SG11201807161RA - Imprint apparatus, method of operating the same, and method of manufacturing article - Google Patents

Imprint apparatus, method of operating the same, and method of manufacturing article

Info

Publication number
SG11201807161RA
SG11201807161RA SG11201807161RA SG11201807161RA SG11201807161RA SG 11201807161R A SG11201807161R A SG 11201807161RA SG 11201807161R A SG11201807161R A SG 11201807161RA SG 11201807161R A SG11201807161R A SG 11201807161RA SG 11201807161R A SG11201807161R A SG 11201807161RA
Authority
SG
Singapore
Prior art keywords
substrate
imprint apparatus
cleaning
peripheral member
operating
Prior art date
Application number
SG11201807161RA
Other languages
English (en)
Inventor
Yoichi Matsuoka
Kiyohito Yamamoto
Hisanobu Azuma
Shigeru Terashima
Toshihiro Maeda
Masami Yonekawa
Keiji Emoto
Kazuki Nakagawa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Priority claimed from PCT/JP2017/005834 external-priority patent/WO2017145924A1/ja
Publication of SG11201807161RA publication Critical patent/SG11201807161RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201807161RA 2016-02-26 2017-02-17 Imprint apparatus, method of operating the same, and method of manufacturing article SG11201807161RA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016036315 2016-02-26
JP2016225379 2016-11-18
JP2017018915A JP6603678B2 (ja) 2016-02-26 2017-02-03 インプリント装置およびその動作方法ならびに物品製造方法
PCT/JP2017/005834 WO2017145924A1 (ja) 2016-02-26 2017-02-17 インプリント装置およびその動作方法ならびに物品製造方法

Publications (1)

Publication Number Publication Date
SG11201807161RA true SG11201807161RA (en) 2018-09-27

Family

ID=62493874

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807161RA SG11201807161RA (en) 2016-02-26 2017-02-17 Imprint apparatus, method of operating the same, and method of manufacturing article

Country Status (5)

Country Link
US (1) US11036149B2 (ja)
JP (1) JP6603678B2 (ja)
KR (1) KR102115879B1 (ja)
CN (1) CN108701585B (ja)
SG (1) SG11201807161RA (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6320183B2 (ja) * 2014-06-10 2018-05-09 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法
JP6735656B2 (ja) * 2016-11-18 2020-08-05 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09219432A (ja) * 1996-02-14 1997-08-19 Hitachi Ltd 気流搬送装置
JP3970464B2 (ja) * 1999-02-26 2007-09-05 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
JP3947374B2 (ja) * 2000-08-25 2007-07-18 エーエスエムエル ネザーランズ ビー．ブイ． 平板投影装置および素子製造方法
JP2002353086A (ja) * 2001-05-30 2002-12-06 Sony Corp 半導体製造装置及び半導体製造方法
JP2007017598A (ja) * 2005-07-06 2007-01-25 Sanyo Electric Co Ltd 液晶表示装置を具えた電子機器
JP2007017895A (ja) * 2005-07-11 2007-01-25 Fujifilm Holdings Corp 露光装置
JP2007317790A (ja) * 2006-05-24 2007-12-06 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5137635B2 (ja) 2007-03-16 2013-02-06 キヤノン株式会社 インプリント方法、チップの製造方法及びインプリント装置
JP4397942B2 (ja) * 2007-07-30 2010-01-13 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
JP2009117440A (ja) * 2007-11-02 2009-05-28 Creative Technology:Kk クリーニングウエハ
JP5235506B2 (ja) * 2008-06-02 2013-07-10 キヤノン株式会社 パターン転写装置及びデバイス製造方法
JP5108834B2 (ja) * 2009-06-24 2012-12-26 東京エレクトロン株式会社 テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
JP2012084654A (ja) * 2010-10-08 2012-04-26 Panasonic Corp ドライエッチング装置および基板の除電方法
JP5769451B2 (ja) * 2011-03-07 2015-08-26 キヤノン株式会社 インプリント装置および物品の製造方法
JP2013008911A (ja) * 2011-06-27 2013-01-10 Canon Inc クリーニング方法、それを用いたインプリント装置および物品の製造方法
JP5537517B2 (ja) * 2011-09-09 2014-07-02 株式会社東芝 テンプレート洗浄装置
JP5787691B2 (ja) 2011-09-21 2015-09-30 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
WO2013173578A2 (en) 2012-05-18 2013-11-21 Rave N.P., Inc. Contamination removal apparatus and method
JP6171412B2 (ja) 2013-03-06 2017-08-02 大日本印刷株式会社 インプリント方法、インプリント用のモールドおよびインプリント装置
JP6123396B2 (ja) * 2013-03-18 2017-05-10 大日本印刷株式会社 インプリント方法およびインプリント装置
JP6210935B2 (ja) * 2013-11-13 2017-10-11 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP5865340B2 (ja) * 2013-12-10 2016-02-17 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6313591B2 (ja) 2013-12-20 2018-04-18 キヤノン株式会社 インプリント装置、異物除去方法及び物品の製造方法
JP2015149390A (ja) * 2014-02-06 2015-08-20 キヤノン株式会社 インプリント装置、型、および物品の製造方法
JP6661397B2 (ja) * 2015-04-22 2020-03-11 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

Also Published As

Publication number Publication date
CN108701585B (zh) 2023-09-26
US20180356741A1 (en) 2018-12-13
JP6603678B2 (ja) 2019-11-06
US11036149B2 (en) 2021-06-15
KR20180115286A (ko) 2018-10-22
CN108701585A (zh) 2018-10-23
KR102115879B1 (ko) 2020-05-27
JP2018088511A (ja) 2018-06-07

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