SG11201901230VA - Sic material and sic composite material - Google Patents

Sic material and sic composite material

Info

Publication number
SG11201901230VA
SG11201901230VA SG11201901230VA SG11201901230VA SG11201901230VA SG 11201901230V A SG11201901230V A SG 11201901230VA SG 11201901230V A SG11201901230V A SG 11201901230VA SG 11201901230V A SG11201901230V A SG 11201901230VA SG 11201901230V A SG11201901230V A SG 11201901230VA
Authority
SG
Singapore
Prior art keywords
sic
composite material
plane
sic composite
peak intensity
Prior art date
Application number
SG11201901230VA
Other languages
English (en)
Inventor
Joung Il Kim
Original Assignee
Tokai Carbon Korea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=61196745&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201901230V(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tokai Carbon Korea Co Ltd filed Critical Tokai Carbon Korea Co Ltd
Publication of SG11201901230VA publication Critical patent/SG11201901230VA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00Carbon; Compounds thereof
    • C01B32/90Carbides
    • C01B32/914Carbides of single elements
    • C01B32/956Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00Carbon; Compounds thereof
    • C01B32/90Carbides
    • C01B32/914Carbides of single elements
    • C01B32/956Silicon carbide
    • C01B32/963Preparation from compounds containing silicon
    • C01B32/984Preparation from elemental silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/32Carbides
    • C23C16/325Silicon carbide
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/20Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/70Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/70Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/74Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by peak-intensities or a ratio thereof only
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/80Particles consisting of a mixture of two or more inorganic phases
    • C01P2004/82Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases
    • C01P2004/84Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases one phase coated with the other

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Ceramic Products (AREA)
SG11201901230VA 2016-08-18 2017-08-18 Sic material and sic composite material SG11201901230VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160104726A KR101866869B1 (ko) 2016-08-18 2016-08-18 SiC 소재 및 SiC 복합 소재
PCT/KR2017/009002 WO2018034532A1 (ko) 2016-08-18 2017-08-18 Sic 소재 및 sic 복합 소재

Publications (1)

Publication Number Publication Date
SG11201901230VA true SG11201901230VA (en) 2019-03-28

Family

ID=61196745

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201901230VA SG11201901230VA (en) 2016-08-18 2017-08-18 Sic material and sic composite material

Country Status (7)

Country Link
US (1) US11591227B2 (ko)
JP (2) JP6831916B2 (ko)
KR (1) KR101866869B1 (ko)
CN (1) CN109562948B (ko)
SG (1) SG11201901230VA (ko)
TW (1) TWI646229B (ko)
WO (1) WO2018034532A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102183258B1 (ko) * 2019-04-18 2020-11-26 주식회사 티씨케이 SiC 소재 및 이의 제조방법

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472476A (en) * 1982-06-24 1984-09-18 United Technologies Corporation Composite silicon carbide/silicon nitride coatings for carbon-carbon materials
US4476178A (en) * 1982-06-24 1984-10-09 United Technologies Corporation Composite silicon carbide coatings for carbon-carbon materials
JPH0692761A (ja) 1992-09-10 1994-04-05 Shin Etsu Chem Co Ltd CVD−SiCコートSi含浸SiC製品およびその製造方法
JP2918860B2 (ja) 1997-01-20 1999-07-12 日本ピラー工業株式会社 鏡面体
JPH11157989A (ja) * 1997-11-25 1999-06-15 Toyo Tanso Kk 気相成長用サセプター及びその製造方法
JPH11199323A (ja) 1998-01-14 1999-07-27 Tokai Carbon Co Ltd ダミーウエハ
JP3857446B2 (ja) * 1998-12-01 2006-12-13 東海カーボン株式会社 SiC成形体
JP2001048649A (ja) * 1999-07-30 2001-02-20 Asahi Glass Co Ltd 炭化ケイ素およびその製造方法
JP4786782B2 (ja) 1999-08-02 2011-10-05 東京エレクトロン株式会社 耐食性に優れたCVD−SiCおよびそれを用いた耐食性部材、ならびに処理装置
JP4361177B2 (ja) * 1999-11-02 2009-11-11 東洋炭素株式会社 炭化ケイ素材料及びrtp装置用治具
JP3557457B2 (ja) 2001-02-01 2004-08-25 東北大学長 SiC膜の製造方法、及びSiC多層膜構造の製造方法
US20050123713A1 (en) * 2003-12-05 2005-06-09 Forrest David T. Articles formed by chemical vapor deposition and methods for their manufacture
JP5087238B2 (ja) 2006-06-22 2012-12-05 株式会社ニューフレアテクノロジー 半導体製造装置の保守方法及び半導体製造方法
JP5051909B2 (ja) 2007-03-30 2012-10-17 コバレントマテリアル株式会社 縦型ウエハボート
TW201104865A (en) * 2009-05-11 2011-02-01 Sumitomo Electric Industries Insulating gate type bipolar transistor
CN103270201B (zh) 2010-12-24 2016-02-10 东洋炭素株式会社 单晶碳化硅液相外延生长用种晶件和单晶碳化硅的液相外延生长方法
EP2657377B1 (en) 2010-12-24 2018-11-21 Toyo Tanso Co., Ltd. Method for epitaxial growth of monocrystalline silicon carbide
WO2012086237A1 (ja) * 2010-12-24 2012-06-28 東洋炭素株式会社 単結晶炭化ケイ素液相エピタキシャル成長用ユニット及び単結晶炭化ケイ素の液相エピタキシャル成長方法
JP5724122B2 (ja) * 2010-12-24 2015-05-27 東洋炭素株式会社 単結晶炭化ケイ素エピタキシャル成長用フィード材及び単結晶炭化ケイ素のエピタキシャル成長方法
JP5896297B2 (ja) 2012-08-01 2016-03-30 東海カーボン株式会社 CVD−SiC成形体およびCVD−SiC成形体の製造方法
CN102874809A (zh) 2012-10-22 2013-01-16 南京工业大学 一种碳化硅复合粉体及其制备工艺
FR3002952B1 (fr) * 2013-03-08 2015-10-30 Commissariat Energie Atomique Procede de preparation d'un revetement multicouche de ceramiques carbures sur, et eventuellement dans, une piece en un materiau carbone, par une technique d'infiltration reactive a l'etat fondu rmi.
KR101631797B1 (ko) 2015-04-13 2016-06-20 주식회사 티씨케이 건식식각장치의 SiC 구조물 및 그 제조방법

Also Published As

Publication number Publication date
JP2019526525A (ja) 2019-09-19
TW201812123A (zh) 2018-04-01
JP2021066657A (ja) 2021-04-30
KR101866869B1 (ko) 2018-06-14
CN109562948A (zh) 2019-04-02
US20190177172A1 (en) 2019-06-13
KR20180020442A (ko) 2018-02-28
US11591227B2 (en) 2023-02-28
JP6831916B2 (ja) 2021-02-17
WO2018034532A1 (ko) 2018-02-22
CN109562948B (zh) 2022-09-30
TWI646229B (zh) 2019-01-01
KR101866869B9 (ko) 2022-05-02

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