SG11201807410SA - Tape for electronic device packaging - Google Patents

Tape for electronic device packaging

Info

Publication number
SG11201807410SA
SG11201807410SA SG11201807410SA SG11201807410SA SG11201807410SA SG 11201807410S A SG11201807410S A SG 11201807410SA SG 11201807410S A SG11201807410S A SG 11201807410SA SG 11201807410S A SG11201807410S A SG 11201807410SA SG 11201807410S A SG11201807410S A SG 11201807410SA
Authority
SG
Singapore
Prior art keywords
tape
electronic device
device packaging
packaging
electronic
Prior art date
Application number
SG11201807410SA
Other languages
English (en)
Inventor
Toru Sano
Hiromitsu Maruyama
Jirou Sugiyama
Masami Aoyama
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of SG11201807410SA publication Critical patent/SG11201807410SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Packages (AREA)
SG11201807410SA 2016-03-31 2016-11-22 Tape for electronic device packaging SG11201807410SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016072256A JP6422462B2 (ja) 2016-03-31 2016-03-31 電子デバイスパッケージ用テープ
PCT/JP2016/084563 WO2017168825A1 (ja) 2016-03-31 2016-11-22 電子デバイスパッケージ用テープ

Publications (1)

Publication Number Publication Date
SG11201807410SA true SG11201807410SA (en) 2018-09-27

Family

ID=59962840

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807410SA SG11201807410SA (en) 2016-03-31 2016-11-22 Tape for electronic device packaging

Country Status (7)

Country Link
JP (1) JP6422462B2 (ja)
KR (1) KR102165006B1 (ja)
CN (1) CN108779375B (ja)
MY (1) MY190282A (ja)
SG (1) SG11201807410SA (ja)
TW (1) TWI632625B (ja)
WO (1) WO2017168825A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7153034B2 (ja) * 2018-01-24 2022-10-13 リンテック株式会社 長尺積層シートおよびその巻収体
CN111629892A (zh) * 2018-01-24 2020-09-04 琳得科株式会社 长条层叠片的卷料
CN108485542B (zh) * 2018-03-23 2023-12-15 山东天汇防水股份有限公司 一种打孔聚乙烯自粘防水卷材及其制备、使用方法
JP7071785B2 (ja) * 2018-07-06 2022-05-19 株式会社ディスコ ウェーハの加工方法
JP7071784B2 (ja) * 2018-07-06 2022-05-19 株式会社ディスコ ウェーハの加工方法
JP2020024968A (ja) * 2018-08-06 2020-02-13 株式会社ディスコ ウェーハの加工方法
JP2020024967A (ja) * 2018-08-06 2020-02-13 株式会社ディスコ ウェーハの加工方法
JP7191458B2 (ja) * 2018-08-06 2022-12-19 株式会社ディスコ ウェーハの加工方法
JP2020043150A (ja) * 2018-09-06 2020-03-19 株式会社ディスコ ウェーハの加工方法
JP2020043147A (ja) * 2018-09-06 2020-03-19 株式会社ディスコ ウェーハの加工方法
JP7175560B2 (ja) * 2018-09-06 2022-11-21 株式会社ディスコ ウェーハの加工方法
JP2020043149A (ja) * 2018-09-06 2020-03-19 株式会社ディスコ ウェーハの加工方法
JP2020043111A (ja) * 2018-09-06 2020-03-19 株式会社ディスコ ウェーハの加工方法
JP2020043148A (ja) * 2018-09-06 2020-03-19 株式会社ディスコ ウェーハの加工方法
JP2020043110A (ja) * 2018-09-06 2020-03-19 株式会社ディスコ ウェーハの加工方法
JP2020043146A (ja) * 2018-09-06 2020-03-19 株式会社ディスコ ウェーハの加工方法
JP7246825B2 (ja) * 2018-12-06 2023-03-28 株式会社ディスコ ウェーハの加工方法
CN109720623B (zh) * 2018-12-30 2024-05-14 上海仪电智能电子有限公司 一种轮胎植入式rfid电子标签压合设备及其压合方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319970A (en) 1976-08-10 1978-02-23 Mitsubishi Heavy Ind Ltd Treating method of exhaust gas
JP2001035817A (ja) * 1999-07-22 2001-02-09 Toshiba Corp ウェーハの分割方法及び半導体装置の製造方法
TWI340446B (en) * 2005-12-30 2011-04-11 Advanced Semiconductor Eng Method and device for preventing warpage of a substrate strip during semiconductor packaging and the substrate strip
JP4954569B2 (ja) * 2006-02-16 2012-06-20 日東電工株式会社 半導体装置の製造方法
JP2007235022A (ja) * 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
JP5157208B2 (ja) * 2006-03-20 2013-03-06 日立化成株式会社 ダイボンドダイシングシート
CN102942883B (zh) * 2006-04-26 2015-08-26 日立化成株式会社 粘接带及使用其的太阳能电池模块
JP5486831B2 (ja) * 2009-03-19 2014-05-07 積水化学工業株式会社 ダイシングテープ及び半導体チップの製造方法
KR101073698B1 (ko) * 2009-09-07 2011-10-14 도레이첨단소재 주식회사 점착테이프와 리드프레임의 라미네이션 방법
JP5487847B2 (ja) 2009-09-25 2014-05-14 日本電気株式会社 電子デバイスパッケージ及びその製造方法、並びに電子機器
CN102337089B (zh) * 2010-07-07 2014-01-29 古河电气工业株式会社 晶片加工用胶带和使用其的半导体加工方法
JP5066231B2 (ja) * 2010-07-28 2012-11-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、短冊状半導体裏面用フィルムの製造方法、及び、フリップチップ型半導体装置
JP5419226B2 (ja) * 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP2012236899A (ja) * 2011-05-11 2012-12-06 Hitachi Chemical Co Ltd 接着シートの製造方法
WO2014157471A1 (ja) * 2013-03-28 2014-10-02 古河電気工業株式会社 粘着テープおよびウエハ加工用テープ
JP6374199B2 (ja) * 2014-03-31 2018-08-15 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム及び積層フィルム

Also Published As

Publication number Publication date
CN108779375B (zh) 2020-11-10
WO2017168825A1 (ja) 2017-10-05
KR20180127361A (ko) 2018-11-28
MY190282A (en) 2022-04-12
JP2017179262A (ja) 2017-10-05
JP6422462B2 (ja) 2018-11-14
TWI632625B (zh) 2018-08-11
CN108779375A (zh) 2018-11-09
TW201737370A (zh) 2017-10-16
KR102165006B1 (ko) 2020-10-13

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