CN117497401A - Wafer back surface cleaning method and device - Google Patents

Wafer back surface cleaning method and device Download PDF

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Publication number
CN117497401A
CN117497401A CN202410000335.7A CN202410000335A CN117497401A CN 117497401 A CN117497401 A CN 117497401A CN 202410000335 A CN202410000335 A CN 202410000335A CN 117497401 A CN117497401 A CN 117497401A
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CN
China
Prior art keywords
wafer
back surface
cleaning
cleaning brush
center
Prior art date
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Pending
Application number
CN202410000335.7A
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Chinese (zh)
Inventor
王冲
汪钢
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Ningbo All Semi Micro Electronics Equipment Co ltd
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Ningbo All Semi Micro Electronics Equipment Co ltd
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Publication date
Application filed by Ningbo All Semi Micro Electronics Equipment Co ltd filed Critical Ningbo All Semi Micro Electronics Equipment Co ltd
Priority to CN202410000335.7A priority Critical patent/CN117497401A/en
Publication of CN117497401A publication Critical patent/CN117497401A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides a wafer back surface cleaning method and device, wherein the wafer back surface cleaning method comprises the following steps: adsorbing the wafer on a wafer bearing table; the first nozzle on the back of the wafer sprays cleaning liquid on the back of the wafer, and the wafer bearing table controls the wafer to rotate; moving a cleaning brush to enable the cleaning brush to contact the back surface of the wafer to be close to the edge of the wafer so as to clean the peripheral area of the back surface of the wafer; after the peripheral area of the back surface of the wafer is cleaned, the wafer moving device conveys the wafer to the cleaning brush, so that the center of the cleaning brush is aligned with the center of the wafer; the cleaning brush rotates to clean the central area of the back surface of the wafer; after the cleaning of the central area of the back surface of the wafer is completed, the wafer moving device conveys the wafer to the wafer carrying table, so that the center of the wafer carrying table is aligned with the center of the wafer; and taking out the cleaned wafer. The invention solves the problem that the cleaning of the central area of the back surface of the wafer is inconvenient.

Description

Wafer back surface cleaning method and device
Technical Field
The invention relates to the technical field of wafers, in particular to a wafer back surface cleaning method and device.
Background
Wafer cleaning refers to the process of cleaning the surface of a wafer by a solvent or a cleaning agent and the like in the wet etching and processing processes of the wafer so as to remove impurities on the surface of the wafer.
In the prior art, a cleaning process for a wafer surface is generally to rinse the wafer surface with a cleaning agent to remove residual processing materials, chemicals, etc., such as photoresist, etc., on the wafer surface. When cleaning the back surface of the wafer, the wafer needs to be fixed on the wafer carrying table, so that the cleaning of the central area of the back surface of the wafer is inconvenient.
Disclosure of Invention
The problem addressed by the present invention is that it is inconvenient to clean the central area of the wafer backside.
In order to solve the above problems, the present invention provides a wafer back surface cleaning method, including: adsorbing the wafer on a wafer bearing table; the first nozzle on the back of the wafer sprays cleaning liquid on the back of the wafer, and the wafer bearing table controls the wafer to rotate; moving a cleaning brush to enable the cleaning brush to contact the back surface of the wafer to be close to the edge of the wafer so as to clean the peripheral area of the back surface of the wafer; after the peripheral area of the back surface of the wafer is cleaned, the wafer moving device conveys the wafer to the cleaning brush, so that the center of the cleaning brush is aligned with the center of the wafer; the cleaning brush rotates to clean the central area of the back surface of the wafer; after the cleaning of the central area of the back surface of the wafer is completed, the wafer moving device conveys the wafer to the wafer carrying table, so that the center of the wafer carrying table is aligned with the center of the wafer; and taking out the cleaned wafer.
The technical effect achieved after the technical scheme is adopted is as follows: the wafer is adsorbed on the wafer bearing table, and can stably rotate along with the wafer bearing table, and the peripheral area of the back surface of the wafer is uniformly washed under the washing of the cleaning liquid; the cleaning brush is used for assisting in brushing the peripheral area of the back surface of the wafer, so that the cleaning effect is further improved; the wafer is taken out from the wafer carrying table, so that the central area of the back surface of the wafer is conveniently cleaned, and the situation that when the central area of the back surface of the wafer is cleaned, a large amount of cleaning liquid is positioned on the top surface of the wafer carrying table or enters a vacuumizing port or a rotating device affecting the bottom of the wafer carrying table is avoided, so that the normal operation of the wafer carrying table is ensured; the center of the wafer is aligned with the center of the cleaning brush, the cleaning brush does not need to move, and the central area of the wafer can be efficiently cleaned.
Further, the moving the cleaning brush to make the cleaning brush contact the back of the wafer at a position close to the edge of the wafer specifically includes: the driving device controls the cleaning brush to move, and the cleaning brush is moved from the lower part of the moisturizing device to a position of the back surface of the wafer close to the edge of the wafer.
The technical effect achieved after the technical scheme is adopted is as follows: the moisturizing device can keep the cleaning brush in a wet state, so that when the cleaning brush can directly perform rotary cleaning after contacting the back surface of the wafer, the wafer cannot be worn by the cleaning brush even if jet of cleaning liquid and rotation of the cleaning brush have time difference.
Further, after the cleaning of the peripheral area of the back surface of the wafer is completed, the wafer back surface cleaning method further includes: and after the rotating speed of the wafer bearing table is increased and the operation is continued for t1 time, stopping the rotation of the wafer bearing table.
The technical effect achieved after the technical scheme is adopted is as follows: the rotating speed of the wafer bearing table is increased, so that residual liquid beads positioned in the peripheral side area of the back surface of the wafer can be removed rapidly, the wafer is spin-dried, and waste carried by the liquid beads is discharged; in addition, when the wafer moving device supports the wafer, the residual liquid beads in the peripheral area do not drop on the top surface of the wafer carrying table or even enter the vacuumizing port of the wafer carrying table, so that the normal operation of the wafer carrying table is ensured.
Further, the wafer moving device conveys the wafer to the cleaning brush, so that the center of the cleaning brush is aligned with the center of the wafer, and the wafer moving device specifically comprises: the wafer moving device is contacted with the back surface of the wafer and adsorbs the back surface of the wafer; the wafer bearing table releases the adsorption of the wafer; and the wafer moving device lifts and conveys the wafer to the cleaning brush, so that the back surface of the wafer is controlled to be contacted with the cleaning brush after the center of the cleaning brush is aligned with the center of the wafer.
The technical effect achieved after the technical scheme is adopted is as follows: the wafer moving device can be stably connected with the wafer in an adsorption mode, and can further support the wafer when adsorbing the back of the wafer, so that the wafer can be conveyed more stably.
Further, the first nozzle on the back of the wafer sprays cleaning solution to the back of the wafer, and the wafer bearing table controls the wafer to rotate, and meanwhile, the method for cleaning the back of the wafer further comprises the following steps: the air curtain device sprays the drying air to the range of the distance from the back surface of the wafer to the center L1 of the wafer so as to maintain the drying environment of the center area of the back surface of the wafer.
The technical effect achieved after the technical scheme is adopted is as follows: the air curtain device can keep the range of the distance from the back surface of the wafer to the center L1 of the wafer dry, blow away liquid, and prevent liquid such as cleaning liquid from entering the vacuumizing port in the center of the wafer bearing table.
Further, after the cleaning of the central area of the back surface of the wafer is completed, the wafer moving device conveys the wafer to the wafer carrying table, so that the center of the wafer carrying table is aligned with the center of the wafer, and the method specifically comprises the following steps: the wafer moving device conveys the wafer to the wafer carrying table, and the air curtain device continuously sprays dry air to the back of the wafer in the moving process of the wafer moving device until the center of the wafer carrying table is aligned with the center of the wafer.
The technical effect achieved after the technical scheme is adopted is as follows: in the moving process of the wafer moving device, the air curtain device can blow the cleaned central area on the back of the wafer to dry, residual waste liquid is blown away, and the phenomenon that liquid enters the vacuumizing hole of the wafer carrying table due to the fact that liquid is remained on the back of the wafer when the wafer is conveyed to the wafer carrying table is avoided.
Further, the step of taking out the cleaned wafer specifically includes: after the center of the wafer bearing table is aligned with the center of the wafer, the thimble assembly jacks up the wafer, so that the back surface of the wafer is separated from the wafer moving device, and the wafer is taken out by the manipulator.
The technical effect achieved after the technical scheme is adopted is as follows: the thimble can separate the wafer and the wafer moving device fast, so that the wafer is separated from the adsorbed state, the thimble can keep the wafer stable, and the wafer can be taken away by the mechanical arm without larger force, thereby avoiding the wafer from being clamped and broken.
Further, the wafer back surface cleaning device is configured to implement the wafer back surface cleaning method according to any one of the above-mentioned embodiments, where the wafer back surface cleaning device includes: the wafer bearing table is used for bearing and adsorbing the wafer and controlling the wafer to rotate; the first nozzle is arranged on the periphery of the wafer carrying table and is used for spraying cleaning liquid to the back surface of the wafer; the cleaning brush is positioned on one side of the wafer bearing table; the driving device is used for controlling the cleaning brush to move or rotate; and the wafer moving device is positioned on at least one side of the wafer carrying table and is used for controlling carrying or adsorbing the wafer and controlling the wafer to move between the wafer carrying table and the cleaning brush.
The technical effect achieved after the technical scheme is adopted is as follows: the wafer back surface cleaning device can realize a wafer back surface cleaning method and achieve one or more of the technical effects; specifically, the wafer back surface cleaning device can control the wafer to rotate after fixing the wafer through the wafer bearing table, so that the cleaning solution can be conveniently sprayed by the first nozzle and contacted with the cleaning brush, and the cleaning effect of the peripheral side area of the back surface of the wafer is improved; the wafer moving device adsorbs and moves the wafer to the cleaning brush, and the cleaning brush cleans the central area of the back of the wafer, so that the wafer is comprehensively cleaned, and waste liquid which is cleaned during the cleaning of the central area is prevented from entering.
Further, the wafer back cleaning device further comprises: the liquid receiving groove is positioned below the cleaning brush; when the driving device controls the cleaning brush to move to the peripheral side of the back surface of the wafer, or the wafer moves to the upper side of the cleaning brush through the wafer moving device, the cleaning brush is always positioned above the liquid receiving groove.
The technical effect achieved after the technical scheme is adopted is as follows: the liquid receiving groove is used for receiving the waste liquid which is dropped when the cleaning brush brushes the back surface of the wafer; when the cleaning brush brushes the peripheral side area of the wafer, the cleaning brush is positioned above the liquid receiving groove, and correspondingly, the brushed side of the back of the wafer is also positioned above the liquid receiving groove, so that the waste liquid can be better received; when the cleaning brush brushes the central area of the back surface of the wafer, the center of the back surface of the wafer moves to the upper part of the cleaning brush, and the center of the back surface of the wafer is also above the liquid receiving groove, so that the waste liquid after cleaning can enter the liquid receiving groove to be collected, and the waste liquid is prevented from polluting a vacuumizing port of the wafer bearing table or a rotating device at the bottom of the wafer bearing table.
Further, the wafer back cleaning device further comprises: and the air curtain device is positioned at the bottom or the periphery of the wafer carrying table and is used for spraying dry gas to the circumferential direction so as to keep at least part of the back surface of the wafer dry.
The technical effect achieved after the technical scheme is adopted is as follows: when the peripheral side area of the wafer is cleaned, the air curtain device can dry the central area of the back surface of the wafer, and liquid such as cleaning liquid is prevented from entering the vacuumizing port in the center of the wafer bearing table; in the moving process of the wafer moving device, the air curtain device can blow and dry the central area of the back surface of the wafer, which is cleaned, and residual waste liquid is blown away.
In summary, each of the above technical solutions of the present application may have one or more of the following advantages or beneficial effects: i) The cleaning brush is used for assisting in brushing the peripheral area of the back surface of the wafer, and the cleaning effect can be further improved by combining the cleaning liquid; ii) taking the wafer out of the wafer carrying table, so that the central area of the back surface of the wafer is conveniently cleaned, and the situation that a large amount of cleaning liquid is positioned on the top surface of the wafer carrying table or enters a vacuumizing port or a rotating device affecting the bottom of the wafer carrying table when the central area of the back surface of the wafer is cleaned is avoided, so that the normal operation of the wafer carrying table is ensured; iii) The air curtain device can dry the central area of the back of the wafer, prevent liquids such as cleaning liquid from entering the vacuumizing port in the center of the wafer bearing table, and blow-dry the central area of the back of the wafer, which is cleaned, and blow away residual waste liquid.
Drawings
FIG. 1 is a flowchart of a method for cleaning a back surface of a wafer according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a wafer backside cleaning device according to an embodiment of the present invention;
FIG. 3 is a schematic view illustrating an internal structure of the wafer backside cleaning apparatus in FIG. 2;
FIG. 4 is a schematic diagram of the wafer moving apparatus of FIG. 2;
FIG. 5 is a schematic view showing the structure of the washing brush of FIG. 2;
fig. 6 is a cross-sectional view of the wafer carrier of fig. 2.
Reference numerals illustrate:
100-a wafer back surface cleaning device; 110-wafer carrier; 111-a vacuumizing port; 120-a first nozzle; 130-cleaning brush; 140-a driving device; 150-a wafer moving device; 151-linear motion assembly; 152-supporting a tray; 153-a liquid shield; 160-liquid receiving groove; 170-an air curtain device; 171-an inner plate; 172-outer plates; 173-an air curtain passage; 180-a housing; 181-side plates; 182-top plate; 190-a moisturizing device; 210-cleaning a nozzle on the front surface of the wafer; 220-liquid receiving box.
Detailed Description
The invention aims to provide a wafer back surface cleaning method which is used for realizing the effect of conveniently cleaning a central area of a wafer back surface.
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
Referring to fig. 1 to 6, an embodiment of the present invention provides a wafer back surface cleaning method, including:
adsorbing the wafer on a wafer bearing table;
the first nozzle on the back of the wafer sprays cleaning liquid on the back of the wafer, and the wafer bearing table controls the wafer to rotate;
moving the cleaning brush to enable the cleaning brush to contact the back surface of the wafer to be close to the edge of the wafer so as to clean the peripheral area of the back surface of the wafer;
after the peripheral area of the back surface of the wafer is cleaned, the wafer moving device conveys the wafer to the cleaning brush, so that the center of the cleaning brush is aligned with the center of the wafer;
the cleaning brush rotates to clean the central area of the back surface of the wafer;
after the cleaning of the central area of the back surface of the wafer is completed, the wafer moving device conveys the wafer to the wafer carrying table, so that the center of the wafer carrying table is aligned with the center of the wafer;
and taking out the cleaned wafer.
In the embodiment, the wafer is adsorbed on the wafer bearing table, and can stably rotate along with the wafer bearing table, so that the peripheral area of the back surface of the wafer is uniformly washed under the washing of the cleaning liquid; the cleaning brush is used for assisting in brushing the peripheral area of the back surface of the wafer, so that the cleaning effect is further improved; the wafer is taken out from the wafer carrying table, so that the central area of the back surface of the wafer is conveniently cleaned, and the situation that when the central area of the back surface of the wafer is cleaned, a large amount of cleaning liquid is positioned on the top surface of the wafer carrying table or enters a vacuumizing port or a rotating device affecting the bottom of the wafer carrying table is avoided, so that the normal operation of the wafer carrying table is ensured; the center of the wafer is aligned with the center of the cleaning brush, the cleaning brush does not need to move, and the central area of the wafer can be efficiently cleaned.
In a specific embodiment, moving the brush to contact the back of the wafer near the edge of the wafer specifically includes: the driving device controls the cleaning brush to move, and the cleaning brush is moved from the lower part of the moisturizing device to a position close to the edge of the wafer.
The moisturizing device can keep the cleaning brush in a wet state, so that when the cleaning brush can directly perform rotary cleaning after contacting the back surface of the wafer, the wafer is not worn by the cleaning brush even if jet of cleaning liquid and rotation of the cleaning brush have time difference.
Preferably, the cleaning brush has bristles, and the bottom of the moisturizing device has an opening for receiving the bristles, and the bristles of the cleaning brush extend into the opening to achieve a wet state. The drive means extend the bristles of the brush into or out of the opening of the moisturizing means, for example by lifting or lowering, for example by rotating arms or translating the brush to a position where the back of the wafer is close to the edge of the wafer.
Preferably, the brush bristles of the cleaning brush are distributed along the radial direction and are brushed at the peripheral side area of the back surface of the wafer in a rotating mode, so that fan-shaped brushing is realized, and the cleaning efficiency is improved.
Preferably, the peripheral area of the back of the wafer is cleaned, and the front of the wafer can be cleaned, specifically, the front cleaning nozzle of the wafer firstly sucks cleaning liquid from the liquid receiving box through the nozzle lifting device, then the cleaning liquid is sprayed to the front of the wafer through the rotation arm rotating to the upper part of the wafer bearing table, so that the double-sided cleaning of the wafer is realized.
In a specific embodiment, after the cleaning of the peripheral area of the wafer back surface is completed, the wafer back surface cleaning method further includes: after the rotating speed of the wafer carrying platform is increased and the operation is continued for t1 time, the wafer carrying platform stops rotating.
The rotating speed of the wafer bearing table is increased, so that residual liquid beads in the peripheral side area of the back surface of the wafer can be removed rapidly, the wafer is spin-dried, and waste carried by the liquid beads is discharged; in addition, when the wafer moving device supports the wafer, the residual liquid beads in the peripheral area do not drop on the top surface of the wafer carrying table or even enter the vacuumizing port of the wafer carrying table, so that the normal operation of the wafer carrying table is ensured.
Wherein, the value range of t1 is 2.5s to 5s.
In a specific embodiment, the wafer moving device conveys the wafer to the cleaning brush, so that the center of the cleaning brush is aligned with the center of the wafer, and specifically comprises: the wafer moving device is contacted with the back surface of the wafer and adsorbs the back surface of the wafer; the wafer bearing table releases the adsorption to the wafer; the wafer moving device lifts and conveys the wafer to the cleaning brush, and after the center of the cleaning brush is aligned with the center of the wafer, the back surface of the wafer is controlled to be contacted with the cleaning brush.
The wafer moving device can be stably connected with the wafer in an adsorption mode, and can further support the wafer when adsorbing the back surface of the wafer, so that the wafer can be conveyed more stably.
Preferably, the wafer moving device is capable of being supported on at least two opposite sides of the wafer and translated to one side of the wafer carrying platform so as to be conveyed to the upper part of the cleaning brush through the wafer.
In a specific embodiment, the first nozzle on the back surface of the wafer sprays the cleaning solution on the back surface of the wafer, and the wafer carrying platform controls the wafer to rotate, and meanwhile, the method for cleaning the back surface of the wafer further comprises the following steps: the air curtain device sprays the drying air to the range of the distance from the back surface of the wafer to the center L1 of the wafer so as to maintain the drying environment of the center area of the back surface of the wafer.
It should be noted that, the air curtain device can keep the drying of the distance range between the back of the wafer and the center L1 of the wafer, blow away the liquid, and avoid the liquid such as the cleaning liquid from entering the vacuum-pumping port in the center of the wafer carrying table.
Wherein the value range of L1 is 50mm to 150mm.
In one embodiment, after the cleaning of the central area of the back surface of the wafer is completed, the wafer moving device conveys the wafer to the wafer carrying platform, so that the center of the wafer carrying platform is aligned with the center of the wafer, and the method specifically comprises: the wafer moving device conveys the wafer to the wafer carrying table, and the air curtain device continuously sprays dry air to the back of the wafer in the moving process of the wafer moving device until the center of the wafer carrying table is aligned with the center of the wafer.
It should be noted that, in the moving process of the wafer moving device, the air curtain device can blow the cleaned central area on the back of the wafer to dry, and blow away the residual waste liquid, so as to avoid that the back of the wafer is still left with liquid when the wafer is conveyed to the wafer carrying table, so that the liquid enters the vacuumizing hole of the wafer carrying table.
In one embodiment, the method for removing the cleaned wafer comprises the following steps: after the center of the wafer bearing table is aligned with the center of the wafer, the thimble assembly jacks up the wafer, so that the back surface of the wafer is separated from the wafer moving device, and the wafer is taken out by the manipulator.
It should be noted that, the thimble can separate wafer and wafer mobile device fast, makes the wafer break away from the state of being adsorbed to the thimble can keep the steady of wafer, and the manipulator need not great power can take away the wafer, avoids the wafer to press from both sides garrulous.
Referring to fig. 2 to fig. 6, an embodiment of the present invention further provides a wafer backside cleaning apparatus 100 for implementing a wafer backside cleaning method according to any one of the above-mentioned technical solutions, where the wafer backside cleaning apparatus 100 includes: the wafer carrying table 110, the wafer carrying table 110 is used for carrying and adsorbing the wafer and controlling the wafer to rotate; the first nozzle 120, the first nozzle 120 is arranged on the circumference side of the wafer carrying platform 110, and is used for spraying cleaning liquid to the back surface of the wafer; a cleaning brush 130, the cleaning brush 130 being located at one side of the wafer stage 110; a driving device 140, wherein the driving device 140 is used for controlling the cleaning brush 130 to move or rotate; the wafer moving device 150 is located on at least one side of the wafer carrier 110, and is used for controlling the carrying or adsorbing of the wafer and controlling the movement of the wafer between the wafer carrier 110 and the cleaning brush 130.
It should be noted that, the wafer back surface cleaning apparatus 100 may implement a wafer back surface cleaning method, and achieve one or more of the above-mentioned technical effects; specifically, the wafer back surface cleaning apparatus 100 can control the wafer to rotate after the wafer is fixed by the wafer carrying table 110, so as to facilitate the contact of the first nozzle 120 to spray the cleaning solution and the contact of the cleaning brush 130, and improve the cleaning effect of the peripheral region of the wafer back surface; the wafer moving device 150 adsorbs and moves the wafer to the cleaning brush 130, and the cleaning brush 130 cleans the central area of the back surface of the wafer, thereby completing the overall cleaning of the wafer and avoiding the entry of waste cleaning liquid during the cleaning of the central area.
Preferably, the wafer carrier 110 has a vacuum port 111 in the center for exhausting air to secure the wafer to the wafer carrier 110.
Preferably, a rotating motor is arranged at the bottom of the wafer carrying table 110, so that the wafer carrying table 110 and the wafer can rotate, and the cleaning effect is improved.
Preferably, the wafer back surface cleaning device 100 further includes a wafer front surface cleaning nozzle 210 and a liquid receiving box 220, the wafer front surface cleaning nozzle 210 is located at one side of the wafer carrying table 110, the wafer front surface cleaning nozzle 210 sucks cleaning liquid from the liquid receiving box 220 through a nozzle lifting device, and then rotates to the upper side of the wafer carrying table through a rotating arm to spray the cleaning liquid on the front surface of the wafer, so that double-sided cleaning of the wafer is realized.
Preferably, the wafer backside cleaning apparatus 100 further comprises a housing 180, the housing 180 has two opposite side plates 181, wherein the wafer moving apparatus 150 includes two opposite linear motion assemblies 151 and a support tray 152, each side plate 181 is slidably connected to one linear motion assembly 151, the support tray 152 is fixed on a side of the linear motion assembly 151 facing the wafer support table, and the support tray 152 is used for supporting and adsorbing the wafer backside.
In a specific embodiment, the linear motion assembly 151 includes, for example, a linear guide for defining the direction of the support tray 152, and the linear motion assembly 151 further includes, for example, a timing belt assembly or a screw assembly for driving the support tray 152 to perform linear motion.
Further, the linear motion assembly 151 further includes, for example: the liquid blocking cover 153, two opposite sides of the liquid blocking groove are connected with the supporting tray 152; when the cleaning brush 130 rotates to clean the center area of the back surface of the wafer, the liquid blocking cover 153 moves along with the supporting tray 152 until the liquid blocking cover 153 surrounds the cleaning brush 130, so that liquid blocking is realized.
In one embodiment, the wafer backside cleaning apparatus 100 further comprises: a liquid receiving groove 160, wherein the liquid receiving groove 160 is positioned below the cleaning brush 130; when the driving device 140 controls the cleaning brush 130 to move to the peripheral side of the back surface of the wafer, or when the wafer moves above the cleaning brush 130 by the wafer moving device 150, the cleaning brush 130 is always located above the liquid receiving groove 160.
The liquid receiving tank 160 is used for receiving the waste liquid dropped when the cleaning brush 130 brushes the back surface of the wafer; when the cleaning brush 130 brushes the peripheral side area of the wafer, the cleaning brush 130 is positioned above the liquid receiving groove 160, and correspondingly, the brushed side of the back of the wafer is also positioned above the liquid receiving groove 160, so that the waste liquid can be better received; when the cleaning brush 130 brushes the central area of the back surface of the wafer, the center of the back surface of the wafer moves above the cleaning brush 130 and is also above the liquid receiving tank 160, so that the waste liquid after cleaning can also enter the liquid receiving tank 160 to be collected, and the waste liquid is prevented from polluting the vacuumizing port 111 of the wafer carrying table 110 or the rotating device at the bottom of the wafer carrying table 110.
In one embodiment, the wafer backside cleaning apparatus 100 further comprises: a moisturizing device 190; the housing 180 further includes a top plate 182, and a moisturizing device 190 secured to the top plate 182 and positioned above the sump 160. Wherein, the cleaning brush 130 cooperates with the moisturizing device 190, so that the wet state of the cleaning brush 130 can be maintained, the driving device 140 controls the cleaning brush 130 to move, the cleaning brush 130 is moved from the lower part of the moisturizing device 190 to a position close to the edge of the wafer, and the edge of the wafer is cleaned, so that friction between the cleaning brush 130 and the wafer can be reduced, and the abrasion of the back of the wafer is avoided.
Preferably, the cleaning brush 130 has at least one set of bristles arranged radially, and the bottom of the moisturizing device 190 has openings for receiving the bristles, which are matched to the distribution of the bristles, so that all the bristles can be moved by the driving device 140 and all the bristles can enter the openings of the moisturizing device 190 for infiltration.
In a specific embodiment, the driving device 140 includes: a brush rotating member, such as a motor or a motor combined with a pulley assembly, for controlling the brush 130 to rotate for cleaning, a brush lifting member, and a brush moving member; the cleaning brush lifter is, for example, a lifting cylinder for controlling the cleaning brush 130 to contact or separate from the moisturizing device 190; the brush moving member is, for example, a motor and a swing arm structure for moving the brush 130 from below the moisturizing device 190 to a position close to the wafer stage 110 or resetting to below the moisturizing device 190.
In one embodiment, the wafer backside cleaning apparatus 100 further comprises: and an air curtain device 170, wherein the air curtain device 170 is positioned at the bottom or the peripheral side of the wafer carrying platform 110 and is used for spraying the drying gas to the circumferential direction so as to keep at least part of the back surface of the wafer dry.
When the peripheral area of the wafer is cleaned, the air curtain device 170 may dry the central area of the back surface of the wafer, and prevent the liquid such as the cleaning liquid from entering the vacuum-pumping port 111 in the center of the wafer carrier 110; during the movement of the wafer moving device 150, the air curtain device 170 can blow the cleaned central area of the back surface of the wafer to dry, and blow away the residual waste liquid.
Preferably, the air curtain device 170 has an inner plate 171 and an outer plate 172, the inner plate 171 and the outer plate 172 encircle the wafer carrying table 110 and are mutually sleeved, an annular air curtain channel 173 is formed between the inner plate 171 and the outer plate 172, at least one side of the outer plate 172 is provided with an air delivery interface for delivering inert gas to the air curtain channel 173, the inert gas is uniformly distributed circumferentially through the annular air curtain channel 173, and then is sprayed out from air outlets at the tops of the inner plate 171 and the outer plate 172, a uniform air curtain is formed circumferentially on the wafer carrying table 110, and the effects of liquid blocking and drying are achieved.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.

Claims (8)

1. The wafer back surface cleaning method is characterized by comprising the following steps of:
adsorbing the wafer on a wafer bearing table;
the first nozzle on the back of the wafer sprays cleaning liquid on the back of the wafer, and the wafer bearing table controls the wafer to rotate;
moving a cleaning brush to enable the cleaning brush to contact the back surface of the wafer to be close to the edge of the wafer so as to clean the peripheral area of the back surface of the wafer;
after the peripheral area of the back surface of the wafer is cleaned, the wafer moving device conveys the wafer to the cleaning brush, so that the center of the cleaning brush is aligned with the center of the wafer;
the cleaning brush rotates to clean the central area of the back surface of the wafer;
after the cleaning of the central area of the back surface of the wafer is completed, the wafer moving device conveys the wafer to the wafer carrying table, so that the center of the wafer carrying table is aligned with the center of the wafer;
taking out the cleaned wafer;
after the peripheral area of the back surface of the wafer is cleaned, the wafer back surface cleaning method further comprises the following steps: after increasing the rotating speed of the wafer bearing table and continuously operating for t1 time, stopping rotating the wafer bearing table;
the wafer moving device conveys a wafer to the cleaning brush, so that the center of the cleaning brush is aligned with the center of the wafer, and the wafer moving device specifically comprises: the wafer moving device is contacted with the back surface of the wafer and adsorbs the back surface of the wafer; the wafer bearing table releases the adsorption of the wafer; and the wafer moving device lifts and conveys the wafer to the cleaning brush, so that the back surface of the wafer is controlled to be contacted with the cleaning brush after the center of the cleaning brush is aligned with the center of the wafer.
2. The method of claim 1, wherein the moving the brush to contact the brush with the back of the wafer at a position near the edge of the wafer comprises:
the driving device controls the cleaning brush to move, and the cleaning brush is moved from the lower part of the moisturizing device to a position of the back surface of the wafer close to the edge of the wafer.
3. The method of claim 1, wherein the first nozzle on the back side sprays cleaning fluid to the back side of the wafer while the wafer carrier controls the wafer to rotate, and further comprising:
the air curtain device sprays the drying air to the range of the distance from the back surface of the wafer to the center L1 of the wafer so as to maintain the drying environment of the center area of the back surface of the wafer.
4. The method of claim 1, wherein after the cleaning of the central area of the wafer back surface is completed, the wafer moving device conveys the wafer onto the wafer carrier so that the center of the wafer carrier is aligned with the center of the wafer, and the method specifically comprises:
the wafer moving device conveys the wafer to the wafer carrying table, and the air curtain device continuously sprays dry air to the back of the wafer in the moving process of the wafer moving device until the center of the wafer carrying table is aligned with the center of the wafer.
5. The method for cleaning the back surface of a wafer according to claim 4, wherein the step of taking out the cleaned wafer comprises:
after the center of the wafer bearing table is aligned with the center of the wafer, the thimble assembly jacks up the wafer, so that the back surface of the wafer is separated from the wafer moving device, and the wafer is taken out by the manipulator.
6. A wafer backside cleaning apparatus for implementing the wafer backside cleaning method according to any one of claims 1 to 5, wherein the wafer backside cleaning apparatus comprises:
the wafer bearing table is used for bearing and adsorbing the wafer and controlling the wafer to rotate;
the first nozzle is arranged on the periphery of the wafer carrying table and is used for spraying cleaning liquid to the back surface of the wafer;
the cleaning brush is positioned on one side of the wafer bearing table;
the driving device is used for controlling the cleaning brush to move or rotate;
and the wafer moving device is positioned on at least one side of the wafer carrying table and is used for controlling carrying or adsorbing the wafer and controlling the wafer to move between the wafer carrying table and the cleaning brush.
7. The wafer back-side cleaning apparatus according to claim 6, further comprising: the liquid receiving groove is positioned below the cleaning brush;
when the driving device controls the cleaning brush to move to the peripheral side of the back surface of the wafer, or the wafer moves to the upper side of the cleaning brush through the wafer moving device, the cleaning brush is always positioned above the liquid receiving groove.
8. The wafer back-side cleaning apparatus according to claim 6, further comprising: and the air curtain device is positioned at the bottom or the periphery of the wafer carrying table and is used for spraying dry gas to the circumferential direction so as to keep at least part of the back surface of the wafer dry.
CN202410000335.7A 2024-01-02 2024-01-02 Wafer back surface cleaning method and device Pending CN117497401A (en)

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CN216213290U (en) * 2021-10-28 2022-04-05 上海华力微电子有限公司 Wafer cleaning device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101207007A (en) * 2006-12-20 2008-06-25 东京毅力科创株式会社 Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
JP2008177541A (en) * 2006-12-20 2008-07-31 Tokyo Electron Ltd Substrate cleaning apparatus, method for cleaning substrate, and computer-readable storage medium
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