SG11201802822PA - Silver powder and method for producing same - Google Patents

Silver powder and method for producing same

Info

Publication number
SG11201802822PA
SG11201802822PA SG11201802822PA SG11201802822PA SG11201802822PA SG 11201802822P A SG11201802822P A SG 11201802822PA SG 11201802822P A SG11201802822P A SG 11201802822PA SG 11201802822P A SG11201802822P A SG 11201802822PA SG 11201802822P A SG11201802822P A SG 11201802822PA
Authority
SG
Singapore
Prior art keywords
silver powder
producing same
producing
same
silver
Prior art date
Application number
SG11201802822PA
Other languages
English (en)
Inventor
Atsushi Ebara
Kenichi Inoue
Yoshiyuki Michiaki
Takahiro Yamada
Masahiro Yoshida
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Priority claimed from PCT/JP2016/004706 external-priority patent/WO2017073057A1/ja
Publication of SG11201802822PA publication Critical patent/SG11201802822PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/69—Particle size larger than 1000 nm
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
    • B22F2009/0828—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid with water
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
SG11201802822PA 2015-10-30 2016-10-26 Silver powder and method for producing same SG11201802822PA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015213682 2015-10-30
JP2016204799A JP6856350B2 (ja) 2015-10-30 2016-10-19 銀粉およびその製造方法
PCT/JP2016/004706 WO2017073057A1 (ja) 2015-10-30 2016-10-26 銀粉およびその製造方法

Publications (1)

Publication Number Publication Date
SG11201802822PA true SG11201802822PA (en) 2018-05-30

Family

ID=58713963

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201802822PA SG11201802822PA (en) 2015-10-30 2016-10-26 Silver powder and method for producing same

Country Status (7)

Country Link
US (2) US10828702B2 (zh)
EP (1) EP3357608B1 (zh)
JP (2) JP6856350B2 (zh)
KR (1) KR102446788B1 (zh)
CN (1) CN108349009A (zh)
SG (1) SG11201802822PA (zh)
TW (1) TWI734710B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7090511B2 (ja) * 2017-09-29 2022-06-24 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
CN113226595B (zh) * 2018-12-26 2023-07-28 昭荣化学工业株式会社 银浆
KR20210107067A (ko) * 2018-12-26 2021-08-31 쇼에이 가가쿠 가부시키가이샤 은 페이스트
JP7447804B2 (ja) * 2018-12-26 2024-03-12 昭栄化学工業株式会社 積層インダクタの内部電極形成用銀ペースト
KR102263618B1 (ko) * 2019-03-29 2021-06-10 대주전자재료 주식회사 혼합 은 분말 및 이를 포함하는 도전성 페이스트
JP7334076B2 (ja) * 2019-06-27 2023-08-28 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4298553A (en) * 1969-09-04 1981-11-03 Metal Innovations, Inc. Method of producing low oxide metal powders
JPS60152605A (ja) * 1984-01-19 1985-08-10 Natl Res Inst For Metals 溶融金属の噴霧微粉化装置
GB2203167B (en) * 1987-03-25 1990-11-28 Matsushita Electric Works Ltd Composite conductive material and method for manufacturing same
JPH01180901A (ja) * 1988-01-08 1989-07-18 Kobe Steel Ltd 電気接点材料用銀ニッケル複合粉末及びその製造方法
JPH0791608B2 (ja) 1990-06-21 1995-10-04 松下電工株式会社 接点材料およびその製造方法
JPH07188702A (ja) * 1993-12-27 1995-07-25 Matsushita Electric Works Ltd Ａｇ基合金粉末及びその製造方法
CN1058918C (zh) * 1996-05-07 2000-11-29 机械工业部桂林电器科学研究所 一种高压水雾化银粉的制造方法
JP3150932B2 (ja) 1997-12-02 2001-03-26 第一工業製薬株式会社 セラミック多層回路基板用導電ペースト
EP1285710B1 (en) * 2000-04-21 2012-04-04 Central Research Institute of Electric Power Industry Method for producing fine particles
JP4569727B2 (ja) 2000-09-08 2010-10-27 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP2005008930A (ja) 2003-06-18 2005-01-13 Nippon Atomized Metal Powers Corp 金属粉末、金属粉末製造装置および金属粉末製造方法
JP4976642B2 (ja) * 2004-02-10 2012-07-18 三井金属鉱業株式会社 高結晶性銀粉及びその製造方法
JP2006002228A (ja) * 2004-06-18 2006-01-05 Dowa Mining Co Ltd 球状銀粉およびその製造方法
JP4805621B2 (ja) 2005-07-07 2011-11-02 株式会社ノリタケカンパニーリミテド 導電性ペースト
JP2007084906A (ja) * 2005-09-26 2007-04-05 Fukuda Metal Foil & Powder Co Ltd Ａｇ系金属粉末及びＣｕ系金属粉末並びにその製造方法
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JP2008007859A (ja) * 2006-03-30 2008-01-17 Mitsui Mining & Smelting Co Ltd 銀粒子
JP5922388B2 (ja) * 2011-12-07 2016-05-24 三井金属鉱業株式会社 焼結型導電性ペースト用銀粉
JP2013139589A (ja) * 2011-12-28 2013-07-18 Toda Kogyo Corp 銀微粒子及びその製造法並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
JP2014005531A (ja) * 2012-01-17 2014-01-16 Dowa Electronics Materials Co Ltd 銀被覆銅合金粉末およびその製造方法
KR20140135718A (ko) * 2012-03-07 2014-11-26 스미토모 긴조쿠 고잔 가부시키가이샤 은분 및 그의 제조 방법
JP2016141817A (ja) * 2015-01-29 2016-08-08 Ｄｏｗａエレクトロニクス株式会社 水アトマイズ法による金属粉末の製造方法
JP6804286B2 (ja) * 2015-12-28 2020-12-23 Ｄｏｗａエレクトロニクス株式会社 銀合金粉末およびその製造方法
JP7039126B2 (ja) * 2016-12-28 2022-03-22 Ｄｏｗａエレクトロニクス株式会社 銅粉およびその製造方法

Also Published As

Publication number Publication date
KR102446788B1 (ko) 2022-09-22
JP6856350B2 (ja) 2021-04-07
US20210078081A1 (en) 2021-03-18
KR20180075582A (ko) 2018-07-04
TWI734710B (zh) 2021-08-01
JP2021075799A (ja) 2021-05-20
EP3357608A4 (en) 2019-05-01
JP7110421B2 (ja) 2022-08-01
EP3357608B1 (en) 2023-02-22
CN108349009A (zh) 2018-07-31
US10828702B2 (en) 2020-11-10
JP2017082327A (ja) 2017-05-18
TW201732046A (zh) 2017-09-16
US20180326497A1 (en) 2018-11-15
US11407030B2 (en) 2022-08-09
EP3357608A1 (en) 2018-08-08

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