SG11201900996VA - Optical near-field metrology - Google Patents

Optical near-field metrology

Info

Publication number
SG11201900996VA
SG11201900996VA SG11201900996VA SG11201900996VA SG11201900996VA SG 11201900996V A SG11201900996V A SG 11201900996VA SG 11201900996V A SG11201900996V A SG 11201900996VA SG 11201900996V A SG11201900996V A SG 11201900996VA SG 11201900996V A SG11201900996V A SG 11201900996VA
Authority
SG
Singapore
Prior art keywords
international
wafer
optical
metrology
features
Prior art date
Application number
SG11201900996VA
Other languages
English (en)
Inventor
Yuri Paskover
Amnon Manassen
Vladimir Levinski
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201900996VA publication Critical patent/SG11201900996VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/02002—Interferometers characterised by controlling or generating intrinsic radiation properties using two or more frequencies
    • G01B9/02004—Interferometers characterised by controlling or generating intrinsic radiation properties using two or more frequencies using frequency scans
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6489—Photoluminescence of semiconductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Inspection Of Paper Currency And Valuable Securities (AREA)
  • Holo Graphy (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG11201900996VA 2016-09-28 2017-07-10 Optical near-field metrology SG11201900996VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662400627P 2016-09-28 2016-09-28
US15/599,881 US11815347B2 (en) 2016-09-28 2017-05-19 Optical near-field metrology
PCT/US2017/041404 WO2018063471A2 (en) 2016-09-28 2017-07-10 Optical near-field metrology

Publications (1)

Publication Number Publication Date
SG11201900996VA true SG11201900996VA (en) 2019-04-29

Family

ID=61685219

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201900996VA SG11201900996VA (en) 2016-09-28 2017-07-10 Optical near-field metrology

Country Status (9)

Country Link
US (1) US11815347B2 (zh)
EP (1) EP3519762A4 (zh)
JP (1) JP7113829B2 (zh)
KR (1) KR102488219B1 (zh)
CN (1) CN109661559B (zh)
IL (1) IL264547B2 (zh)
SG (1) SG11201900996VA (zh)
TW (1) TWI782924B (zh)
WO (1) WO2018063471A2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018026373A1 (en) * 2016-08-04 2018-02-08 Kla-Tencor Corporation Method and computer program product for controlling the positioning of patterns on a substrate in a manufacturing process
US10444161B2 (en) * 2017-04-05 2019-10-15 Kla-Tencor Corporation Systems and methods for metrology with layer-specific illumination spectra
EP3444676A1 (en) * 2017-08-15 2019-02-20 ASML Netherlands B.V. Metrology method, apparatus and computer program
US10677588B2 (en) * 2018-04-09 2020-06-09 Kla-Tencor Corporation Localized telecentricity and focus optimization for overlay metrology
JP2020173207A (ja) * 2019-04-12 2020-10-22 株式会社ミツトヨ 形状測定機

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3071858D1 (en) 1980-07-31 1987-01-22 Ibm Method and device for optical distance measurement
JP2988788B2 (ja) 1992-09-18 1999-12-13 科学技術振興事業団 走査型近接場光学顕微鏡
US5387972A (en) 1993-03-15 1995-02-07 National Research Council Of Canada Coherent phase and frequency detection using sum-frequency mixing in non-linear waveguides
JP3535356B2 (ja) 1997-09-18 2004-06-07 片岡 俊彦 光共振器を利用した走査型近接場光学顕微鏡
AT410845B (de) 2000-06-09 2003-08-25 Kranz Christine Dr Vorrichtung für die gleichzeitige durchführung einer elektrochemischen und einer topographischen nahfeld-mikroskopie
AU2001281192A1 (en) * 2000-08-08 2002-02-18 California Institute Of Technology Optical sensing based on whispering-gallery-mode microcavity
WO2002044672A2 (en) 2000-11-28 2002-06-06 Rosemount Inc. Arrangement for measuring physical parameters with an optical sensor
US7498564B2 (en) * 2001-02-06 2009-03-03 University Of Bristol Of Senate House Resonant scanning near-field optical microscope
WO2005019798A2 (en) 2003-08-13 2005-03-03 The Regents Of The University Of Michigan Biochemical sensors with micro-resonators
US7218803B1 (en) * 2006-03-24 2007-05-15 Fitel Usa Corp. Microsphere probe for optical surface microscopy and method of using the same
US9041938B2 (en) 2006-05-02 2015-05-26 California Institute Of Technology Surface wave assisted structures and systems
US8116624B1 (en) * 2007-01-29 2012-02-14 Cirrex Systems Llc Method and system for evaluating an optical device
JP5406729B2 (ja) 2007-02-05 2014-02-05 ブラウン ユニバーシティ 改良型高解像度超音波顕微鏡
US7639351B2 (en) 2007-03-20 2009-12-29 Tokyo Electron Limited Automated process control using optical metrology with a photonic nanojet
WO2008141301A1 (en) * 2007-05-10 2008-11-20 Veeco Instruments Inc. Non-destructive wafer-scale sub-surface ultrasonic microscopy employing near field afm detection
US8402819B2 (en) 2007-05-15 2013-03-26 Anasys Instruments, Inc. High frequency deflection measurement of IR absorption
DE202007010784U1 (de) * 2007-08-03 2007-10-04 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktloses Messsystem
US20090281452A1 (en) * 2008-05-02 2009-11-12 Marcus Pfister System and method for a medical procedure using computed tomography
US8593638B2 (en) 2008-10-02 2013-11-26 California Institute Of Technology Split frequency sensing methods and systems
SG163442A1 (en) 2009-01-13 2010-08-30 Semiconductor Technologies & Instruments System and method for inspecting a wafer
US8619260B2 (en) 2009-11-02 2013-12-31 Corning Incorporated Multi-grating biosensor for label-independent optical readers
WO2012144903A2 (en) 2011-04-22 2012-10-26 Mapper Lithography Ip B.V. Lithography system for processing a target, such as a wafer, a method for operating a lithography system for processing a target, such as a wafer and a substrate for use in such a lithography system
US20140110606A1 (en) * 2011-05-27 2014-04-24 Hitachi, Ltd. Near-field optical defect inspection apparatus
US9400246B2 (en) 2011-10-11 2016-07-26 Kla-Tencor Corporation Optical metrology tool equipped with modulated illumination sources
DE102012201393A1 (de) 2012-02-01 2013-08-01 Dr. Johannes Heidenhain Gmbh Positionsmesseinrichtung und Anordnung mit mehreren Positionsmesseinrichtungen
JP5743958B2 (ja) * 2012-05-30 2015-07-01 キヤノン株式会社 計測方法、露光方法および装置
FR2994734B1 (fr) 2012-08-21 2017-08-25 Fogale Nanotech Dispositif et procede pour faire des mesures dimensionnelles sur des objets multi-couches tels que des wafers.
TWI688760B (zh) 2013-03-11 2020-03-21 美商克萊譚克公司 使用表面增強電場之缺陷偵測
US9442391B2 (en) 2013-03-12 2016-09-13 Taiwan Semiconductor Manufacturing Co., Ltd. Overlay sampling methodology
CN103226296B (zh) 2013-04-27 2015-04-15 清华大学 一种带激光干涉仪测量的粗精动叠层工作台
JP2014228323A (ja) 2013-05-20 2014-12-08 ウシオ電機株式会社 検査方法、センサ
US8997258B2 (en) 2013-05-23 2015-03-31 National Institute Of Standards And Technology Microscope probe and method for use of same
US9646896B2 (en) * 2013-07-12 2017-05-09 Taiwan Semiconductor Manufacturing Co., Ltd. Lithographic overlay sampling
CN104390596B (zh) 2014-11-12 2017-01-25 广东工业大学 一种便携式光栅尺主尺刻画器及其刻画方法

Also Published As

Publication number Publication date
CN109661559A (zh) 2019-04-19
JP2019535023A (ja) 2019-12-05
WO2018063471A3 (en) 2018-07-26
WO2018063471A2 (en) 2018-04-05
IL264547A (en) 2019-02-28
CN109661559B (zh) 2021-07-30
IL264547B2 (en) 2023-05-01
US20180087900A1 (en) 2018-03-29
TWI782924B (zh) 2022-11-11
EP3519762A4 (en) 2020-05-27
US11815347B2 (en) 2023-11-14
IL264547B1 (en) 2023-01-01
EP3519762A2 (en) 2019-08-07
KR102488219B1 (ko) 2023-01-12
TW201819936A (zh) 2018-06-01
JP7113829B2 (ja) 2022-08-05
KR20190050856A (ko) 2019-05-13

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