SG11201709953TA - Conductive probe for inspection and semiconductor inspection device - Google Patents

Conductive probe for inspection and semiconductor inspection device

Info

Publication number
SG11201709953TA
SG11201709953TA SG11201709953TA SG11201709953TA SG11201709953TA SG 11201709953T A SG11201709953T A SG 11201709953TA SG 11201709953T A SG11201709953T A SG 11201709953TA SG 11201709953T A SG11201709953T A SG 11201709953TA SG 11201709953T A SG11201709953T A SG 11201709953TA
Authority
SG
Singapore
Prior art keywords
inspection
conductive probe
semiconductor
inspection device
semiconductor inspection
Prior art date
Application number
SG11201709953TA
Other languages
English (en)
Inventor
Kohei Hironaka
Kazuya Souma
Satoshi Shoji
Ryosuke Yamaguchi
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of SG11201709953TA publication Critical patent/SG11201709953TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201709953TA 2016-02-15 2017-02-01 Conductive probe for inspection and semiconductor inspection device SG11201709953TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016026041 2016-02-15
PCT/JP2017/003586 WO2017141706A1 (ja) 2016-02-15 2017-02-01 検査用導電性接触子、および半導体検査装置

Publications (1)

Publication Number Publication Date
SG11201709953TA true SG11201709953TA (en) 2018-01-30

Family

ID=59626041

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709953TA SG11201709953TA (en) 2016-02-15 2017-02-01 Conductive probe for inspection and semiconductor inspection device

Country Status (6)

Country Link
US (1) US10274517B2 (ja)
JP (1) JP6243584B1 (ja)
PH (1) PH12017502189A1 (ja)
SG (1) SG11201709953TA (ja)
TW (1) TWI629484B (ja)
WO (1) WO2017141706A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018084438A (ja) * 2016-11-21 2018-05-31 株式会社エンプラス 電気接触子及び電気部品用ソケット
KR102212346B1 (ko) * 2019-12-17 2021-02-04 주식회사 제네드 프로브 핀

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4174148A (en) * 1977-12-16 1979-11-13 Amerace Corporation Electrical terminal clamp assembly
US4417206A (en) * 1981-03-09 1983-11-22 Virginia Panel Corporation Electrical contact probe and method of manufacturing
JPS5896259U (ja) 1981-12-22 1983-06-30 富士通株式会社 接触ピン
US4571540A (en) * 1983-09-14 1986-02-18 Virginia Panel Corporation Electrical contact probe
JPS6179273U (ja) 1984-10-29 1986-05-27
JPH10214649A (ja) 1997-01-30 1998-08-11 Yokowo Co Ltd スプリングコネクタおよび該スプリングコネクタを用いた装置
JP2000329789A (ja) 1999-03-12 2000-11-30 Sony Chem Corp 針状接点プローブ
US6759858B2 (en) * 1999-10-20 2004-07-06 Intel Corporation Integrated circuit test probe having ridge contact
US8253430B2 (en) * 2005-04-22 2012-08-28 Hewlett-Packard Development Company Circuit board testing using a probe
JP2008157904A (ja) 2006-12-25 2008-07-10 Shuichi Ikeda 電気テスト用接触子
JP2009198238A (ja) 2008-02-20 2009-09-03 Totoku Electric Co Ltd プローブ針及びその製造方法
JP5406310B2 (ja) * 2009-12-11 2014-02-05 日本発條株式会社 コンタクトプローブ
JP5597108B2 (ja) * 2010-11-29 2014-10-01 株式会社精研 接触検査用治具
JP5783715B2 (ja) 2010-12-20 2015-09-24 ユニテクノ株式会社 検査用コンタクトプローブ
WO2013018809A1 (ja) 2011-08-02 2013-02-07 日本発條株式会社 プローブユニット
JP2013130516A (ja) 2011-12-22 2013-07-04 Yamaichi Electronics Co Ltd コンタクトプローブ及びそれを備えた半導体素子用ソケット
JP2014085207A (ja) * 2012-10-23 2014-05-12 Renesas Electronics Corp 半導体装置テスト用プローブピン

Also Published As

Publication number Publication date
TWI629484B (zh) 2018-07-11
JP6243584B1 (ja) 2017-12-06
US10274517B2 (en) 2019-04-30
US20180238932A1 (en) 2018-08-23
WO2017141706A1 (ja) 2017-08-24
TW201802479A (zh) 2018-01-16
PH12017502189B1 (en) 2018-06-11
JPWO2017141706A1 (ja) 2018-02-22
PH12017502189A1 (en) 2018-06-11

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