SG11201900803YA - Surface defect inspection with large particle monitoring and laser power control - Google Patents

Surface defect inspection with large particle monitoring and laser power control

Info

Publication number
SG11201900803YA
SG11201900803YA SG11201900803YA SG11201900803YA SG11201900803YA SG 11201900803Y A SG11201900803Y A SG 11201900803YA SG 11201900803Y A SG11201900803Y A SG 11201900803YA SG 11201900803Y A SG11201900803Y A SG 11201900803YA SG 11201900803Y A SG11201900803Y A SG 11201900803YA
Authority
SG
Singapore
Prior art keywords
california
measurement spot
international
san jose
leading
Prior art date
Application number
SG11201900803YA
Other languages
English (en)
Inventor
Steve Yifeng Cui
Jay Huang (Chunsheng)
Chunhai Wang
Christian Wolters
Bret Whiteside
Anatoly Romanovsky
Chuanyong Huang
Donald Pettibone
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201900803YA publication Critical patent/SG11201900803YA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201900803YA 2016-08-05 2017-08-03 Surface defect inspection with large particle monitoring and laser power control SG11201900803YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/230,330 US10324045B2 (en) 2016-08-05 2016-08-05 Surface defect inspection with large particle monitoring and laser power control
PCT/US2017/045261 WO2018027010A1 (en) 2016-08-05 2017-08-03 Surface defect inspection with large particle monitoring and laser power control

Publications (1)

Publication Number Publication Date
SG11201900803YA true SG11201900803YA (en) 2019-02-27

Family

ID=61069145

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201900803YA SG11201900803YA (en) 2016-08-05 2017-08-03 Surface defect inspection with large particle monitoring and laser power control

Country Status (8)

Country Link
US (1) US10324045B2 (ko)
JP (1) JP6840224B2 (ko)
KR (1) KR102228505B1 (ko)
CN (1) CN109564884B (ko)
IL (1) IL264450B (ko)
SG (1) SG11201900803YA (ko)
TW (1) TWI733873B (ko)
WO (1) WO2018027010A1 (ko)

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US11094501B2 (en) * 2019-11-19 2021-08-17 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Secondary charged particle imaging system
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US20220091047A1 (en) * 2020-09-24 2022-03-24 Kla Corporation Large-Particle Monitoring with Laser Power Control for Defect Inspection
TWI814412B (zh) * 2022-05-31 2023-09-01 合盈光電科技股份有限公司 多方向物件失效檢查系統及其方法

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Also Published As

Publication number Publication date
JP6840224B2 (ja) 2021-03-10
TW201807765A (zh) 2018-03-01
TWI733873B (zh) 2021-07-21
US10324045B2 (en) 2019-06-18
IL264450B (en) 2021-09-30
US20180038803A1 (en) 2018-02-08
JP2019525180A (ja) 2019-09-05
WO2018027010A1 (en) 2018-02-08
CN109564884A (zh) 2019-04-02
IL264450A (en) 2019-02-28
CN109564884B (zh) 2020-08-18
KR20190027390A (ko) 2019-03-14
KR102228505B1 (ko) 2021-03-15

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