SG11201906975PA - Structure for rf use - Google Patents

Structure for rf use

Info

Publication number
SG11201906975PA
SG11201906975PA SG11201906975PA SG11201906975PA SG11201906975PA SG 11201906975P A SG11201906975P A SG 11201906975PA SG 11201906975P A SG11201906975P A SG 11201906975PA SG 11201906975P A SG11201906975P A SG 11201906975PA SG 11201906975P A SG11201906975P A SG 11201906975PA
Authority
SG
Singapore
Prior art keywords
layer
dielectric layer
front surface
support substrate
electrode
Prior art date
Application number
SG11201906975PA
Other languages
English (en)
Inventor
Eric Desbonnets
Bernard Aspar
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11201906975PA publication Critical patent/SG11201906975PA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841Barrier, adhesion or liner layers
    • H01L21/76843Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76846Layer combinations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/66772Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78612Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
    • H01L29/78615Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect with a body contact
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Waveguides (AREA)
  • Physical Vapour Deposition (AREA)
SG11201906975PA 2017-02-02 2018-01-29 Structure for rf use SG11201906975PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1750870A FR3062517B1 (fr) 2017-02-02 2017-02-02 Structure pour application radiofrequence
PCT/FR2018/050196 WO2018142052A1 (fr) 2017-02-02 2018-01-29 Structure pour application radiofréquence

Publications (1)

Publication Number Publication Date
SG11201906975PA true SG11201906975PA (en) 2019-08-27

Family

ID=58779151

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201906975PA SG11201906975PA (en) 2017-02-02 2018-01-29 Structure for rf use

Country Status (9)

Country Link
US (3) US11043756B2 (ko)
EP (1) EP3577683B1 (ko)
JP (1) JP7098851B2 (ko)
KR (1) KR102520751B1 (ko)
CN (1) CN110235238B (ko)
FR (1) FR3062517B1 (ko)
SG (1) SG11201906975PA (ko)
TW (1) TWI764978B (ko)
WO (1) WO2018142052A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3086096B1 (fr) * 2018-09-14 2021-08-27 Soitec Silicon On Insulator Procede de realisation d'un substrat avance pour une integration hybride
FR3091010B1 (fr) * 2018-12-24 2020-12-04 Soitec Silicon On Insulator Structure de type semi-conducteur pour applications digitales et radiofréquences, et procédé de fabrication d’une telle structure
FR3091004B1 (fr) * 2018-12-24 2020-12-04 Soitec Silicon On Insulator Structure de type semi-conducteur pour applications digitales et radiofréquences
US11271079B2 (en) * 2020-01-15 2022-03-08 Globalfoundries U.S. Inc. Wafer with crystalline silicon and trap rich polysilicon layer
TWI761255B (zh) 2021-07-08 2022-04-11 環球晶圓股份有限公司 晶圓及晶圓的製造方法
FR3136325A1 (fr) * 2022-06-02 2023-12-08 Soitec Dispositif a ondes elastiques de surface

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0159601A3 (de) * 1984-04-10 1987-08-19 Hartwig Wolfgang Prof.Dr. Thim Logik-Schaltungsanordnung mit dazu angepasst ausgebildeten Feldeffekt-Transistoren
US5841623A (en) * 1995-12-22 1998-11-24 Lam Research Corporation Chuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing system
JPH1041512A (ja) * 1996-07-23 1998-02-13 Denso Corp 半導体装置
JP2000058844A (ja) * 1998-08-10 2000-02-25 Denso Corp 半導体装置及び半導体装置の製造方法
JP2004207271A (ja) * 2002-12-20 2004-07-22 Nec Electronics Corp Soi基板及び半導体集積回路装置
US6956278B2 (en) * 2003-06-30 2005-10-18 Matrix Semiconductor, Inc. Low-density, high-resistivity titanium nitride layer for use as a contact for low-leakage dielectric layers
JP4773697B2 (ja) * 2004-06-30 2011-09-14 ルネサスエレクトロニクス株式会社 Soi基板およびその製造方法ならびに半導体装置
US7709313B2 (en) * 2005-07-19 2010-05-04 International Business Machines Corporation High performance capacitors in planar back gates CMOS
US20100027355A1 (en) * 2007-07-31 2010-02-04 Dao Thuy B Planar double gate transistor storage cell
US7993752B2 (en) * 2008-03-17 2011-08-09 Nano PV Technologies, Inc. Transparent conductive layer and method
JP2010114165A (ja) * 2008-11-04 2010-05-20 Nikon Corp 半導体装置、積層半導体装置および積層半導体装置の製造方法
JP4917085B2 (ja) * 2008-12-15 2012-04-18 東京エレクトロン株式会社 半導体装置
US8133774B2 (en) * 2009-03-26 2012-03-13 International Business Machines Corporation SOI radio frequency switch with enhanced electrical isolation
US8742459B2 (en) * 2009-05-14 2014-06-03 Transphorm Inc. High voltage III-nitride semiconductor devices
US8466036B2 (en) * 2010-12-24 2013-06-18 Io Semiconductor, Inc. Trap rich layer for semiconductor devices
US8481405B2 (en) * 2010-12-24 2013-07-09 Io Semiconductor, Inc. Trap rich layer with through-silicon-vias in semiconductor devices
US8536021B2 (en) 2010-12-24 2013-09-17 Io Semiconductor, Inc. Trap rich layer formation techniques for semiconductor devices
FR2973158B1 (fr) * 2011-03-22 2014-02-28 Soitec Silicon On Insulator Procédé de fabrication d'un substrat de type semi-conducteur sur isolant pour applications radiofréquences
CN103199110B (zh) * 2012-01-09 2015-10-14 上海华虹宏力半导体制造有限公司 一种nldmos器件及其制造方法
KR102360695B1 (ko) * 2014-01-23 2022-02-08 글로벌웨이퍼스 씨오., 엘티디. 고 비저항 soi 웨이퍼 및 그 제조 방법
US20150228714A1 (en) * 2014-02-13 2015-08-13 Rfaxis, Inc. Isolation methods for leakage, loss and non-linearity mitigation in radio-frequency integrated circuits on high-resistivity silicon-on-insulator substrates
US9269591B2 (en) * 2014-03-24 2016-02-23 Taiwan Semiconductor Manufacturing Co., Ltd. Handle wafer for high resistivity trap-rich SOI
US9209198B2 (en) * 2014-05-12 2015-12-08 Macronix International Co., Ltd. Memory cell and manufacturing method thereof
US9917571B2 (en) * 2014-06-13 2018-03-13 Georgia Tech Research Corporation Resonant gyroscopes and methods of making and using the same
FR3024587B1 (fr) * 2014-08-01 2018-01-26 Soitec Procede de fabrication d'une structure hautement resistive
JP6650463B2 (ja) * 2014-11-18 2020-02-19 グローバルウェーハズ カンパニー リミテッドGlobalWafers Co.,Ltd. 電荷トラップ層を備えた高抵抗率の半導体・オン・インシュレーターウェハーの製造方法
FR3029682B1 (fr) 2014-12-04 2017-12-29 Soitec Silicon On Insulator Substrat semi-conducteur haute resistivite et son procede de fabrication
JP6344271B2 (ja) * 2015-03-06 2018-06-20 信越半導体株式会社 貼り合わせ半導体ウェーハ及び貼り合わせ半導体ウェーハの製造方法
US20160322385A1 (en) * 2015-03-31 2016-11-03 Skyworks Solutions, Inc. Substrate bias for field-effect transistor devices
WO2016187032A1 (en) * 2015-05-15 2016-11-24 Skyworks Solutions, Inc. Radio frequency isolation using substrate opening
JP6595804B2 (ja) * 2015-05-27 2019-10-23 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および撮像装置
US9514987B1 (en) * 2015-06-19 2016-12-06 International Business Machines Corporation Backside contact to final substrate
US20160379943A1 (en) * 2015-06-25 2016-12-29 Skyworks Solutions, Inc. Method and apparatus for high performance passive-active circuit integration
US9711521B2 (en) * 2015-08-31 2017-07-18 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate fabrication method to improve RF (radio frequency) device performance
FR3052592B1 (fr) * 2016-06-08 2018-05-18 Soitec Structure pour applications radiofrequences
FR3062238A1 (fr) * 2017-01-26 2018-07-27 Soitec Support pour une structure semi-conductrice
EP3496281A1 (en) * 2017-12-07 2019-06-12 Infineon Technologies AG System and method for a radio frequency filter
DE102018215018A1 (de) * 2018-09-04 2020-03-05 Infineon Technologies Ag Feuchtigkeitssensor

Also Published As

Publication number Publication date
KR102520751B1 (ko) 2023-04-12
TW201830660A (zh) 2018-08-16
CN110235238B (zh) 2023-08-29
KR20190112738A (ko) 2019-10-07
US20220368036A1 (en) 2022-11-17
EP3577683A1 (fr) 2019-12-11
US20210280990A1 (en) 2021-09-09
WO2018142052A1 (fr) 2018-08-09
US20190372243A1 (en) 2019-12-05
TWI764978B (zh) 2022-05-21
EP3577683B1 (fr) 2022-09-21
CN110235238A (zh) 2019-09-13
JP2020509576A (ja) 2020-03-26
FR3062517A1 (fr) 2018-08-03
US11043756B2 (en) 2021-06-22
US11502428B2 (en) 2022-11-15
FR3062517B1 (fr) 2019-03-15
JP7098851B2 (ja) 2022-07-12

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