SG10201912512UA - Simultaneous capturing of overlay signals from multiple targets - Google Patents
Simultaneous capturing of overlay signals from multiple targetsInfo
- Publication number
- SG10201912512UA SG10201912512UA SG10201912512UA SG10201912512UA SG10201912512UA SG 10201912512U A SG10201912512U A SG 10201912512UA SG 10201912512U A SG10201912512U A SG 10201912512UA SG 10201912512U A SG10201912512U A SG 10201912512UA SG 10201912512U A SG10201912512U A SG 10201912512UA
- Authority
- SG
- Singapore
- Prior art keywords
- multiple targets
- overlay signals
- simultaneous capturing
- capturing
- simultaneous
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J4/00—Measuring polarisation of light
- G01J4/04—Polarimeters using electric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N2021/4792—Polarisation of scatter light
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/222,503 US10048132B2 (en) | 2016-07-28 | 2016-07-28 | Simultaneous capturing of overlay signals from multiple targets |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201912512UA true SG10201912512UA (en) | 2020-02-27 |
Family
ID=61009490
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201900509YA SG11201900509YA (en) | 2016-07-28 | 2017-07-28 | Simultaneous capturing of overlay signals from multiple targets |
SG10201912512UA SG10201912512UA (en) | 2016-07-28 | 2017-07-28 | Simultaneous capturing of overlay signals from multiple targets |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201900509YA SG11201900509YA (en) | 2016-07-28 | 2017-07-28 | Simultaneous capturing of overlay signals from multiple targets |
Country Status (7)
Country | Link |
---|---|
US (2) | US10048132B2 (en) |
JP (1) | JP6771647B2 (en) |
KR (1) | KR102180433B1 (en) |
CN (2) | CN109564160B (en) |
SG (2) | SG11201900509YA (en) |
TW (1) | TWI728157B (en) |
WO (1) | WO2018023078A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3528047A1 (en) * | 2018-02-14 | 2019-08-21 | ASML Netherlands B.V. | Method and apparatus for measuring a parameter of interest using image plane detection techniques |
US10809124B2 (en) * | 2018-05-07 | 2020-10-20 | Perkinelmer Health Sciences, Inc. | Spectrometers and instruments including them |
EP3575875A1 (en) | 2018-05-31 | 2019-12-04 | ASML Netherlands B.V. | Measurement apparatus and method of measuring a target |
CN112567296B (en) * | 2018-08-28 | 2024-03-08 | 科磊股份有限公司 | Off-axis illumination overlay measurement using two diffraction orders imaging |
WO2020057900A1 (en) * | 2018-09-19 | 2020-03-26 | Asml Netherlands B.V. | Metrology sensor for position metrology |
US11119417B2 (en) * | 2018-11-21 | 2021-09-14 | Kla-Tencor Corporation | Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s) |
US11073768B2 (en) | 2019-06-26 | 2021-07-27 | Kla Corporation | Metrology target for scanning metrology |
US11359916B2 (en) * | 2019-09-09 | 2022-06-14 | Kla Corporation | Darkfield imaging of grating target structures for overlay measurement |
US11933717B2 (en) | 2019-09-27 | 2024-03-19 | Kla Corporation | Sensitive optical metrology in scanning and static modes |
WO2021151754A1 (en) | 2020-01-29 | 2021-08-05 | Asml Netherlands B.V. | Metrology method and device for measuring a periodic structure on a substrate |
US11604149B2 (en) * | 2020-04-23 | 2023-03-14 | Kla Corporation | Metrology methods and optical schemes for measurement of misregistration by using hatched target designs |
US11966171B2 (en) | 2020-08-17 | 2024-04-23 | Tokyo Electron Limited | Method for producing overlay results with absolute reference for semiconductor manufacturing |
US11531275B1 (en) * | 2021-08-25 | 2022-12-20 | Kla Corporation | Parallel scatterometry overlay metrology |
WO2023072880A1 (en) * | 2021-10-29 | 2023-05-04 | Asml Netherlands B.V. | Inspection apparatus, polarization-maintaining rotatable beam displacer, and method |
WO2024017649A1 (en) * | 2022-07-19 | 2024-01-25 | Asml Netherlands B.V. | Enhanced alignment apparatus for lithographic systems |
WO2024033035A1 (en) * | 2022-08-10 | 2024-02-15 | Asml Netherlands B.V. | Metrology method and associated metrology device |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8600638A (en) * | 1986-03-12 | 1987-10-01 | Philips Nv | DEVICE FOR ALIGNING A MASK AND A SUBSTRATE WITH REGARD TO EACH OTHER |
JPH05157521A (en) * | 1991-08-29 | 1993-06-22 | Nkk Corp | Measuring method of ellipso parameter and ellipsometer |
US5734498A (en) * | 1994-05-09 | 1998-03-31 | The Regents Of The University Of California | Illuminator elements for conventional light microscopes |
US6710876B1 (en) * | 2000-08-14 | 2004-03-23 | Kla-Tencor Technologies Corporation | Metrology system using optical phase |
US6768543B1 (en) | 2001-11-01 | 2004-07-27 | Arun Ananth Aiyer | Wafer inspection apparatus with unique illumination methodology and method of operation |
US7957066B2 (en) | 2003-02-21 | 2011-06-07 | Kla-Tencor Corporation | Split field inspection system using small catadioptric objectives |
US7561282B1 (en) | 2006-03-27 | 2009-07-14 | Kla-Tencor Technologies Corporation | Techniques for determining overlay and critical dimension using a single metrology tool |
WO2007116000A2 (en) * | 2006-04-04 | 2007-10-18 | Tesa Scribos Gmbh | Device and method for microstructuring a storage medium and storage medium comprising a microstructured region |
US7692792B2 (en) * | 2006-06-22 | 2010-04-06 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7701577B2 (en) * | 2007-02-21 | 2010-04-20 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
IL194839A0 (en) * | 2007-10-25 | 2009-08-03 | Asml Netherlands Bv | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US8441639B2 (en) * | 2009-09-03 | 2013-05-14 | Kla-Tencor Corp. | Metrology systems and methods |
NL2006229A (en) * | 2010-03-18 | 2011-09-20 | Asml Netherlands Bv | Inspection method and apparatus, and associated computer readable product. |
US8896832B2 (en) * | 2010-06-17 | 2014-11-25 | Kla-Tencor Corp. | Discrete polarization scatterometry |
JP5873212B2 (en) * | 2012-04-12 | 2016-03-01 | エーエスエムエル ネザーランズ ビー.ブイ. | POSITION MEASURING METHOD, POSITION MEASURING DEVICE, LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD, AND OPTICAL ELEMENT |
US8817273B2 (en) * | 2012-04-24 | 2014-08-26 | Nanometrics Incorporated | Dark field diffraction based overlay |
US9778025B2 (en) | 2012-08-16 | 2017-10-03 | Asml Netherlands B.V. | Method and apparatus for measuring asymmetry of a microstructure, position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method |
CN108761752A (en) * | 2012-10-30 | 2018-11-06 | 加州理工学院 | Fourier overlapping associations imaging system, device and method |
US9091650B2 (en) * | 2012-11-27 | 2015-07-28 | Kla-Tencor Corporation | Apodization for pupil imaging scatterometry |
CN108398856B (en) | 2013-08-07 | 2020-10-16 | Asml荷兰有限公司 | Metrology method and apparatus, lithographic system and device manufacturing method |
CN110082900B (en) * | 2013-08-22 | 2022-05-13 | 加州理工学院 | Variable illumination fourier ptychographic imaging apparatus, system and method |
US10795144B2 (en) * | 2014-12-06 | 2020-10-06 | Howard Hughes Medical Institute | Microscopy with structured plane illumination and point accumulation for imaging and nanoscale topography |
-
2016
- 2016-07-28 US US15/222,503 patent/US10048132B2/en active Active
-
2017
- 2017-07-28 TW TW106125402A patent/TWI728157B/en active
- 2017-07-28 KR KR1020197005724A patent/KR102180433B1/en active IP Right Grant
- 2017-07-28 CN CN201780046742.XA patent/CN109564160B/en active Active
- 2017-07-28 WO PCT/US2017/044528 patent/WO2018023078A1/en active Application Filing
- 2017-07-28 SG SG11201900509YA patent/SG11201900509YA/en unknown
- 2017-07-28 CN CN202011221908.7A patent/CN112432926A/en active Pending
- 2017-07-28 JP JP2019504839A patent/JP6771647B2/en active Active
- 2017-07-28 SG SG10201912512UA patent/SG10201912512UA/en unknown
-
2018
- 2018-08-01 US US16/052,044 patent/US10401228B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2019526053A (en) | 2019-09-12 |
KR102180433B1 (en) | 2020-11-19 |
US10048132B2 (en) | 2018-08-14 |
US20180335346A1 (en) | 2018-11-22 |
JP6771647B2 (en) | 2020-10-21 |
CN109564160B (en) | 2020-11-10 |
KR20190026039A (en) | 2019-03-12 |
US20180031424A1 (en) | 2018-02-01 |
TW201805593A (en) | 2018-02-16 |
US10401228B2 (en) | 2019-09-03 |
CN112432926A (en) | 2021-03-02 |
WO2018023078A1 (en) | 2018-02-01 |
CN109564160A (en) | 2019-04-02 |
TWI728157B (en) | 2021-05-21 |
SG11201900509YA (en) | 2019-02-27 |
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