SG11201900509YA - Simultaneous capturing of overlay signals from multiple targets - Google Patents

Simultaneous capturing of overlay signals from multiple targets

Info

Publication number
SG11201900509YA
SG11201900509YA SG11201900509YA SG11201900509YA SG11201900509YA SG 11201900509Y A SG11201900509Y A SG 11201900509YA SG 11201900509Y A SG11201900509Y A SG 11201900509YA SG 11201900509Y A SG11201900509Y A SG 11201900509YA SG 11201900509Y A SG11201900509Y A SG 11201900509YA
Authority
SG
Singapore
Prior art keywords
international
multiple targets
pct
field plane
metrology
Prior art date
Application number
SG11201900509YA
Inventor
Andy Hill (Andrew)
Amnon Manassen
Yuri Paskover
Yuval Lubashevsky
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201900509YA publication Critical patent/SG11201900509YA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J4/00Measuring polarisation of light
    • G01J4/04Polarimeters using electric detection means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/26Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N2021/4792Polarisation of scatter light

Abstract

103 104 119 100 104 1158 FIG. 4 -102 111111111111111111111111111111 110 65 103-. 64 113 101 105A 62 11 111111111111 115A 1-1 GC N O Cr) O GC O 1-1 C (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 01 February 2018 (01.02.2018) WIP0 I PCT omit VIII °nolo III oloilino IIV X10111110 oimIE (10) International Publication Number WO 2018/023078 Al (51) International Patent Classification: GO1N 21/47(2006.01) GO2B 27/28 (2006.01) GO1N 21/95 (2006.01) GO2B 27/42 (2006.01) GO1B 11/00 (2006.01) (21) International Application Number: PCT/US2017/044528 (22) International Filing Date: 28 July 2017 (28.07.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/222,503 28 July 2016 (28.07.2016) US (71) Applicant: KLA-TENCOR CORPORATION [US/US]; Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (72) Inventors: HILL, Andy (Andrew); 2112 Los Angeles Av- enue, Berkeley, California 94707 (US). MANASSEN, Am- non; 10 Golda Meir, 34892 Haifa (IL). PASKOVER, Yuri; 10 Schoham Str., 38900 Caesarea (IL). LUBASHEVSKY, Yuval; 22 Smolenskin St., 3436606 Haifa (IL). (74) Agent: MCANDREWS, Kevin et al.; KLA-Tencor Corp., Legal Department, One Technology Drive, Milpitas, Cali- fornia 95035 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (54) Title: SIMULTANEOUS CAPTURING OF OVERLAY SIGNALS FROM MULTIPLE TARGETS (57) : Metrology methods and systems are provided, in which the detected image is split at a field plane of the collection path of the metrology system's optical system into at least two pupil plane images. Optical elements such as prisms may be used to split the field plane images, and multiple targets or target cells may be measured simultaneously by spatially splitting the field plane and/or the illumination sources and/or by using two polarization types. The simultaneous capturing of multiple targets or target cells increases the throughput of the disclosed metrology systems. [Continued on next page] WO 2018/023078 Al MIDEDIMOMOIDEIREIO I 0 10 1101 0111 INEEHMEHOM GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
SG11201900509YA 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets SG11201900509YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/222,503 US10048132B2 (en) 2016-07-28 2016-07-28 Simultaneous capturing of overlay signals from multiple targets
PCT/US2017/044528 WO2018023078A1 (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets

Publications (1)

Publication Number Publication Date
SG11201900509YA true SG11201900509YA (en) 2019-02-27

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SG10201912512UA SG10201912512UA (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets

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SG10201912512UA SG10201912512UA (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets

Country Status (7)

Country Link
US (2) US10048132B2 (en)
JP (1) JP6771647B2 (en)
KR (1) KR102180433B1 (en)
CN (2) CN109564160B (en)
SG (2) SG11201900509YA (en)
TW (1) TWI728157B (en)
WO (1) WO2018023078A1 (en)

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WO2024033035A1 (en) * 2022-08-10 2024-02-15 Asml Netherlands B.V. Metrology method and associated metrology device

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Also Published As

Publication number Publication date
US20180031424A1 (en) 2018-02-01
CN112432926A (en) 2021-03-02
KR20190026039A (en) 2019-03-12
US20180335346A1 (en) 2018-11-22
US10048132B2 (en) 2018-08-14
TWI728157B (en) 2021-05-21
US10401228B2 (en) 2019-09-03
JP6771647B2 (en) 2020-10-21
CN109564160A (en) 2019-04-02
TW201805593A (en) 2018-02-16
WO2018023078A1 (en) 2018-02-01
SG10201912512UA (en) 2020-02-27
CN109564160B (en) 2020-11-10
KR102180433B1 (en) 2020-11-19
JP2019526053A (en) 2019-09-12

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