KR102482181B1 - 기판의 연마 장치 및 연마 방법 - Google Patents

기판의 연마 장치 및 연마 방법 Download PDF

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Publication number
KR102482181B1
KR102482181B1 KR1020197028236A KR20197028236A KR102482181B1 KR 102482181 B1 KR102482181 B1 KR 102482181B1 KR 1020197028236 A KR1020197028236 A KR 1020197028236A KR 20197028236 A KR20197028236 A KR 20197028236A KR 102482181 B1 KR102482181 B1 KR 102482181B1
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South Korea
Prior art keywords
polishing
substrate
conditioning
polishing pad
partial
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KR1020197028236A
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English (en)
Korean (ko)
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KR20190131501A (ko
Inventor
호즈미 야스다
이츠키 고바타
노부유키 다카하시
스구루 사쿠가와
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
KR1020197028236A 2017-03-22 2018-01-10 기판의 연마 장치 및 연마 방법 Active KR102482181B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法
JPJP-P-2017-055976 2017-03-22
PCT/JP2018/000233 WO2018173421A1 (ja) 2017-03-22 2018-01-10 基板の研磨装置および研磨方法

Publications (2)

Publication Number Publication Date
KR20190131501A KR20190131501A (ko) 2019-11-26
KR102482181B1 true KR102482181B1 (ko) 2022-12-29

Family

ID=63584243

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KR1020197028236A Active KR102482181B1 (ko) 2017-03-22 2018-01-10 기판의 연마 장치 및 연마 방법

Country Status (7)

Country Link
US (1) US20200269383A1 (enExample)
JP (1) JP6884015B2 (enExample)
KR (1) KR102482181B1 (enExample)
CN (1) CN110461542A (enExample)
SG (1) SG11201908381RA (enExample)
TW (1) TWI763765B (enExample)
WO (1) WO2018173421A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250085835A (ko) * 2018-12-19 2025-06-12 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7387471B2 (ja) * 2020-02-05 2023-11-28 株式会社荏原製作所 基板処理装置および基板処理方法
KR102781684B1 (ko) * 2021-02-26 2025-03-18 주식회사 케이씨텍 기판 이송 시스템

Citations (6)

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JP2001054864A (ja) 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
JP2002321146A (ja) 2001-04-24 2002-11-05 Canon Inc 回折光学素子用金型加工方法
JP2010076080A (ja) 2008-09-29 2010-04-08 Nikon Corp 研磨装置および研磨方法
JP2011167813A (ja) 2010-02-19 2011-09-01 Jtekt Corp カップ型ドレッサ及びツルーイング・ドレッシング方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
WO2015050185A1 (ja) 2013-10-04 2015-04-09 株式会社 フジミインコーポレーテッド 研磨装置、研磨部材の加工方法、研磨部材の修正方法、形状加工用切削工具及び表面修正用工具

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JPH0818241B2 (ja) * 1987-03-19 1996-02-28 キヤノン株式会社 研磨工具の製造方法
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US6478977B1 (en) * 1995-09-13 2002-11-12 Hitachi, Ltd. Polishing method and apparatus
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP3011168B2 (ja) * 1997-12-19 2000-02-21 日本電気株式会社 半導体基板研磨装置
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JPH11320384A (ja) * 1998-05-13 1999-11-24 Sony Corp 化学的機械研磨方法及びこれを使った化学的機械研磨装置
US6227956B1 (en) * 1999-10-28 2001-05-08 Strasbaugh Pad quick release device for chemical mechanical polishing
JP2001170856A (ja) * 1999-12-14 2001-06-26 Kawasaki Heavy Ind Ltd 曲面仕上げ装置
JP2002018662A (ja) * 2000-06-30 2002-01-22 Toshiba Mach Co Ltd 磨き加工用工具
US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
JP2009246240A (ja) * 2008-03-31 2009-10-22 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置
US8915768B2 (en) * 2008-07-31 2014-12-23 Mitsubishi Heavy Industries, Ltd. Method of phasing threaded grinding stone, as well as device therefor
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
JP6454326B2 (ja) * 2014-04-18 2019-01-16 株式会社荏原製作所 基板処理装置、基板処理システム、および基板処理方法
JP2015205359A (ja) * 2014-04-18 2015-11-19 株式会社荏原製作所 基板処理装置
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
CN205363593U (zh) * 2016-02-22 2016-07-06 中芯国际集成电路制造(北京)有限公司 一种研磨垫调整器
KR102535628B1 (ko) * 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
JP2018134710A (ja) * 2017-02-22 2018-08-30 株式会社荏原製作所 基板の研磨装置および研磨方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001054864A (ja) 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
JP2002321146A (ja) 2001-04-24 2002-11-05 Canon Inc 回折光学素子用金型加工方法
JP2010076080A (ja) 2008-09-29 2010-04-08 Nikon Corp 研磨装置および研磨方法
JP2011167813A (ja) 2010-02-19 2011-09-01 Jtekt Corp カップ型ドレッサ及びツルーイング・ドレッシング方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
WO2015050185A1 (ja) 2013-10-04 2015-04-09 株式会社 フジミインコーポレーテッド 研磨装置、研磨部材の加工方法、研磨部材の修正方法、形状加工用切削工具及び表面修正用工具

Also Published As

Publication number Publication date
SG11201908381RA (en) 2019-10-30
JP6884015B2 (ja) 2021-06-09
CN110461542A (zh) 2019-11-15
JP2018158399A (ja) 2018-10-11
TW201834786A (zh) 2018-10-01
KR20190131501A (ko) 2019-11-26
TWI763765B (zh) 2022-05-11
US20200269383A1 (en) 2020-08-27
WO2018173421A1 (ja) 2018-09-27

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