SG10201912512UA - Simultaneous capturing of overlay signals from multiple targets - Google Patents

Simultaneous capturing of overlay signals from multiple targets

Info

Publication number
SG10201912512UA
SG10201912512UA SG10201912512UA SG10201912512UA SG10201912512UA SG 10201912512U A SG10201912512U A SG 10201912512UA SG 10201912512U A SG10201912512U A SG 10201912512UA SG 10201912512U A SG10201912512U A SG 10201912512UA SG 10201912512U A SG10201912512U A SG 10201912512UA
Authority
SG
Singapore
Prior art keywords
multiple targets
overlay signals
simultaneous capturing
capturing
simultaneous
Prior art date
Application number
SG10201912512UA
Inventor
Andy Hill (Andrew)
Amnon Manassen
Yuri Paskover
Yuval Lubashevsky
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG10201912512UA publication Critical patent/SG10201912512UA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J4/00Measuring polarisation of light
    • G01J4/04Polarimeters using electric detection means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/26Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70633Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N2021/4792Polarisation of scatter light
SG10201912512UA 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets SG10201912512UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/222,503 US10048132B2 (en) 2016-07-28 2016-07-28 Simultaneous capturing of overlay signals from multiple targets

Publications (1)

Publication Number Publication Date
SG10201912512UA true SG10201912512UA (en) 2020-02-27

Family

ID=61009490

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201900509YA SG11201900509YA (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets
SG10201912512UA SG10201912512UA (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201900509YA SG11201900509YA (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets

Country Status (7)

Country Link
US (2) US10048132B2 (en)
JP (1) JP6771647B2 (en)
KR (1) KR102180433B1 (en)
CN (2) CN109564160B (en)
SG (2) SG11201900509YA (en)
TW (1) TWI728157B (en)
WO (1) WO2018023078A1 (en)

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EP3575875A1 (en) 2018-05-31 2019-12-04 ASML Netherlands B.V. Measurement apparatus and method of measuring a target
CN112567296B (en) * 2018-08-28 2024-03-08 科磊股份有限公司 Off-axis illumination overlay measurement using two diffraction orders imaging
WO2020057900A1 (en) * 2018-09-19 2020-03-26 Asml Netherlands B.V. Metrology sensor for position metrology
US11119417B2 (en) * 2018-11-21 2021-09-14 Kla-Tencor Corporation Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s)
US11073768B2 (en) 2019-06-26 2021-07-27 Kla Corporation Metrology target for scanning metrology
US11359916B2 (en) * 2019-09-09 2022-06-14 Kla Corporation Darkfield imaging of grating target structures for overlay measurement
US11933717B2 (en) 2019-09-27 2024-03-19 Kla Corporation Sensitive optical metrology in scanning and static modes
WO2021151754A1 (en) 2020-01-29 2021-08-05 Asml Netherlands B.V. Metrology method and device for measuring a periodic structure on a substrate
US11604149B2 (en) * 2020-04-23 2023-03-14 Kla Corporation Metrology methods and optical schemes for measurement of misregistration by using hatched target designs
US11966171B2 (en) 2020-08-17 2024-04-23 Tokyo Electron Limited Method for producing overlay results with absolute reference for semiconductor manufacturing
US11531275B1 (en) * 2021-08-25 2022-12-20 Kla Corporation Parallel scatterometry overlay metrology
WO2023072880A1 (en) * 2021-10-29 2023-05-04 Asml Netherlands B.V. Inspection apparatus, polarization-maintaining rotatable beam displacer, and method
WO2024017649A1 (en) * 2022-07-19 2024-01-25 Asml Netherlands B.V. Enhanced alignment apparatus for lithographic systems
WO2024033035A1 (en) * 2022-08-10 2024-02-15 Asml Netherlands B.V. Metrology method and associated metrology device

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NL8600638A (en) * 1986-03-12 1987-10-01 Philips Nv DEVICE FOR ALIGNING A MASK AND A SUBSTRATE WITH REGARD TO EACH OTHER
JPH05157521A (en) * 1991-08-29 1993-06-22 Nkk Corp Measuring method of ellipso parameter and ellipsometer
US5734498A (en) * 1994-05-09 1998-03-31 The Regents Of The University Of California Illuminator elements for conventional light microscopes
US6710876B1 (en) * 2000-08-14 2004-03-23 Kla-Tencor Technologies Corporation Metrology system using optical phase
US6768543B1 (en) 2001-11-01 2004-07-27 Arun Ananth Aiyer Wafer inspection apparatus with unique illumination methodology and method of operation
US7957066B2 (en) 2003-02-21 2011-06-07 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US7561282B1 (en) 2006-03-27 2009-07-14 Kla-Tencor Technologies Corporation Techniques for determining overlay and critical dimension using a single metrology tool
WO2007116000A2 (en) * 2006-04-04 2007-10-18 Tesa Scribos Gmbh Device and method for microstructuring a storage medium and storage medium comprising a microstructured region
US7692792B2 (en) * 2006-06-22 2010-04-06 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7701577B2 (en) * 2007-02-21 2010-04-20 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
IL194839A0 (en) * 2007-10-25 2009-08-03 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US8441639B2 (en) * 2009-09-03 2013-05-14 Kla-Tencor Corp. Metrology systems and methods
NL2006229A (en) * 2010-03-18 2011-09-20 Asml Netherlands Bv Inspection method and apparatus, and associated computer readable product.
US8896832B2 (en) * 2010-06-17 2014-11-25 Kla-Tencor Corp. Discrete polarization scatterometry
JP5873212B2 (en) * 2012-04-12 2016-03-01 エーエスエムエル ネザーランズ ビー.ブイ. POSITION MEASURING METHOD, POSITION MEASURING DEVICE, LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD, AND OPTICAL ELEMENT
US8817273B2 (en) * 2012-04-24 2014-08-26 Nanometrics Incorporated Dark field diffraction based overlay
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Also Published As

Publication number Publication date
JP2019526053A (en) 2019-09-12
KR102180433B1 (en) 2020-11-19
US10048132B2 (en) 2018-08-14
US20180335346A1 (en) 2018-11-22
JP6771647B2 (en) 2020-10-21
CN109564160B (en) 2020-11-10
KR20190026039A (en) 2019-03-12
US20180031424A1 (en) 2018-02-01
TW201805593A (en) 2018-02-16
US10401228B2 (en) 2019-09-03
CN112432926A (en) 2021-03-02
WO2018023078A1 (en) 2018-02-01
CN109564160A (en) 2019-04-02
TWI728157B (en) 2021-05-21
SG11201900509YA (en) 2019-02-27

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