SG11201808871RA - Contactless electric power supply mechanism and method for rotary table, and wafer rotating and holding device - Google Patents

Contactless electric power supply mechanism and method for rotary table, and wafer rotating and holding device

Info

Publication number
SG11201808871RA
SG11201808871RA SG11201808871RA SG11201808871RA SG11201808871RA SG 11201808871R A SG11201808871R A SG 11201808871RA SG 11201808871R A SG11201808871R A SG 11201808871RA SG 11201808871R A SG11201808871R A SG 11201808871RA SG 11201808871R A SG11201808871R A SG 11201808871RA
Authority
SG
Singapore
Prior art keywords
rotary table
electric power
power supply
supply mechanism
holding device
Prior art date
Application number
SG11201808871RA
Other languages
English (en)
Inventor
Masato Tsuchiya
Original Assignee
Mimasu Semiconductor Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimasu Semiconductor Industry Co Ltd filed Critical Mimasu Semiconductor Industry Co Ltd
Publication of SG11201808871RA publication Critical patent/SG11201808871RA/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32055—Deposition of semiconductive layers, e.g. poly - or amorphous silicon layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201808871RA 2016-04-21 2017-03-29 Contactless electric power supply mechanism and method for rotary table, and wafer rotating and holding device SG11201808871RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016085365 2016-04-21
PCT/JP2017/012792 WO2017183402A1 (ja) 2016-04-21 2017-03-29 回転テーブル用非接触電力供給機構及び方法並びにウェーハ回転保持装置

Publications (1)

Publication Number Publication Date
SG11201808871RA true SG11201808871RA (en) 2018-11-29

Family

ID=60116678

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808871RA SG11201808871RA (en) 2016-04-21 2017-03-29 Contactless electric power supply mechanism and method for rotary table, and wafer rotating and holding device

Country Status (8)

Country Link
US (1) US10679862B2 (ko)
EP (1) EP3432351B1 (ko)
JP (1) JP6622389B2 (ko)
KR (1) KR20180121562A (ko)
CN (1) CN109075117B (ko)
SG (1) SG11201808871RA (ko)
TW (1) TWI728093B (ko)
WO (1) WO2017183402A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019198181A (ja) * 2018-05-10 2019-11-14 Ｎｉｔｔｏｋｕ株式会社 回転テーブル式製造装置
KR102111099B1 (ko) * 2018-11-09 2020-05-15 (주)에이앤아이 집전 픽업을 포함하는 무선 로터리 검사장치
KR102111095B1 (ko) * 2018-11-09 2020-05-15 (주)에이앤아이 전력전달유닛을 포함하는 무선 로터리 검사장치
US20220224159A1 (en) * 2019-04-26 2022-07-14 Panasonic Intellectual Property Management Co., Ltd. Wireless power and data transmission apparatus and transmission module
JP7241646B2 (ja) * 2019-08-30 2023-03-17 京セラ株式会社 ヒータ及びヒータシステム
CN113131624A (zh) * 2021-04-22 2021-07-16 北京机械设备研究所 一种载车转塔无线供电装置
CN116372801A (zh) * 2023-04-12 2023-07-04 华海清科股份有限公司 一种承载组件和化学机械抛光系统

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232047A (ja) * 1993-01-29 1994-08-19 Mitsubishi Heavy Ind Ltd ウェハ回転装置
JP4257816B2 (ja) 2000-03-16 2009-04-22 三益半導体工業株式会社 廃液回収機構付ウェーハ表面処理装置
JP4111479B2 (ja) 1999-09-09 2008-07-02 三益半導体工業株式会社 ウェーハ回転保持装置
JP3816359B2 (ja) * 2001-06-29 2006-08-30 アルプス電気株式会社 プラズマ処理装置およびプラズマ処理システム
JP2004241492A (ja) 2003-02-04 2004-08-26 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4364242B2 (ja) 2004-03-22 2009-11-11 三益半導体工業株式会社 スピンエッチングにおける工程管理方法及びスピンエッチング装置
WO2006103773A1 (ja) 2005-03-30 2006-10-05 Mimasu Semiconductor Industry Co., Ltd. スピン処理方法及び装置
JP2008034463A (ja) * 2006-07-26 2008-02-14 Hitachi Kokusai Electric Inc 基板処理装置
JP4753832B2 (ja) * 2006-10-19 2011-08-24 大日本スクリーン製造株式会社 基板回転保持装置および基板処理装置
JP2008172161A (ja) * 2007-01-15 2008-07-24 Dainippon Screen Mfg Co Ltd 基板回転保持装置およびこれを備えた基板処理装置
JP5135204B2 (ja) * 2008-12-26 2013-02-06 株式会社日立製作所 非接触電力伝送システム、および該非接触電力伝送システムにおける負荷装置
JP6011417B2 (ja) 2012-06-15 2016-10-19 東京エレクトロン株式会社 成膜装置、基板処理装置及び成膜方法
JP6036189B2 (ja) 2012-11-07 2016-11-30 ソニー株式会社 アンテナモジュール、情報通信装置及び情報通信システム
US20150083042A1 (en) * 2013-09-26 2015-03-26 Applied Materials, Inc. Rotatable substrate support having radio frequency applicator
JP6690995B2 (ja) 2016-05-20 2020-04-28 三益半導体工業株式会社 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置
JP6634154B2 (ja) * 2016-05-24 2020-01-22 三益半導体工業株式会社 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置

Also Published As

Publication number Publication date
US20190148154A1 (en) 2019-05-16
CN109075117A (zh) 2018-12-21
JP6622389B2 (ja) 2019-12-18
CN109075117B (zh) 2023-01-17
EP3432351A4 (en) 2019-12-11
EP3432351B1 (en) 2021-07-14
US10679862B2 (en) 2020-06-09
WO2017183402A1 (ja) 2017-10-26
TWI728093B (zh) 2021-05-21
JPWO2017183402A1 (ja) 2019-02-21
EP3432351A1 (en) 2019-01-23
TW201742140A (zh) 2017-12-01
KR20180121562A (ko) 2018-11-07

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