SG11201908381RA - Substrate polishing device and substrate polishing method - Google Patents

Substrate polishing device and substrate polishing method

Info

Publication number
SG11201908381RA
SG11201908381RA SG11201908381RA SG11201908381RA SG 11201908381R A SG11201908381R A SG 11201908381RA SG 11201908381R A SG11201908381R A SG 11201908381RA SG 11201908381R A SG11201908381R A SG 11201908381RA
Authority
SG
Singapore
Prior art keywords
polishing
substrate
substrate polishing
polishing device
conditioning
Prior art date
Application number
Other languages
English (en)
Inventor
Hozumi Yasuda
Itsuki Kobata
Nobuyuki Takahashi
Suguru Sakugawa
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201908381RA publication Critical patent/SG11201908381RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
SG11201908381R 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method SG11201908381RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法
PCT/JP2018/000233 WO2018173421A1 (ja) 2017-03-22 2018-01-10 基板の研磨装置および研磨方法

Publications (1)

Publication Number Publication Date
SG11201908381RA true SG11201908381RA (en) 2019-10-30

Family

ID=63584243

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201908381R SG11201908381RA (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method

Country Status (7)

Country Link
US (1) US20200269383A1 (enExample)
JP (1) JP6884015B2 (enExample)
KR (1) KR102482181B1 (enExample)
CN (1) CN110461542A (enExample)
SG (1) SG11201908381RA (enExample)
TW (1) TWI763765B (enExample)
WO (1) WO2018173421A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250085835A (ko) * 2018-12-19 2025-06-12 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7387471B2 (ja) * 2020-02-05 2023-11-28 株式会社荏原製作所 基板処理装置および基板処理方法
KR102781684B1 (ko) * 2021-02-26 2025-03-18 주식회사 케이씨텍 기판 이송 시스템

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JPH0818241B2 (ja) * 1987-03-19 1996-02-28 キヤノン株式会社 研磨工具の製造方法
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US6478977B1 (en) * 1995-09-13 2002-11-12 Hitachi, Ltd. Polishing method and apparatus
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP3011168B2 (ja) * 1997-12-19 2000-02-21 日本電気株式会社 半導体基板研磨装置
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JPH11320384A (ja) * 1998-05-13 1999-11-24 Sony Corp 化学的機械研磨方法及びこれを使った化学的機械研磨装置
JP2001054864A (ja) * 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
US6227956B1 (en) * 1999-10-28 2001-05-08 Strasbaugh Pad quick release device for chemical mechanical polishing
JP2001170856A (ja) * 1999-12-14 2001-06-26 Kawasaki Heavy Ind Ltd 曲面仕上げ装置
JP2002018662A (ja) * 2000-06-30 2002-01-22 Toshiba Mach Co Ltd 磨き加工用工具
JP3762248B2 (ja) * 2001-04-24 2006-04-05 キヤノン株式会社 回折光学素子用金型加工方法
US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
JP2009246240A (ja) * 2008-03-31 2009-10-22 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置
US8915768B2 (en) * 2008-07-31 2014-12-23 Mitsubishi Heavy Industries, Ltd. Method of phasing threaded grinding stone, as well as device therefor
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP2010076080A (ja) * 2008-09-29 2010-04-08 Nikon Corp 研磨装置および研磨方法
JP5589427B2 (ja) * 2010-02-19 2014-09-17 株式会社ジェイテクト カップ型ドレッサ及びツルーイング・ドレッシング方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
EP3053704A4 (en) * 2013-10-04 2017-07-19 Fujimi Incorporated Polishing device, processing method of polishing member, modification method of polishing member, shape processing cutting tool, and surface modification tool
JP6454326B2 (ja) * 2014-04-18 2019-01-16 株式会社荏原製作所 基板処理装置、基板処理システム、および基板処理方法
JP2015205359A (ja) * 2014-04-18 2015-11-19 株式会社荏原製作所 基板処理装置
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
CN205363593U (zh) * 2016-02-22 2016-07-06 中芯国际集成电路制造(北京)有限公司 一种研磨垫调整器
KR102535628B1 (ko) * 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
JP2018134710A (ja) * 2017-02-22 2018-08-30 株式会社荏原製作所 基板の研磨装置および研磨方法

Also Published As

Publication number Publication date
KR102482181B1 (ko) 2022-12-29
JP6884015B2 (ja) 2021-06-09
CN110461542A (zh) 2019-11-15
JP2018158399A (ja) 2018-10-11
TW201834786A (zh) 2018-10-01
KR20190131501A (ko) 2019-11-26
TWI763765B (zh) 2022-05-11
US20200269383A1 (en) 2020-08-27
WO2018173421A1 (ja) 2018-09-27

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