SG11201810262XA - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- SG11201810262XA SG11201810262XA SG11201810262XA SG11201810262XA SG11201810262XA SG 11201810262X A SG11201810262X A SG 11201810262XA SG 11201810262X A SG11201810262X A SG 11201810262XA SG 11201810262X A SG11201810262X A SG 11201810262XA SG 11201810262X A SG11201810262X A SG 11201810262XA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- photosensitive resin
- photosensitive
- composition
- resin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Electroluminescent Light Sources (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016118522 | 2016-06-15 | ||
| PCT/JP2017/021094 WO2017217293A1 (ja) | 2016-06-15 | 2017-06-07 | 感光性樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201810262XA true SG11201810262XA (en) | 2018-12-28 |
Family
ID=60664107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201810262XA SG11201810262XA (en) | 2016-06-15 | 2017-06-07 | Photosensitive resin composition |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2017217293A1 (zh) |
| KR (1) | KR102364136B1 (zh) |
| CN (1) | CN109313387B (zh) |
| SG (1) | SG11201810262XA (zh) |
| TW (1) | TWI726112B (zh) |
| WO (1) | WO2017217293A1 (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7180459B2 (ja) * | 2018-03-26 | 2022-11-30 | 東レ株式会社 | アルカリ可溶性樹脂溶液の製造方法 |
| JP2019172975A (ja) * | 2018-03-26 | 2019-10-10 | 東レ株式会社 | 樹脂組成物、樹脂シート、硬化膜 |
| JP7094150B2 (ja) * | 2018-05-31 | 2022-07-01 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物、および電子部品 |
| EP3971243A4 (en) * | 2019-05-16 | 2022-05-11 | Showa Denko Materials Co., Ltd. | POLYAMIDE-IMIDE RESIN COMPOSITION AND POLYAMIDE-IMIDE RESIN PRODUCTION METHOD |
| JP7235128B2 (ja) * | 2020-02-20 | 2023-03-08 | 住友ベークライト株式会社 | 感光性樹脂組成物の製造方法 |
| CN117304225B (zh) * | 2023-09-12 | 2024-03-29 | 波米科技有限公司 | 一种含炔基化合物、正型感光性树脂组合物及其制备方法和应用 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3968884B2 (ja) * | 1998-05-01 | 2007-08-29 | 日本メクトロン株式会社 | 感光性組成物 |
| JP3931484B2 (ja) * | 1999-06-03 | 2007-06-13 | 住友化学株式会社 | ポジ型フォトレジスト組成物 |
| JP4677687B2 (ja) | 2001-06-21 | 2011-04-27 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物 |
| KR100548625B1 (ko) * | 2003-03-24 | 2006-01-31 | 주식회사 엘지화학 | 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물 |
| JP4955263B2 (ja) * | 2004-12-15 | 2012-06-20 | イビデン株式会社 | プリント配線板 |
| JP5061435B2 (ja) | 2005-08-01 | 2012-10-31 | 東レ株式会社 | 耐熱樹脂前駆体組成物およびそれを用いた半導体装置 |
| JP5241280B2 (ja) | 2007-04-06 | 2013-07-17 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
| JP2009084435A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 感光性樹脂組成物、フォトスペーサの製造方法、液晶表示装置用基板、液晶表示素子、及び液晶表示装置 |
| TWI399391B (zh) * | 2007-10-26 | 2013-06-21 | Asahi Chemical Ind | A polyimide precursor and a photosensitive resin composition containing a polyimide precursor |
| JP2009235311A (ja) * | 2008-03-28 | 2009-10-15 | Toray Ind Inc | ポリイミド樹脂およびそれを用いた耐熱性樹脂組成物 |
| JP5163812B2 (ja) * | 2009-05-20 | 2013-03-13 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物、硬化膜、保護膜、層間絶縁膜、およびそれを用いた半導体装置、表示素子 |
| WO2011030744A1 (ja) * | 2009-09-10 | 2011-03-17 | 東レ株式会社 | 感光性樹脂組成物および感光性樹脂膜の製造方法 |
| KR101333704B1 (ko) * | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| CN102713756B (zh) * | 2010-01-22 | 2014-10-15 | 日立化成杜邦微系统股份有限公司 | 感光性聚合物组合物、图形的制造方法以及电子部件 |
| JP2012069734A (ja) * | 2010-09-24 | 2012-04-05 | Toshiba Corp | 半導体装置の製造方法 |
| JP5548604B2 (ja) * | 2010-12-21 | 2014-07-16 | 富士フイルム株式会社 | 感光性樹脂組成物 |
| US9331295B2 (en) * | 2011-12-20 | 2016-05-03 | Seiko Epson Corporation | Film-forming ink, film-forming method, method of manufacturing light emitting element, light emitting element, light emitting device, and electronic apparatus |
| WO2014115233A1 (ja) | 2013-01-28 | 2014-07-31 | 日立化成デュポンマイクロシステムズ株式会社 | 樹脂組成物、パターン硬化膜の製造方法及び半導体素子 |
| WO2015087830A1 (ja) * | 2013-12-11 | 2015-06-18 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置 |
| JPWO2015137281A1 (ja) * | 2014-03-14 | 2017-04-06 | 東レ株式会社 | 感光性樹脂組成物 |
| JP6447242B2 (ja) | 2014-05-15 | 2019-01-09 | Jsr株式会社 | 感放射線性樹脂組成物、絶縁膜及びその製造方法、並びに有機ｅｌ素子 |
| US20170293224A1 (en) * | 2014-09-26 | 2017-10-12 | Toray Industries, Inc. | Organic el display device |
-
2017
- 2017-06-07 JP JP2017531637A patent/JPWO2017217293A1/ja active Pending
- 2017-06-07 SG SG11201810262XA patent/SG11201810262XA/en unknown
- 2017-06-07 WO PCT/JP2017/021094 patent/WO2017217293A1/ja active Application Filing
- 2017-06-07 KR KR1020187037217A patent/KR102364136B1/ko active IP Right Grant
- 2017-06-07 CN CN201780036074.2A patent/CN109313387B/zh active Active
- 2017-06-09 TW TW106119168A patent/TWI726112B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017217293A1 (ja) | 2017-12-21 |
| CN109313387B (zh) | 2021-11-26 |
| KR102364136B1 (ko) | 2022-02-18 |
| CN109313387A (zh) | 2019-02-05 |
| JPWO2017217293A1 (ja) | 2019-04-04 |
| TW201833662A (zh) | 2018-09-16 |
| TWI726112B (zh) | 2021-05-01 |
| KR20190017807A (ko) | 2019-02-20 |
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