SG11201807161RA - Imprint apparatus, method of operating the same, and method of manufacturing article - Google Patents

Imprint apparatus, method of operating the same, and method of manufacturing article

Info

Publication number
SG11201807161RA
SG11201807161RA SG11201807161RA SG11201807161RA SG11201807161RA SG 11201807161R A SG11201807161R A SG 11201807161RA SG 11201807161R A SG11201807161R A SG 11201807161RA SG 11201807161R A SG11201807161R A SG 11201807161RA SG 11201807161R A SG11201807161R A SG 11201807161RA
Authority
SG
Singapore
Prior art keywords
substrate
imprint apparatus
cleaning
peripheral member
operating
Prior art date
Application number
SG11201807161RA
Inventor
Yoichi Matsuoka
Kiyohito Yamamoto
Hisanobu Azuma
Shigeru Terashima
Toshihiro Maeda
Masami Yonekawa
Keiji Emoto
Kazuki Nakagawa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Priority claimed from PCT/JP2017/005834 external-priority patent/WO2017145924A1/en
Publication of SG11201807161RA publication Critical patent/SG11201807161RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

An imprint apparatus forms a pattern on a substrate (101) by curing an imprint material on the substrate while the imprint material is in contact with a mold. The imprint apparatus includes a substrate chuck (102) having a substrate holding region for holding the substrate, a peripheral member (113) arranged to 5 surround the side surface of the substrate held by the substrate chuck, and a control unit configured to control a cleaning process for cleaning at least a partial region of the peripheral member by using a cleaning member (170) including a charging unit. The cleaning process includes an operation for attracting a particle in the partial region to the charging unit by moving the cleaning member 10 relative to the peripheral member while the charging unit faces at least the partial region of the peripheral member.
SG11201807161RA 2016-02-26 2017-02-17 Imprint apparatus, method of operating the same, and method of manufacturing article SG11201807161RA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016036315 2016-02-26
JP2016225379 2016-11-18
JP2017018915A JP6603678B2 (en) 2016-02-26 2017-02-03 Imprint apparatus, operation method thereof, and article manufacturing method
PCT/JP2017/005834 WO2017145924A1 (en) 2016-02-26 2017-02-17 Imprint device, operating method for same, and method for manufacturing article

Publications (1)

Publication Number Publication Date
SG11201807161RA true SG11201807161RA (en) 2018-09-27

Family

ID=62493874

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807161RA SG11201807161RA (en) 2016-02-26 2017-02-17 Imprint apparatus, method of operating the same, and method of manufacturing article

Country Status (5)

Country Link
US (1) US11036149B2 (en)
JP (1) JP6603678B2 (en)
KR (1) KR102115879B1 (en)
CN (1) CN108701585B (en)
SG (1) SG11201807161RA (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6320183B2 (en) * 2014-06-10 2018-05-09 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method
JP6735656B2 (en) * 2016-11-18 2020-08-05 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method
CN114675496A (en) * 2020-12-24 2022-06-28 无锡迪思微电子有限公司 Cavity purifying method, purifying equipment and electron beam exposure device
JP2023132506A (en) 2022-03-11 2023-09-22 キオクシア株式会社 Imprint method, method for manufacturing semiconductor device, and imprint device

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09219432A (en) * 1996-02-14 1997-08-19 Hitachi Ltd Air stream transport apparatus
JP3970464B2 (en) * 1999-02-26 2007-09-05 株式会社ルネサステクノロジ Manufacturing method of semiconductor integrated circuit device
US6781673B2 (en) * 2000-08-25 2004-08-24 Asml Netherlands B.V. Mask handling apparatus, lithographic projection apparatus, device manufacturing method and device manufactured thereby
JP2002353086A (en) * 2001-05-30 2002-12-06 Sony Corp Apparatus and method for manufacturing semiconductor
JP2007017598A (en) * 2005-07-06 2007-01-25 Sanyo Electric Co Ltd Electronic apparatus equipped with liquid crystal display device
JP2007017895A (en) * 2005-07-11 2007-01-25 Fujifilm Holdings Corp Exposure apparatus
JP2007317790A (en) * 2006-05-24 2007-12-06 Dainippon Screen Mfg Co Ltd Substrate-treating apparatus and substrate treatment method
JP5137635B2 (en) 2007-03-16 2013-02-06 キヤノン株式会社 Imprint method, chip manufacturing method, and imprint apparatus
JP4397942B2 (en) * 2007-07-30 2010-01-13 株式会社ルネサステクノロジ Manufacturing method of semiconductor integrated circuit device
JP2009117440A (en) * 2007-11-02 2009-05-28 Creative Technology:Kk Cleaning wafer
JP5235506B2 (en) * 2008-06-02 2013-07-10 キヤノン株式会社 Pattern transfer apparatus and device manufacturing method
JP5108834B2 (en) * 2009-06-24 2012-12-26 東京エレクトロン株式会社 Template processing apparatus, imprint system, release agent processing method, program, and computer storage medium
JP2012084654A (en) * 2010-10-08 2012-04-26 Panasonic Corp Dry etching device and neutralization method of substrate
JP5769451B2 (en) * 2011-03-07 2015-08-26 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP2013008911A (en) * 2011-06-27 2013-01-10 Canon Inc Cleaning method, imprint device using the same and manufacturing method of article
JP5537517B2 (en) * 2011-09-09 2014-07-02 株式会社東芝 Template cleaning device
JP5787691B2 (en) 2011-09-21 2015-09-30 キヤノン株式会社 Imprint apparatus and article manufacturing method using the same
JP6336439B2 (en) 2012-05-18 2018-06-06 レイヴ エヌ．ピー． インコーポレイテッド Contaminant removal apparatus and method
JP6171412B2 (en) 2013-03-06 2017-08-02 大日本印刷株式会社 Imprint method, imprint mold and imprint apparatus
JP6123396B2 (en) * 2013-03-18 2017-05-10 大日本印刷株式会社 Imprint method and imprint apparatus
JP6210935B2 (en) * 2013-11-13 2017-10-11 東京エレクトロン株式会社 Polishing and cleaning mechanism, substrate processing apparatus, and substrate processing method
JP5865340B2 (en) * 2013-12-10 2016-02-17 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP6313591B2 (en) 2013-12-20 2018-04-18 キヤノン株式会社 Imprint apparatus, foreign matter removing method, and article manufacturing method
JP2015149390A (en) * 2014-02-06 2015-08-20 キヤノン株式会社 Imprint device, die, and method of manufacturing article
JP6661397B2 (en) * 2015-04-22 2020-03-11 キヤノン株式会社 Imprint apparatus, imprint method, and article manufacturing method

Also Published As

Publication number Publication date
JP6603678B2 (en) 2019-11-06
US11036149B2 (en) 2021-06-15
CN108701585B (en) 2023-09-26
KR20180115286A (en) 2018-10-22
JP2018088511A (en) 2018-06-07
US20180356741A1 (en) 2018-12-13
KR102115879B1 (en) 2020-05-27
CN108701585A (en) 2018-10-23

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