では、２つの吸着部１２ｐを有する。２つの吸着部１２ｐは、略矩形形状の吸着面（基板Ｗを載置できる表面）を有する。また、２つの吸着部１２ｐは、その吸着面に形成された吸着孔１２ａにより、基板Ｗの裏面を吸着しながら固定する保持機能（真空チャック機能）を備える。これにより、２つの吸着部１２ｐは、基板Ｗの裏面の外周部の対向する二箇所（第２の領域）において、基板Ｗの外縁形状と略平行に接触することにより、基板Ｗを載置することができる。このとき、２つの吸着パッド１２ｐは、吸着孔１２ａの吸引力により、基板Ｗの裏面の外周部を吸着して、基板Ｗを保持することができる。   The suction pad 12 is a suction means (chuck) that supports the second region from below. In this embodiment, the suction pad 12 has two suction portions 12p. The two suction portions 12p have a substantially rectangular suction surface (surface on which the substrate W can be placed). In addition, the two suction portions 12p have a holding function (vacuum chuck function) for fixing the back surface of the substrate W while sucking the suction holes 12a formed on the suction surfaces. Thereby, the two adsorption | suction part 12p mounts the board | substrate W by making contact with the outer edge shape of the board | substrate W in two places (2nd area | region) which the outer peripheral part of the back surface of the board | substrate W opposes. be able to. At this time, the two suction pads 12p can hold the substrate W by sucking the outer peripheral portion of the back surface of the substrate W by the suction force of the suction holes 12a.

支持ピン１３は、３本の支持ピンで基板Ｗを支持するものである。３本の支持ピンは、スピンチャック１１の周囲に配置（立設）されている。支持ピン１３は、本実施形態では、図示しない昇降機構により、３本の支持ピンで略水平に支持した基板Ｗを鉛直方向に移動（昇降）させることができる。これにより、支持ピン１３は、外部の搬送手段（不図示）との協働作用によって、その搬送手段と吸着パッド１２との間で基板Ｗを受け渡しすることができる。   The support pins 13 support the substrate W with three support pins. The three support pins are arranged (standing) around the spin chuck 11. In the present embodiment, the support pins 13 can move (elevate) the substrate W, which is supported substantially horizontally by the three support pins, by an elevating mechanism (not shown). Thereby, the support pin 13 can deliver the substrate W between the conveyance means and the suction pad 12 by a cooperative action with an external conveyance means (not shown).

洗浄部２０は、基板保持部１０に保持された基板Ｗを洗浄する。洗浄部２０は、本実施形態では、基板Ｗの裏面及び吸着パッド１２の吸着面を洗浄するブラシ部２１と、ブラシ部２１を洗浄する洗浄バス部２２とを有する。洗浄部２０は、ブラシ部２１（後述する図２の上部ブラシ部材２１ｕｐ）を基板Ｗの裏面に接触させ、その裏面を洗浄することができる。また、洗浄部２０は、ブラシ部２１（後述する図２の下部ブラシ部材２１ｄｗ）を吸着パッド１２に接触させ、吸着パッド１２を洗浄することができる。更に、洗浄部２０は、ブラシ部２１を後述する洗浄バス部２２（図３参照）に収容し、ブラシ部２１（上部ブラシ部材２１ｕｐ及び下部ブラシ部材２１ｄｗ）を洗浄することができる。   The cleaning unit 20 cleans the substrate W held on the substrate holding unit 10. In the present embodiment, the cleaning unit 20 includes a brush unit 21 that cleans the back surface of the substrate W and the suction surface of the suction pad 12, and a cleaning bath unit 22 that cleans the brush unit 21. The cleaning unit 20 can bring the brush unit 21 (upper brush member 21up of FIG. 2 described later) into contact with the back surface of the substrate W and clean the back surface. In addition, the cleaning unit 20 can clean the suction pad 12 by bringing the brush unit 21 (lower brush member 21dw of FIG. 2 described later) into contact with the suction pad 12. Furthermore, the washing | cleaning part 20 accommodates the brush part 21 in the washing | cleaning bath part 22 (refer FIG. 3) mentioned later, and can wash | clean the brush part 21 (upper brush member 21up and lower brush member 21dw).

ブラシ部２１は、後述する上部ブラシ部材２１ｕｐ等を基板Ｗの裏面又は吸着パッド１２の吸着面に押圧した（押し付けた）状態で、両者の相対的な位置関係を変化させることにより、基板Ｗの裏面等を洗浄する。ブラシ部２１の構成を、図２を用いて具体的に説明する。図２（ａ）及び図２（ｂ）は、本実施形態に係るブラシ部２１の斜視図及び断面図を示す。   The brush unit 21 changes the relative positional relationship between the substrate W and the upper brush member 21up, which will be described later, against the back surface of the substrate W or the suction surface of the suction pad 12 by changing the relative positional relationship between them. Clean the back side. The configuration of the brush portion 21 will be specifically described with reference to FIG. 2A and 2B show a perspective view and a cross-sectional view of the brush portion 21 according to the present embodiment.

図２（ａ）に示すように、ブラシ部２１は、本実施形態では、第１の洗浄手段（第１のブラシ部材）として基板Ｗの裏面を洗浄する上部ブラシ部材２１ｕｐと、第２の洗浄手段（第２のブラシ部材）として吸着パッド１２を洗浄する下部ブラシ部材２１ｄｗと、上部ブラシ部材２１ｕｐ及び下部ブラシ部材２１ｄｗを搭載する洗浄支持部材２１ｓｐとを有する。   As shown in FIG. 2A, in this embodiment, the brush part 21 includes an upper brush member 21up for cleaning the back surface of the substrate W as a first cleaning means (first brush member), and a second cleaning. As means (second brush member), there are a lower brush member 21dw for cleaning the suction pad 12, and a cleaning support member 21sp on which the upper brush member 21up and the lower brush member 21dw are mounted.

上部ブラシ部材２１ｕｐ及び下部ブラシ部材２１ｄｗは、多数のプラスチック繊維を円柱状に束ねた部材である。上部ブラシ部材２１ｕｐは、洗浄支持部材２１ｓｐの先端の端面が上方を向いた状態で、その端面（一方の表面）に固定されている。また、下部ブラシ部材２１ｄｗは、上部ブラシ部材２１ｕｐが固定された洗浄支持部材２１ｓｐの先端の端面の反対側の側面（他方の表面）に固定されている。更に、ブラシ部２１は、図示しない回転手段により、洗浄支持部材２１ｓｐを回転することによって、上部ブラシ部材２１ｕｐ等を上部ブラシ部材２１ｕｐ等の周方向に回転することができる。   The upper brush member 21up and the lower brush member 21dw are members in which a large number of plastic fibers are bundled in a columnar shape. The upper brush member 21up is fixed to the end surface (one surface) with the end surface of the tip of the cleaning support member 21sp facing upward. The lower brush member 21dw is fixed to the side surface (the other surface) opposite to the end surface at the tip of the cleaning support member 21sp to which the upper brush member 21up is fixed. Further, the brush part 21 can rotate the upper brush member 21up and the like in the circumferential direction of the upper brush member 21up and the like by rotating the cleaning support member 21sp by a rotating means (not shown).

ここで、上部ブラシ部材２１ｕｐは、洗浄する基板の形状に対応した形状とすることができる。また、上部ブラシ部材２１ｕｐは、洗浄する基板の材質に対応した材質又はその繊維の密集度とすることができる。下部ブラシ部材２１ｄｗも、同様に、洗浄する吸着パッド１２の形状又は材質に対応した形状、材質又はその繊維の密集度とすることができる。更に、上部ブラシ部材２１ｕｐ等は、プラスチック繊維若しくはその他合成樹脂（塩化ビニル樹脂（ＰＶＣ）、ポリ酢酸ビニル（ＰＶＡ）、ポリプロピレン（ＰＰ）など）の繊維を束ねたもの又は多孔質で伸縮性のある円柱形状の合成樹脂スポンジ、ウレタンスポンジ若しくはその他スポンジを用いることができる。   Here, the upper brush member 21up can have a shape corresponding to the shape of the substrate to be cleaned. Further, the upper brush member 21up can be made of a material corresponding to the material of the substrate to be cleaned or the density of the fibers. Similarly, the lower brush member 21dw can have a shape, material, or density of fibers corresponding to the shape or material of the suction pad 12 to be cleaned. Further, the upper brush member 21up or the like is a bundle of fibers of plastic fibers or other synthetic resins (vinyl chloride resin (PVC), polyvinyl acetate (PVA), polypropylene (PP), etc.) or porous and stretchable. A cylindrical synthetic resin sponge, urethane sponge, or other sponge can be used.

以上より、本実施形態に係るブラシ部２１は、上部ブラシ部材２１ｕｐ及び下部ブラシ部材２１ｄｗを後述する洗浄支持部材２１ｓｐの対応する２つの表面（一方の表面と他方の表面）に搭載することができるので、２つのブラシ部材を搭載することによるブラシ部２１及び洗浄支持部材２１ｓｐの体積の増加を低減し、ブラシ部２１及び洗浄支持部材２１ｓｐの省スペース化を図ることができる。   As described above, the brush portion 21 according to the present embodiment can mount the upper brush member 21up and the lower brush member 21dw on two corresponding surfaces (one surface and the other surface) of a cleaning support member 21sp described later. Therefore, the increase in the volume of the brush part 21 and the cleaning support member 21sp due to the mounting of the two brush members can be reduced, and the space of the brush part 21 and the cleaning support member 21sp can be saved.

洗浄支持部材２１ｓｐは、図１に示すように、長手方向に複数の屈曲部を有する矩形断面形状の部材である。洗浄支持部材２１ｓｐは、その一端に上部ブラシ部材２１ｕｐ等を保持する。また、洗浄支持部材２１ｓｐは、その他端に連結した後述する駆動部４０（図４の回転機構４１Ｍ）の駆動により、保持した上部ブラシ部材２１ｕｐ等を回転移動することができる。ブラシ部２１の配置（移動した上部ブラシ部材２１ｕｐ等）は、後述する図４及び図５で説明する。   As shown in FIG. 1, the cleaning support member 21sp is a member having a rectangular cross-sectional shape having a plurality of bent portions in the longitudinal direction. The cleaning support member 21sp holds the upper brush member 21up and the like at one end thereof. Further, the cleaning support member 21sp can rotate and move the held upper brush member 21up and the like by driving of a driving unit 40 (described later) (rotating mechanism 41M in FIG. 4) connected to the other end. The arrangement of the brush portion 21 (the moved upper brush member 21up and the like) will be described with reference to FIGS.

なお、上部ブラシ部材２１ｕｐ等は洗浄支持部材２１ｓｐに着脱可能に固定することができる。このため、洗浄部２０は、所定期間使用した上部ブラシ部材２１ｕｐ等を交換することができる。   The upper brush member 21up and the like can be detachably fixed to the cleaning support member 21sp. For this reason, the washing | cleaning part 20 can replace | exchange the upper brush member 21up etc. which were used for the predetermined period.

洗浄バス部２２は、上部ブラシ部材２１ｕｐ等を後述する上部バス基板２２ｕｐ（図３参照）等に押圧した状態で、両者の相対的な位置関係を変化させることにより、上部ブラシ部材２１ｕｐ等を洗浄する。洗浄バス部２２の構成を、図３を用いて具体的に説明する。図３（ａ）は、本実施形態に係る洗浄バス部２２の斜視図を示す。図３（ｂ）は、ブラシ部２１を収容（遊挿）した洗浄バス部２２の断面図を示す。   The cleaning bath unit 22 cleans the upper brush member 21up and the like by changing the relative positional relationship between the upper brush member 21up and the like while pressing the upper brush member 21up and the like against an upper bus substrate 22up (see FIG. 3) described later. To do. The configuration of the cleaning bath 22 will be specifically described with reference to FIG. Fig.3 (a) shows the perspective view of the washing | cleaning bath part 22 which concerns on this embodiment. FIG. 3B shows a cross-sectional view of the cleaning bath portion 22 in which the brush portion 21 is accommodated (freely inserted).

図３（ａ）に示すように、洗浄バス部２２は、本実施形態では、外形が略円柱形状（ブラシ部２１の円形断面の直径より大きい直径の略円柱形状）であり、その外形の底部に洗浄支持部材２１ｓｐを挿入することができる切り欠き部を有する。洗浄バス部２２は、その切り欠き部に洗浄支持部材２１ｓｐを挿入することで、ブラシ部２１を収容することができる。また、洗浄バス部２２は、本実施形態では、第１の洗浄バスとして上部ブラシ部材２１ｕｐを洗浄する円柱形状の上部バス基板２２ｕｐと、第２の洗浄バスとして下部ブラシ部材２１ｄｗを洗浄する切り欠き部を有する略円柱形状の下部バス基板２２ｄｗとを有する。   As shown in FIG. 3A, in the present embodiment, the washing bath portion 22 has a substantially cylindrical shape (a substantially cylindrical shape having a diameter larger than the diameter of the circular cross section of the brush portion 21), and the bottom of the outer shape. Has a notch into which the cleaning support member 21sp can be inserted. The cleaning bath portion 22 can accommodate the brush portion 21 by inserting the cleaning support member 21sp into the cutout portion. In the present embodiment, the cleaning bath 22 includes a cylindrical upper bus substrate 22up that cleans the upper brush member 21up as a first cleaning bath, and a cutout that cleans the lower brush member 21dw as a second cleaning bath. And a substantially cylindrical lower bus substrate 22dw having a portion.

図３（ｂ）に示すように、洗浄バス部２２は、その略円柱形状の中心軸が上部ブラシ部材２１ｕｐ等の中心軸とほぼ同じ位置となるようにブラシ部２１を挿入することができる。これにより、洗浄バス部２２は、ブラシ部２１をその内部に収容する。このとき、洗浄バス部２２は、上部ブラシ部材２１ｕｐを上部バス基板２２ｕｐに押圧した状態で、両者の相対的な位置関係を変化させることにより、上部ブラシ部材２１ｕｐを洗浄することができる。また、洗浄バス部２２は、同様に、下部ブラシ部材２１ｄｗを下部バス基板２２ｄｗにより洗浄することができる。ここで、上部バス基板２２ｕｐ及び下部バス基板２２ｄｗは、石英ガラスのガラス基板を用いることができる。   As shown in FIG. 3B, the brush portion 21 can be inserted into the cleaning bath portion 22 such that the central axis of the substantially cylindrical shape is substantially the same position as the central axis of the upper brush member 21up and the like. Thereby, the washing | cleaning bath part 22 accommodates the brush part 21 in the inside. At this time, the cleaning bath portion 22 can clean the upper brush member 21up by changing the relative positional relationship between the upper brush member 21up and the upper bus substrate 22up while being pressed. Similarly, the cleaning bath 22 can clean the lower brush member 21dw with the lower bus substrate 22dw. Here, a quartz glass glass substrate can be used for the upper bus substrate 22up and the lower bus substrate 22dw.

なお、上部ブラシ部材２１ｕｐ等を回転させながら上部バス基板２２ｕｐ等に押圧してもよい。また、上部ブラシ部材２１ｕｐ等に洗浄液等を供給してもよい。更に、上部ブラシ部材２１ｕｐ等に紫外線を照射してもよい。これらにより、洗浄バス部２２の上部ブラシ部材２１ｕｐ等に対する洗浄効果を高めることができる。   Alternatively, the upper brush member 21up or the like may be pressed against the upper bus board 22up or the like while rotating. Further, a cleaning liquid or the like may be supplied to the upper brush member 21up or the like. Further, the upper brush member 21up and the like may be irradiated with ultraviolet rays. As a result, the cleaning effect on the upper brush member 21up of the cleaning bath 22 can be enhanced.

筐体部３０は、図１に示すように、細長い棒状で矩形断面形状の２本の第１の橋桁３１ａ及び２本の第２の橋桁３１ｂと、吸着パッド１２を支持する細長い棒状のパッド支持片３１ｐと、洗浄バス部２２を搭載する細長い棒状で矩形断面形状の２本の洗浄バス支持片３１ｑと、その中央部に洗浄する基板Ｗの直径より大きい直径の円形の開口部３２ｕｐａを有する環状のアッパーカップ３２ｕｐと、その上部が開口した４つの側壁を備える箱状のアンダーカップ３２ｕｄとを含む。   As shown in FIG. 1, the housing unit 30 has an elongated rod-like pad support for supporting the two first bridge girders 31 a and two second bridge girders 31 b having a rectangular cross-sectional shape, and the suction pad 12. A ring 31p, an annular rod 32pa having a diameter larger than the diameter of the substrate W to be cleaned at the center thereof, and two cleaning bus support pieces 31q having an elongated rod shape and a rectangular cross section for mounting the cleaning bus portion 22. The upper cup 32up and a box-like undercup 32ud having four side walls opened at the top thereof.

２本の第１の橋桁３１ａは、本実施形態では、その橋桁の両端を後述するアンダーカップ３２ｕｄの対向する２つの側壁の上部端面に載置する。これにより、２本の第１の橋桁３１ａ及び２本の第２の橋桁３１ｂは、アッパーカップ３２ｕｐ等を搭載することができる井桁（以下、井桁という。）を構成する。また、２本の第１の橋桁３１ａのアンダーカップ３２ｕｄの側壁の上部端面に載置した両端は、アンダーカップ３２ｕｄの側壁に沿って張設（張った状態で設置）されたベルト４２ｂに固定されている。すなわち、筐体部３０は、後述する駆動部４０（駆動機構４２Ｍ）の駆動により、ベルト４２ｂを移動（旋回）し、井桁及び井桁に搭載されたアッパーカップ３２ｕｐを移動することができる。   In the present embodiment, the two first bridge girders 31a are placed on the upper end surfaces of two opposing side walls of an under cup 32ud described later. Thus, the two first bridge girders 31a and the two second bridge girders 31b constitute a well beam (hereinafter referred to as a well beam) on which the upper cup 32up and the like can be mounted. Further, both ends of the two first bridge girders 31a placed on the upper end face of the side wall of the under cup 32ud are fixed to a belt 42b stretched (installed in a stretched state) along the side wall of the under cup 32ud. ing. That is, the casing 30 can move (turn) the belt 42b by driving a drive unit 40 (drive mechanism 42M) described later, and can move the upper cup 32up mounted on the well beam and the well beam.

パッド支持片３１ｐは、本実施形態では、２本の第２の橋桁３１ｂの略中央部に各々設置されている。洗浄バス支持片３１ｑは、本実施形態では、その支持片の両端を２本の第１の橋桁３１ａの上部表面に載置し、固定されている。このため、２本の洗浄バス支持片３１ｑは井桁（ベルト４２ｂ）に追従して移動する。また、２本の洗浄バス支持片３１ｑに搭載された洗浄バス部２２は２本の洗浄バス支持片３１ｑに追従して移動する。   In the present embodiment, the pad support pieces 31p are respectively installed at substantially central portions of the two second bridge girders 31b. In this embodiment, the cleaning bath support piece 31q is fixed by placing both ends of the support piece on the upper surfaces of the two first bridge girders 31a. For this reason, the two washing bath support pieces 31q move following the cross beam (belt 42b). Further, the cleaning bus portion 22 mounted on the two cleaning bus support pieces 31q moves following the two cleaning bus support pieces 31q.

アッパーカップ３２ｕｐは、基板Ｗ表面上の洗浄液などの飛散を防止する。また、基板洗浄装置１００は、アッパーカップ３２ｕｐの開口部３２ｕｐａを介して、外部の搬送手段Ｍｗ（図６（ａ））と吸着パッド１２との間で基板Ｗの受け渡しを行うことができる。なお、井桁に搭載されたアッパーカップ３２ｕｐは、井桁の移動に追従して移動する。   The upper cup 32up prevents scattering of the cleaning liquid on the surface of the substrate W. Further, the substrate cleaning apparatus 100 can transfer the substrate W between the external transfer means Mw (FIG. 6A) and the suction pad 12 through the opening 32upa of the upper cup 32up. Note that the upper cup 32up mounted on the cross beam moves following the movement of the cross beam.

アンダーカップ３２ｕｄは、筐体部３０の外形を形成する。また、アンダーカップ３２ｕｄは、図示しないインナーカップ、排液管（ドレイン管）及び排気管などにより、アンダーカップ３２ｕｄ内に送入された気体（窒素ガス、圧縮空気など）又は液体（洗浄液、リンス液及び処理液など）を排気又は排液することができる。   The undercup 32 ud forms the outer shape of the housing unit 30. The under cup 32ud is a gas (nitrogen gas, compressed air, etc.) or liquid (cleaning liquid, rinse liquid) fed into the under cup 32ud by an inner cup, a drain pipe (drain pipe), an exhaust pipe, etc. (not shown). And the treatment liquid) can be exhausted or drained.

駆動部４０は、図１に示すように、移動手段として、洗浄支持部材２１ｓｐを片持ちの状態で回転移動する回転機構４１Ｍと、井桁を水平方向（図中のＸ軸方向）に平行移動する駆動機構４２Ｍと、井桁を鉛直方向（図中のＺ方向）に上下移動する昇降機構（スライダ）４３Ｓと、スピンチャック１１を回転する回転機構（スピンチャックモータ）４４Ｍとを含む。駆動部４０は、回転機構４１Ｍと駆動機構４２Ｍとにより、基板保持部１０と洗浄部２０との相対的な位置関係を変化することができる。また、駆動部４０は、昇降機構４３Ｓにより、スピンチャック１１と吸着パッド１２との間で基板Ｗの受け渡しを行なうことができる。更に、駆動部４０は、回転機構４４Ｍにより、スピンチャック１１に吸着して固定した基板Ｗを回転することができる。   As shown in FIG. 1, the drive unit 40 translates the rotating mechanism 41M that rotates the cleaning support member 21sp in a cantilevered manner as a moving unit, and the parallel beam in the horizontal direction (X-axis direction in the drawing). It includes a drive mechanism 42M, an elevating mechanism (slider) 43S that moves the cross beam vertically in the vertical direction (Z direction in the figure), and a rotating mechanism (spin chuck motor) 44M that rotates the spin chuck 11. The drive unit 40 can change the relative positional relationship between the substrate holding unit 10 and the cleaning unit 20 by the rotation mechanism 41M and the drive mechanism 42M. Further, the drive unit 40 can transfer the substrate W between the spin chuck 11 and the suction pad 12 by the lifting mechanism 43S. Furthermore, the drive unit 40 can rotate the substrate W that is attracted and fixed to the spin chuck 11 by the rotation mechanism 44M.

回転機構４１Ｍは、洗浄支持部材２１ｓｐの一端と連結し、洗浄支持部材２１ｓｐを片持ちの状態で回転移動する。これにより、回転機構４１Ｍは、ブラシ部２１を基板Ｗの下方、吸着パッド１２の上方及び洗浄バス部の内部に移動することができる。   The rotation mechanism 41M is connected to one end of the cleaning support member 21sp, and rotates and moves the cleaning support member 21sp in a cantilever state. Thereby, the rotation mechanism 41M can move the brush part 21 below the substrate W, above the suction pad 12, and inside the cleaning bath part.

駆動機構４２Ｍは、巻掛軸４２ｒを回転し、巻掛軸４２ｒに設置（巻回）したベルト４２ｂを移動（旋回）させ、ベルト４２ｂに固定された井桁を平行移動する。これにより、駆動機構４２Ｍは、井桁に搭載されたアッパーカップ３２ｕｐ及び井桁に設置された吸着パッド１２をブラシ部２１に接近する方向及び離間する方向（図１のＸ軸方向）に移動することができる。   The drive mechanism 42M rotates the winding shaft 42r, moves (turns) the belt 42b installed (wound) on the winding shaft 42r, and translates the well beam fixed to the belt 42b. Thus, the drive mechanism 42M can move the upper cup 32up mounted on the cross beam and the suction pad 12 installed on the cross beam in a direction approaching and separating from the brush portion 21 (X-axis direction in FIG. 1). it can.

昇降機構４３Ｓは、スライダレール４３ｒに沿って、ベルト４２ｂを鉛直方向に上下移動し、ベルト４２ｂに固定された井桁を上下移動させ、井桁に搭載されたアッパーカップ３２ｕｐ及び井桁に設置された吸着パッド１２を上下移動する。これにより、昇降機構４３Ｓは、吸着パッド１２に吸着された基板Ｗの裏面をブラシ部２１（上部ブラシ部材２１ｕｐ）に接近する方向及び離間する方向（図１のＺ軸方向）に移動することができる。   The elevating mechanism 43S moves the belt 42b up and down in the vertical direction along the slider rail 43r, moves the well fixed to the belt 42b up and down, and the upper cup 32up mounted on the well and the suction pad installed on the well 12 is moved up and down. As a result, the lifting mechanism 43S can move the back surface of the substrate W sucked by the suction pad 12 in a direction approaching and separating from the brush portion 21 (upper brush member 21up) (Z-axis direction in FIG. 1). it can.

（各洗浄時の洗浄部の配置）
本発明の実施形態に係る基板洗浄装置１００の洗浄部２０について、基板Ｗ、基板保持部１０及び洗浄部２０を洗浄するときの洗浄部２０（ブラシ部２１）の配置を図４及び図５を用いて説明する。 (Placement of cleaning section at each cleaning)
Regarding the cleaning unit 20 of the substrate cleaning apparatus 100 according to the embodiment of the present invention, the arrangement of the cleaning unit 20 (brush unit 21) when cleaning the substrate W, the substrate holding unit 10 and the cleaning unit 20 is shown in FIGS. It explains using.

図４は、本実施形態に係る基板洗浄装置１００の吸着パッド１２（第２の基板保持手段）を洗浄するときの洗浄部２０（ブラシ部２１）の配置を示す。図５（ａ）は、基板洗浄装置１００が基板Ｗの裏面を洗浄するときの洗浄部２０（ブラシ部２１）の配置を示す。図５（ｂ）は、基板洗浄装置１００がブラシ部２１を洗浄するときの洗浄部２０（ブラシ部２１）の配置を示す。   FIG. 4 shows an arrangement of the cleaning unit 20 (brush unit 21) when cleaning the suction pad 12 (second substrate holding unit) of the substrate cleaning apparatus 100 according to the present embodiment. FIG. 5A shows the arrangement of the cleaning unit 20 (brush unit 21) when the substrate cleaning apparatus 100 cleans the back surface of the substrate W. FIG. FIG. 5B shows an arrangement of the cleaning unit 20 (brush unit 21) when the substrate cleaning apparatus 100 cleans the brush unit 21.

図４に示すように、本実施形態に係る基板洗浄装置１００は、駆動部４０の回転機構４１Ｍの駆動により、洗浄部２０の洗浄支持部材２１ｓｐを回転移動し、ブラシ部２１（下部ブラシ部材２１ｄｗ）を基板保持部１０（吸着パッド１２）に接触させる。このとき、洗浄部２０は、ブラシ部２１の下部ブラシ部材２１ｄｗ（図２）を吸着パッド１２の基板Ｗの裏面と接触する接触面に押し当て、ブラシ部２１を回転若しくは回転移動及び吸着パッド１２（井桁）を移動することで両者の相対的な位置関係を変化させ、吸着パッド１２の表面（接触面）を洗浄する。   As shown in FIG. 4, the substrate cleaning apparatus 100 according to the present embodiment rotates and moves the cleaning support member 21sp of the cleaning unit 20 by driving the rotation mechanism 41M of the driving unit 40, and the brush unit 21 (lower brush member 21dw). ) Is brought into contact with the substrate holder 10 (suction pad 12). At this time, the cleaning unit 20 presses the lower brush member 21dw (FIG. 2) of the brush unit 21 against a contact surface that contacts the back surface of the substrate W of the suction pad 12, and rotates or rotates the brush unit 21 and the suction pad 12. The relative positional relationship between the two is changed by moving the (cross beam), and the surface (contact surface) of the suction pad 12 is cleaned.

これにより、本実施形態に係る基板洗浄装置１００は、吸着パッド１２の表面が基板Ｗに付着していた汚染物により汚染された場合でも、吸着パッド１２の表面を洗浄することができる。また、基板洗浄装置１００は、基板Ｗの搬入時又は搬出時を利用して、吸着パッド１２の表面を洗浄することにより、基板Ｗを洗浄する工程を中断することなく、吸着パッド１２を洗浄することができる。更に、基板洗浄装置１００は、洗浄支持部材２１ｓｐに上部ブラシ部材２１ｕｐ及び下部ブラシ部材２１ｄｗを搭載することで、基板保持部１０（吸着パッド１２）を洗浄するための新たな構成を追加することなく、基板Ｗの裏面を洗浄する洗浄部２０の構成を利用して、基板保持部１０を洗浄することができる。   Thereby, the substrate cleaning apparatus 100 according to the present embodiment can clean the surface of the suction pad 12 even when the surface of the suction pad 12 is contaminated by contaminants attached to the substrate W. Further, the substrate cleaning apparatus 100 cleans the suction pad 12 without interrupting the process of cleaning the substrate W by cleaning the surface of the suction pad 12 by using the loading or unloading of the substrate W. be able to. Furthermore, the substrate cleaning apparatus 100 mounts the upper brush member 21up and the lower brush member 21dw on the cleaning support member 21sp without adding a new configuration for cleaning the substrate holding unit 10 (suction pad 12). The substrate holding unit 10 can be cleaned using the configuration of the cleaning unit 20 that cleans the back surface of the substrate W.

なお、基板洗浄装置１００は、基板Ｗの搬入前若しくは搬出後、又は、ロッドごと、基板Ｗの所定枚数の処理後若しくは所定期間の経過後に、基板保持部１０（吸着パッド１２）を洗浄してもよい。   The substrate cleaning apparatus 100 cleans the substrate holding unit 10 (suction pad 12) before or after loading the substrate W, or after processing a predetermined number of substrates W or after a predetermined period of time for each rod. Also good.

図５（ａ）に示すように、本実施形態に係る基板洗浄装置１００は、駆動部４０の回転機構４１Ｍの駆動により、洗浄部２０の洗浄支持部材２１ｓｐを回転移動し、スピンチャック１１に保持された基板Ｗの下方にブラシ部２１を移動し、ブラシ部２１と基板Ｗの裏面を接触させる。このとき、洗浄部２０は、ブラシ部２１の上部ブラシ部材２１ｕｐ（図２）を基板Ｗの裏面と接触する表面に押し当て、ブラシ部２１を回転若しくは回転移動及び基板Ｗ（スピンチャック１１）を回転することにより、ブラシ部２１と基板Ｗとの相対的な位置関係を変化させ、基板Ｗの裏面を洗浄する。   As shown in FIG. 5A, the substrate cleaning apparatus 100 according to this embodiment rotates and moves the cleaning support member 21sp of the cleaning unit 20 by the rotation of the rotation mechanism 41M of the driving unit 40 and holds it on the spin chuck 11. The brush part 21 is moved to the lower side of the substrate W, and the brush part 21 and the back surface of the substrate W are brought into contact with each other. At this time, the cleaning unit 20 presses the upper brush member 21up (FIG. 2) of the brush unit 21 against the surface that contacts the back surface of the substrate W, and rotates or rotates the brush unit 21 and the substrate W (spin chuck 11). By rotating, the relative positional relationship between the brush portion 21 and the substrate W is changed, and the back surface of the substrate W is cleaned.

これにより、本実施形態に係る基板洗浄装置１００は、洗浄部２０により、基板Ｗの裏面に付着していた汚染物を洗浄することができる。   Thereby, the substrate cleaning apparatus 100 according to the present embodiment can clean the contaminants attached to the back surface of the substrate W by the cleaning unit 20.

図５（ｂ）に示すように、本実施形態に係る基板洗浄装置１００は、駆動部４０の回転機構４１Ｍの駆動により、洗浄部２０の洗浄支持部材２１ｓｐを回転移動し、ブラシ部２１を洗浄バス部２２に移動する。このとき、洗浄部２０は、一定期間使用したことにより基板Ｗに付着していた汚染物で汚染されたブラシ部２１を洗浄バス部２２の内部で洗浄することができる（図３（ｂ））。   As shown in FIG. 5B, the substrate cleaning apparatus 100 according to this embodiment rotates the cleaning support member 21sp of the cleaning unit 20 by driving the rotation mechanism 41M of the driving unit 40, and cleans the brush unit 21. Move to the bus unit 22. At this time, the cleaning unit 20 can clean the brush unit 21 contaminated with the contaminant attached to the substrate W after being used for a certain period of time within the cleaning bath unit 22 (FIG. 3B). .

これにより、本実施形態に係る基板洗浄装置１００は、一定期間使用することによって基板Ｗに付着していた汚染物によりブラシ部２１が汚染された場合でも、その汚染されたブラシ部２１を洗浄することができる。また、基板洗浄装置１００は、基板Ｗの搬入時若しくは搬出時又は搬入後若しくは搬出後の時間を利用して、ブラシ部２１を洗浄することにより、基板Ｗを洗浄する工程を中断することなく、ブラシ部２１を洗浄することができる。更に、基板洗浄装置１００は、ブラシ部２１で洗浄しないときに、ブラシ部２１を洗浄バス部２２で待機させることにより、ブラシ部２１を清浄に保つことができる。   Accordingly, the substrate cleaning apparatus 100 according to the present embodiment cleans the contaminated brush portion 21 even when the brush portion 21 is contaminated by contaminants attached to the substrate W after being used for a certain period of time. be able to. In addition, the substrate cleaning apparatus 100 uses the time when the substrate W is loaded or unloaded, or after loading or unloading, to clean the brush unit 21 without interrupting the process of cleaning the substrate W. The brush part 21 can be cleaned. Furthermore, the substrate cleaning apparatus 100 can keep the brush unit 21 clean by causing the brush unit 21 to wait in the cleaning bath unit 22 when not cleaning with the brush unit 21.

（基板、基板保持部及び洗浄部を洗浄する動作）
本実施形態に係る基板洗浄装置１００が基板Ｗ、基板保持部１０及び洗浄部２０を洗浄する基板洗浄方法を、図６を用いて説明する。以下に、本発明の実施形態に係る基板洗浄方法を時系列で説明する。 (Operation to clean the substrate, substrate holding unit and cleaning unit)
A substrate cleaning method in which the substrate cleaning apparatus 100 according to this embodiment cleans the substrate W, the substrate holding unit 10, and the cleaning unit 20 will be described with reference to FIG. Hereinafter, a substrate cleaning method according to an embodiment of the present invention will be described in time series.

先ず、本実施形態の基板洗浄装置１００は、図６（ａ）において、外部の搬送手段Ｍｗにより、基板Ｗを、基板洗浄装置１００の上方に搬入する。このとき、外部の搬送手段Ｍｗは、基板保持部１０の支持ピン１３（３つの支持ピン）に基板Ｗを載置する（点接触させる）ため、搬入した基板Ｗを下方に移動する（Ｍａ）。なお、支持ピン１３が更に上昇して、支持ピン１３に基板Ｗを搭載してもよい。   First, in FIG. 6A, the substrate cleaning apparatus 100 of the present embodiment carries the substrate W into the upper part of the substrate cleaning apparatus 100 by the external transfer means Mw. At this time, the external transport means Mw moves the loaded substrate W downward to place the substrate W on the support pins 13 (three support pins) (three support pins) of the substrate holding unit 10 (Ma). . The support pins 13 may be further raised and the substrate W may be mounted on the support pins 13.

次に、基板洗浄装置１００は、図６（ｂ）において、支持ピン１３で支持した基板Ｗを吸着パッド１２で保持するため、支持ピン１３を下方に移動する（Ｍｂ）。ここで、基板Ｗは、アッパーカップの開口部３２ｕｐａを通過して、吸着パッド１２の上方の端面に載置される。このとき、吸着パッド１２は、基板Ｗの裏面の第２の領域（接触面）で面接触する。   Next, in FIG. 6B, the substrate cleaning apparatus 100 moves the support pin 13 downward in order to hold the substrate W supported by the support pin 13 with the suction pad 12 (Mb). Here, the substrate W passes through the upper cup opening 32upa and is placed on the upper end surface of the suction pad 12. At this time, the suction pad 12 comes into surface contact with the second region (contact surface) on the back surface of the substrate W.

次いで、基板洗浄装置１００は、図６（ｃ）において、後述するスピンチャック１１で保持（図６（ｆ））される基板Ｗの裏面の第１の領域を洗浄するため、駆動部４０の駆動機構４２Ｍの駆動により、吸着パッド１２に保持された基板Ｗをブラシ部２１の方向に移動する（Ｍｃ）。   Next, in FIG. 6C, the substrate cleaning apparatus 100 drives the drive unit 40 to clean the first region on the back surface of the substrate W held by the spin chuck 11 described later (FIG. 6F). By driving the mechanism 42M, the substrate W held on the suction pad 12 is moved in the direction of the brush portion 21 (Mc).

次いで、基板洗浄装置１００は、図６（ｄ）において、基板Ｗの第１の領域を含む裏面の一部をブラシ部２１の上部ブラシ部材２１ｕｐで洗浄する。このとき、洗浄部２０は図示しない駆動機構によりブラシ部２１を上昇して基板Ｗの裏面に接触させ、図示しない回転機構によりブラシ部２１を回転して基板Ｗの裏面を洗浄する（Ｍｄ）。   Next, in FIG. 6D, the substrate cleaning apparatus 100 cleans a part of the back surface including the first region of the substrate W with the upper brush member 21 up of the brush portion 21. At this time, the cleaning unit 20 raises the brush unit 21 by a driving mechanism (not shown) to contact the back surface of the substrate W, and rotates the brush unit 21 by a rotating mechanism (not shown) to clean the back surface of the substrate W (Md).

洗浄の後に、基板洗浄装置１００は、図６（ｅ）において、スピンチャック１１で基板Ｗを保持するため、駆動機構４２Ｍの駆動により、基板Ｗを図６（ｃ）と同じ位置に戻す。更にその後、基板洗浄装置１００は、スピンチャック１１を上方に移動し、スピンチャック１１と基板Ｗの裏面の第１の領域とを接触させ、基板Ｗを保持する（Ｍｅ）。   After the cleaning, the substrate cleaning apparatus 100 returns the substrate W to the same position as in FIG. 6C by driving the drive mechanism 42M in order to hold the substrate W by the spin chuck 11 in FIG. 6E. Thereafter, the substrate cleaning apparatus 100 moves the spin chuck 11 upward to bring the spin chuck 11 into contact with the first region on the back surface of the substrate W to hold the substrate W (Me).

なお、基板洗浄装置１００は、スピンチャック１２及び支持ピン１３の周囲に、これらを取り囲むように設置された円筒体形状のエアナイフ２４ａｎ（図８）により、エアナイフ２４ａｎの噴射口から基板Ｗの裏面に気体を噴出して、スピンチャック１１が基板Ｗに付着した汚染物等を吸引しないようにすることができる。   In addition, the substrate cleaning apparatus 100 is arranged around the spin chuck 12 and the support pin 13 from the injection port of the air knife 24an to the back surface of the substrate W by a cylindrical air knife 24an (FIG. 8) installed so as to surround them. It is possible to prevent the spin chuck 11 from sucking contaminants attached to the substrate W by ejecting gas.

次いで、基板洗浄装置１００は、図６（ｆ）において、駆動機構４４Ｍの駆動により、スピンチャック１１で保持した基板Ｗを回転し（Ｒｆ）、第２の領域を含む基板Ｗの裏面をブラシ部２１の上部ブラシ部材２１ｕｐで洗浄する。このとき、基板洗浄装置１００は、液体ノズル２４ｆ又は気体ノズル２４ｇを用いて、基板Ｗの裏面に洗浄液又は基板Ｗの表面に不活性ガスを供給することができる。   Next, in FIG. 6F, the substrate cleaning apparatus 100 rotates the substrate W held by the spin chuck 11 by driving the drive mechanism 44M (Rf), and the back surface of the substrate W including the second region is brushed. 21 is cleaned with the upper brush member 21up. At this time, the substrate cleaning apparatus 100 can supply the cleaning liquid or the inert gas to the front surface of the substrate W using the liquid nozzle 24 f or the gas nozzle 24 g.

その後、基板洗浄装置１００は、図６（ｇ）において、基板Ｗに付着していた汚染物により汚染された吸着パッド１２を下部ブラシ部材２１ｄｗで洗浄する。このとき、基板洗浄装置１００は、液体ノズル２４ｆ又はブラシ部等に設置したノズル（図８の２３ａ〜２３ｃ又は２４ｆ）を用いて、吸着パッド１２の表面に洗浄液を供給することができる。   Thereafter, in FIG. 6G, the substrate cleaning apparatus 100 cleans the suction pad 12 contaminated with the contaminants attached to the substrate W with the lower brush member 21dw. At this time, the substrate cleaning apparatus 100 can supply the cleaning liquid to the surface of the suction pad 12 using a nozzle (23a to 23c or 24f in FIG. 8) installed in the liquid nozzle 24f or a brush unit or the like.

更にその後、基板洗浄装置１００は、図６（ｈ）において、基板Ｗの洗浄を完了し、図６（ａ）及び図６（ｂ）の逆の手順で基板Ｗを基板洗浄装置１００の外部に搬出する。なお、基板洗浄装置１００は、基板Ｗを搬出するのと同時に、上記図６（ｇ）の吸着パッド１２の洗浄をしてもよい。また、基板洗浄装置１００は、基板Ｗを搬出した後又は次の基板Ｗを搬入する前に、上記図６（ｇ）の吸着パッド１２の洗浄をしてもよい。   Thereafter, the substrate cleaning apparatus 100 completes the cleaning of the substrate W in FIG. 6H, and the substrate W is moved outside the substrate cleaning apparatus 100 in the reverse order of FIGS. 6A and 6B. Take it out. The substrate cleaning apparatus 100 may clean the suction pad 12 shown in FIG. 6G at the same time when the substrate W is unloaded. Further, the substrate cleaning apparatus 100 may clean the suction pad 12 shown in FIG. 6G after unloading the substrate W or before loading the next substrate W.

以上により、本発明の実施形態に係る基板洗浄装置１００は、ブラシ部２１（下部ブラシ部材２１ｄｗ）で吸着パッド１２（第２の基板保持手段）を洗浄することができるので、洗浄する前の基板Ｗの裏面に付着した汚染物により汚染された吸着パッド１２を洗浄することができる。また、基板洗浄装置１００は、ブラシ部２１の洗浄により吸着パッド１２を清浄に保つことができるので、吸着パッド１２に付着した汚染物が基板Ｗ等に転移することを防ぐことができる。更に、基板洗浄装置１００は、スピンチャック１１（第１の基板保持手段）及び吸着パッド１２（第２の基板保持手段）によって基板Ｗを各々異なる領域で保持することができるので、基板Ｗの裏面の全域を洗浄することができる。   As described above, the substrate cleaning apparatus 100 according to the embodiment of the present invention can clean the suction pad 12 (second substrate holding means) with the brush portion 21 (lower brush member 21dw). It is possible to clean the suction pad 12 contaminated by the contaminants attached to the back surface of W. Further, since the substrate cleaning apparatus 100 can keep the suction pad 12 clean by cleaning the brush portion 21, it is possible to prevent the contaminants attached to the suction pad 12 from being transferred to the substrate W or the like. Furthermore, since the substrate cleaning apparatus 100 can hold the substrate W in different regions by the spin chuck 11 (first substrate holding means) and the suction pad 12 (second substrate holding means), the back surface of the substrate W The entire area can be cleaned.

更に、本発明の実施形態に係る基板洗浄装置１００は、ブラシ部２１を洗浄バス部２２により洗浄することができるので、清浄な洗浄部２０（ブラシ部２１）で基板Ｗを洗浄することができる。また、基板洗浄装置１００は、基板Ｗの搬入時又は搬出時に洗浄バス部２２でブラシ部２１を洗浄することができるので、基板Ｗを洗浄する工程を中断することなく、洗浄部２０を洗浄することができる。すなわち、基板洗浄装置１００は、基板Ｗを製造する生産性を犠牲にすることなく、基板Ｗを洗浄することができる。   Furthermore, since the substrate cleaning apparatus 100 according to the embodiment of the present invention can clean the brush unit 21 with the cleaning bath unit 22, the substrate W can be cleaned with the clean cleaning unit 20 (brush unit 21). . In addition, since the substrate cleaning apparatus 100 can clean the brush unit 21 with the cleaning bus unit 22 when the substrate W is carried in or out, the substrate cleaning apparatus 100 cleans the cleaning unit 20 without interrupting the process of cleaning the substrate W. be able to. That is, the substrate cleaning apparatus 100 can clean the substrate W without sacrificing productivity for manufacturing the substrate W.

本実施形態に係るブラシ部の例を、図７を用いて説明する。図７（ａ）は、本実施形態に係るブラシ部の一例を示す。また、図７（ｂ）は、本実施形態に係るブラシ部の他の例を示す。   The example of the brush part which concerns on this embodiment is demonstrated using FIG. Fig.7 (a) shows an example of the brush part which concerns on this embodiment. Moreover, FIG.7 (b) shows the other example of the brush part which concerns on this embodiment.

図７（ａ）において、本実施形態に係るブラシ部の例は、円柱形状の上部ブラシ部材２１ｕｐと四角柱形状の下部ブラシ部材２１ｄｗを有するブラシ部２１Ｂの例である。ブラシ部２１Ｂは、下部ブラシ部材２１ｄｗを洗浄する吸着パッド１２の表面形状に対応した矩形形状の表面を有するブラシ部材とすることができる。このため、ブラシ部２１Ｂは、吸着パッド１２に接触する面積が増加するため、吸着パッド１２を洗浄する時間を短縮することができる。   In FIG. 7A, an example of the brush portion according to the present embodiment is an example of a brush portion 21B having a columnar upper brush member 21up and a quadrangular prism lower brush member 21dw. The brush part 21B can be a brush member having a rectangular surface corresponding to the surface shape of the suction pad 12 that cleans the lower brush member 21dw. For this reason, since the area where the brush part 21B contacts the suction pad 12 increases, the time for cleaning the suction pad 12 can be shortened.

図７（ｂ）において、本実施形態に係るブラシ部の他の例は、上部ブラシ部材２１ｕｐ及び下部ブラシ部材２１ｄｗの基板Ｗの裏面又は吸着パッド１２に接触する表面が凹凸の表面形状を有するブラシ部材２１Ｃの例である。このため、ブラシ部２１Ｃは、上部ブラシ部材２１ｕｐ等の凸部が基板Ｗの裏面等と接触するときの摩擦力が増加するため、基板Ｗの裏面等に付着した汚染物を短時間で剥離させることができる。また、ブラシ部２１Ｃは、上部ブラシ部材２１ｕｐ等の凹部に洗浄液等を保持することができるため、洗浄液の供給量を低減することができる。   In FIG. 7B, another example of the brush portion according to the present embodiment is a brush having a surface shape in which the back surface of the substrate W of the upper brush member 21up and the lower brush member 21dw or the surface contacting the suction pad 12 is uneven. It is an example of member 21C. For this reason, the brush portion 21C increases the frictional force when the convex portions such as the upper brush member 21up come into contact with the back surface or the like of the substrate W, so that the contaminants attached to the back surface or the like of the substrate W are peeled off in a short time. be able to. Moreover, since the brush part 21C can hold | maintain a washing | cleaning liquid etc. in recessed parts, such as the upper brush member 21up, it can reduce the supply amount of a washing | cleaning liquid.

本実施形態に係る洗浄液等供給系の例を、図８を用いて説明する。   An example of a cleaning liquid supply system according to this embodiment will be described with reference to FIG.

図８（ａ）及び図８（ｂ）は、本実施形態に係る洗浄液等供給系の一例の概略平面図及び概略側面図を示す。   FIG. 8A and FIG. 8B show a schematic plan view and a schematic side view of an example of a supply system for cleaning liquid and the like according to this embodiment.

図８（ａ）及び図８（ｂ）において、本実施形態に係る洗浄液供給系の例は、ブラシ部２１に並設された第１のノズル２３ａ、ブラシ部２１に並設された第２のノズル２３ｂ、ブラシ部２１の中心部に形成された第３のノズル２３ｃ、基板Ｗの裏面の任意の位置に洗浄液などを吐出する液体ノズル２４ｆ及び基板Ｗの表面の任意の位置に不活性ガスなどを噴出する図示しない気体ノズルのいずれか一つ又はこれらのうちの複数を含む供給系を用いることができる。     8A and 8B, the example of the cleaning liquid supply system according to the present embodiment includes a first nozzle 23 a arranged in parallel with the brush portion 21 and a second nozzle arranged in parallel with the brush portion 21. Nozzle 23b, third nozzle 23c formed at the center of the brush portion 21, liquid nozzle 24f for discharging a cleaning liquid or the like to an arbitrary position on the back surface of the substrate W, and an inert gas at an arbitrary position on the surface of the substrate W A supply system including any one of gas nozzles (not shown) or a plurality of them can be used.

これにより、本実施形態に係る洗浄液等供給系は、例えば第１のノズル２３ａ及び第２のノズル２３ｂで液体及び気体又は異なる２種類の液体を供給することができる。また、本実施形態に係る洗浄液供給系は、例えば第３のノズル２３ｃにより、効率的にブラシ部２１に洗浄液を供給することができる。更に、本実施形態に係る洗浄液供給系は、例えば液体ノズル２４ｆにより、基板Ｗの裏面を洗浄している部分に集中的に洗浄液を供給することができる。更に、本実施形態に係る洗浄液等供給系は、例えば気体ノズルにより、基板Ｗの表面で乾燥し難い中心部に集中的に不活性ガスを供給することができる。   Thereby, the supply system such as the cleaning liquid according to the present embodiment can supply the liquid and the gas or two different kinds of liquids with the first nozzle 23a and the second nozzle 23b, for example. Further, the cleaning liquid supply system according to the present embodiment can efficiently supply the cleaning liquid to the brush portion 21 by, for example, the third nozzle 23c. Furthermore, the cleaning liquid supply system according to the present embodiment can supply the cleaning liquid intensively to a portion where the back surface of the substrate W is cleaned by, for example, the liquid nozzle 24f. Furthermore, the supply system such as the cleaning liquid according to the present embodiment can supply the inert gas intensively to the central portion that is difficult to dry on the surface of the substrate W by, for example, a gas nozzle.

なお、本実施形態に係る洗浄液等供給系は、液体等の供給源ＣｎｔＳから温度調整部ＣｎｔＨによりその温度を調整して、バルブＶ１を介して、洗浄液等を供給することができる。洗浄液としては、脱イオン水（ＤＩＷ）、ＤＩＷとオゾン水との混合液、あるいはＤＩＷとアルカリ液との混合液等を用いることができる。   The cleaning liquid supply system according to the present embodiment can supply the cleaning liquid or the like via the valve V1 by adjusting the temperature of the supply system CntS of the liquid or the like by the temperature adjustment unit CntH. As the cleaning liquid, deionized water (DIW), a mixed liquid of DIW and ozone water, a mixed liquid of DIW and an alkaline liquid, or the like can be used.

本実施形態に係るブラシ部のその他の例を、図９を用いて説明する。図９（ａ）及び図９（ｂ）は、本実施形態に係るブラシ部のその他の例を示す。   Another example of the brush unit according to the present embodiment will be described with reference to FIG. FIG. 9A and FIG. 9B show another example of the brush unit according to the present embodiment.

図９（ａ）及び図９（ｂ）において、本実施形態に係るブラシ部の一例は、１つのブラシ部材２１ｕｐを上方及び下方に移動させるブラシ部２１Ｄの例である。ブラシ部２１Ｄは、回転機構２１Ａｒの駆動により、洗浄支持部材２１ｓｐの先端部を回転させ、洗浄支持部材２１ｓｐの先端に搭載したブラシ部材２１ｕｐを上方及び下方に移動させる。これにより、ブラシ部２１Ｄは、ブラシ部材２１ｕｐを上方に移動させたときに（図９（ａ））、基板Ｗの裏面を洗浄することができる。また、ブラシ部２１Ｄは、ブラシ部材２１ｕｐを下方に移動させたときに（図９（ｂ））、吸着パッド１２（第２の基板保持手段）を洗浄することができる。   9A and 9B, an example of the brush portion according to the present embodiment is an example of a brush portion 21D that moves one brush member 21up upward and downward. The brush unit 21D rotates the tip of the cleaning support member 21sp by driving the rotation mechanism 21Ar, and moves the brush member 21up mounted on the tip of the cleaning support member 21sp upward and downward. Thus, the brush portion 21D can clean the back surface of the substrate W when the brush member 21up is moved upward (FIG. 9A). Further, the brush portion 21D can clean the suction pad 12 (second substrate holding means) when the brush member 21up is moved downward (FIG. 9B).

上記により、本実施形態に係るブラシ部２１Ｄは、１つのブラシ部材で基板Ｗの裏面及び吸着パッド１２の両方を洗浄することができる。また、本実施形態に係るブラシ部２１Ｄは、１つのブラシ部材であるため、洗浄バス部を単純にすることができる。   By the above, brush part 21D concerning this embodiment can wash both the back of substrate W and adsorption pad 12 with one brush member. Moreover, since the brush part 21D according to the present embodiment is one brush member, the cleaning bath part can be simplified.

以上により、実施形態を参照しながら本発明を説明したが、本発明はこれに限定されることなく、添付の特許請求の範囲に照らし、種々に変形又は変更することが可能である。   Although the present invention has been described above with reference to the exemplary embodiments, the present invention is not limited thereto, and various modifications and changes can be made in light of the appended claims.

また、本発明は、半導体ウエハだけでなくフラットパネルディスプレイ用のガラス基板（ＦＰＤ基板）といった基板を洗浄する基板洗浄装置にも適用できる。   The present invention can also be applied to a substrate cleaning apparatus for cleaning not only a semiconductor wafer but also a substrate such as a glass substrate (FPD substrate) for a flat panel display.

１００：基板洗浄装置
１０ ： 基板保持部
１１ ： スピンチャック（第１の基板保持手段）
１１ａ ： 吸着孔（スピンチャック用）
１２ ： 吸着パッド（第２の基板保持手段）
１２ａ ： 吸着孔（吸着パッド用）
１２ｐ ： 吸着部
１３ ： 支持ピン
２０ ： 洗浄部
２１、２１Ｂ、２１Ｃ、２１Ｄ： ブラシ部
２１ｓｐ： 洗浄支持部材
２１ｕｐ： 上部ブラシ部材（第１の洗浄手段）
２１ｄｗ： 下部ブラシ部材（第２の洗浄手段）
２１Ａｒ： 回転機構
２２ ： 洗浄バス部
２２ｕｐ： 上部バス基板（第１の洗浄バス）
２２ｄｗ： 下部バス基板（第２の洗浄バス）
２３ａ、２３ｂ ： 第１のノズル、第２のノズル（ブラシ部並設用）
２３ｃ ： 第３のノズル（ブラシ部中心軸部用）
２４ａｎ： エアナイフ
２４ｆ ： 液体ノズル
２４ｇ ： 気体ノズル
３０ ： 筐体部
３１ ： 井桁
３１ａ、３１ｂ ： 第１の橋桁、第２の橋桁
３１ｐ ： パッド支持片
３１ｑ ： 洗浄バス支持片
３２ｕｐ： アッパーカップ
３２ｕｐａ：アッパーカップ開口部
３２ｕｄ： アンダーカップ
４０ ： 駆動部（移動手段）
４１Ｍ ： 回転機構（洗浄支持部材用）
４２Ｍ ： 駆動機構（モータ）
４２ｂ ： ベルト
４２ｒ ： 巻掛軸
４３Ｓ ： 昇降機構（スライダ）
４３ｒ ： スライダレール
４４Ｍ ： 回転機構（スピンチャックモータ）
Ｗ ： 基板（ウエハなど） 100: Substrate cleaning device 10: Substrate holder 11: Spin chuck (first substrate holder)
11a: Adsorption hole (for spin chuck)
12: Suction pad (second substrate holding means)
12a: Suction hole (for suction pad)
12p: Suction part 13: Support pin 20: Cleaning part 21, 21B, 21C, 21D: Brush part 21sp: Cleaning support member 21up: Upper brush member (first cleaning means)
21dw: Lower brush member (second cleaning means)
21Ar: Rotating mechanism 22: Cleaning bath unit 22up: Upper bus substrate (first cleaning bus)
22dw: Lower bus substrate (second cleaning bath)
23a, 23b: 1st nozzle, 2nd nozzle (for brush unit juxtaposition)
23c: 3rd nozzle (for brush shaft central axis)
24an: Air knife 24f: Liquid nozzle 24g: Gas nozzle 30: Case 31: Well beam 31a, 31b: First bridge beam, second bridge beam 31p: Pad support piece 31q: Washing bath support piece 32up: Upper cup 32upa: Upper Cup opening 32ud: Under cup 40: Drive unit (moving means)
41M: Rotating mechanism (for cleaning support member)
42M: Drive mechanism (motor)
42b: belt 42r: winding shaft 43S: lifting mechanism (slider)
43r: Slider rail 44M: Rotating mechanism (spin chuck motor)
W: Substrate (wafer, etc.)

Claims (12)

基板の裏面を洗浄する基板洗浄装置であって、
前記裏面の第１の領域に接触して、前記基板を保持する第１の基板保持手段と、
前記第１の領域以外の前記裏面の第２の領域に接触して、前記基板を保持する第２の基板保持手段と、
前記第１の基板保持手段又は前記第２の基板保持手段により保持された基板の裏面を洗浄する第１の洗浄手段と、
前記基板と接触する前記第２の基板保持手段の接触面を洗浄する第２の洗浄手段と
を有することを特徴とする基板洗浄装置。 A substrate cleaning apparatus for cleaning the back surface of a substrate,
First substrate holding means for holding the substrate in contact with the first region on the back surface;
A second substrate holding means for holding the substrate in contact with the second region on the back surface other than the first region;
First cleaning means for cleaning the back surface of the substrate held by the first substrate holding means or the second substrate holding means;
A substrate cleaning apparatus, comprising: a second cleaning unit that cleans a contact surface of the second substrate holding unit that contacts the substrate. 前記第１の洗浄手段は、第１のブラシ部材を有し、
前記第２の洗浄手段は、第２のブラシ部材を有し、
前記第１のブラシ部材は、前記裏面に接触することにより、該裏面を洗浄し、
前記第２のブラシ部材は、前記接触面に接触することにより、該接触面を洗浄する、
ことを特徴とする、請求項１に記載の基板洗浄装置。 The first cleaning means has a first brush member,
The second cleaning means has a second brush member,
The first brush member cleans the back surface by contacting the back surface,
The second brush member cleans the contact surface by contacting the contact surface;
The substrate cleaning apparatus according to claim 1, wherein: 前記第１の洗浄手段と前記第２の洗浄手段とは、一つの洗浄支持部材に固定され、
前記洗浄支持部材は、前記裏面に対向する該洗浄支持部材の一方の表面に前記第１の洗浄手段を搭載し、前記一方の表面の反対側の他方の表面に前記第２の洗浄手段を搭載している、
ことを特徴とする、請求項１又は２に記載の基板洗浄装置。 The first cleaning means and the second cleaning means are fixed to one cleaning support member,
The cleaning support member has the first cleaning means mounted on one surface of the cleaning support member facing the back surface, and the second cleaning means mounted on the other surface opposite to the one surface. doing,
The substrate cleaning apparatus according to claim 1, wherein the substrate cleaning apparatus is characterized. 前記第１の洗浄手段又は前記第２の洗浄手段に押圧され、前記第１の洗浄手段又は前記第２の洗浄手段と相対的に回転され得る、前記第１の洗浄手段及び前記第２の洗浄手段を洗浄する洗浄バス部を更に有することを特徴とする、請求項１乃至３に記載の基板洗浄装置。   The first cleaning means and the second cleaning means, which are pressed by the first cleaning means or the second cleaning means and can be rotated relative to the first cleaning means or the second cleaning means. 4. The substrate cleaning apparatus according to claim 1, further comprising a cleaning bath for cleaning the means. 前記洗浄バス部は、前記第１の洗浄手段を洗浄する第１の洗浄バスと、前記第２の洗浄手段を洗浄する第２の洗浄バスとを含むことを特徴とする、請求項４に記載の基板洗浄装置。   The said washing | cleaning bath part contains the 1st washing | cleaning bath which wash | cleans the said 1st washing | cleaning means, and the 2nd washing | cleaning bath which wash | cleans the said 2nd washing | cleaning means, It is characterized by the above-mentioned. Substrate cleaning equipment. 前記第１の洗浄手段及び前記第２の洗浄手段を移動する移動手段を有し、
前記移動手段は、前記第１の洗浄手段を前記基板の裏面に接触する該基板の下方に移動し、及び、前記第２の洗浄手段を前記第２の基板保持手段に接触する該第２の基板保持手段の上方に移動し、並びに、前記第１の洗浄手段を前記第１の洗浄バスに接触する位置に移動し、及び、前記第２の洗浄手段を前記第２の洗浄バスに接触する位置に移動する、
ことを特徴とする、請求項５に記載の基板洗浄装置。 Moving means for moving the first cleaning means and the second cleaning means;
The moving means moves the first cleaning means below the substrate that contacts the back surface of the substrate, and the second cleaning means contacts the second substrate holding means. Move above the substrate holding means, move the first cleaning means to a position in contact with the first cleaning bath, and contact the second cleaning means in the second cleaning bath. Move to position,
The substrate cleaning apparatus according to claim 5, wherein: 前記移動手段は、前記第１の洗浄手段及び前記第２の洗浄手段を回転する回転軸を有し、前記回転軸を中心に前記第１の洗浄手段及び前記第２の洗浄手段を移動することを特徴とする、請求項６に記載の基板洗浄装置。   The moving means has a rotating shaft that rotates the first cleaning means and the second cleaning means, and moves the first cleaning means and the second cleaning means about the rotating shaft. The substrate cleaning apparatus according to claim 6, wherein: 第２の基板保持手段を基板の裏面の第２の領域に接触させて、前記第２の基板保持手段により前記基板を略水平に保持する第１の基板保持工程と、
第１の領域を含む裏面の一部を洗浄する第１の基板洗浄工程と、
第１の基板保持手段を前記第１の領域に接触させて、前記第１の基板保持手段により前記基板を保持する第２の基板保持工程と、
前記第２の領域を含む裏面の一部を洗浄する第２の基板洗浄工程と、
前記裏面と接触する前記第２の基板保持手段の接触面を洗浄する基板保持手段洗浄工程と
を有することを特徴とする基板洗浄方法。 A first substrate holding step of bringing the second substrate holding means into contact with the second region on the back surface of the substrate and holding the substrate substantially horizontally by the second substrate holding means;
A first substrate cleaning step of cleaning a part of the back surface including the first region;
A second substrate holding step of bringing the first substrate holding means into contact with the first region and holding the substrate by the first substrate holding means;
A second substrate cleaning step of cleaning a part of the back surface including the second region;
And a substrate holding means cleaning step for cleaning the contact surface of the second substrate holding means that contacts the back surface. 前記第１の基板洗浄工程及び前記第２の基板洗浄工程は、第１の洗浄手段で前記裏面を洗浄し、
前記基板保持手段洗浄工程は、第２の洗浄手段で前記接触面を洗浄する、
ことを特徴とする、請求項８に記載の基板洗浄方法。 In the first substrate cleaning step and the second substrate cleaning step, the back surface is cleaned by a first cleaning means,
In the substrate holding means cleaning step, the contact surface is cleaned by a second cleaning means.
The substrate cleaning method according to claim 8, wherein: 前記第１の洗浄手段及び前記第２の洗浄手段を洗浄バス部で洗浄する洗浄手段洗浄工程を含むことを特徴とする、請求項９に記載の基板洗浄方法。   The substrate cleaning method according to claim 9, further comprising a cleaning unit cleaning step of cleaning the first cleaning unit and the second cleaning unit with a cleaning bath unit. 前記第１の基板洗浄工程及び前記第２の基板洗浄工程は、前記第１の洗浄手段と前記第２の洗浄手段とを搭載した洗浄支持部材を回転移動することにより、前記第１の洗浄手段を前記基板の下方の位置で、該基板の裏面に接触する位置に移動する第１の洗浄手段移動工程を含み、
前記基板保持手段洗浄工程は、前記洗浄支持部材を回転移動することにより、前記第２の洗浄手段を前記第２の基板保持手段の上方の位置で、前記裏面に接触する該第２の基板保持手段の表面に接触する位置に移動する第２の洗浄手段移動工程を含み、
前記洗浄手段洗浄工程は、前記洗浄支持部材を回転移動することにより、前記第１の洗浄手段及び前記第２の洗浄手段を前記洗浄バス部に移動する洗浄バス部移動工程を含む、
ことを特徴とする、請求項１０に記載の基板洗浄方法。 In the first substrate cleaning step and the second substrate cleaning step, the first cleaning unit is configured by rotating and moving a cleaning support member on which the first cleaning unit and the second cleaning unit are mounted. A first cleaning means moving step of moving the substrate to a position in contact with the back surface of the substrate at a position below the substrate,
The substrate holding means cleaning step rotates the cleaning support member to bring the second cleaning means into contact with the back surface at a position above the second substrate holding means. A second cleaning means moving step for moving to a position in contact with the surface of the means,
The cleaning means cleaning step includes a cleaning bath portion moving step of moving the first cleaning means and the second cleaning means to the cleaning bath portion by rotating the cleaning support member.
The substrate cleaning method according to claim 10, wherein: 前記基板保持手段洗浄工程は、前記第２の洗浄手段を回転移動及び／又は前記第２の基板保持手段を平行移動することにより、前記第２の基板保持手段と第２の洗浄手段との相対的な位置関係を変化させる接触洗浄工程を含むことを特徴とする、請求項９乃至１２のいずれか一項に記載の基板洗浄方法。   In the substrate holding unit cleaning step, the second substrate holding unit and the second cleaning unit are relatively moved by rotating the second cleaning unit and / or moving the second substrate holding unit in parallel. The substrate cleaning method according to claim 9, further comprising a contact cleaning step of changing a general positional relationship.
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