SG11201708850VA - Tape for semiconductor processing - Google Patents
Tape for semiconductor processingInfo
- Publication number
- SG11201708850VA SG11201708850VA SG11201708850VA SG11201708850VA SG11201708850VA SG 11201708850V A SG11201708850V A SG 11201708850VA SG 11201708850V A SG11201708850V A SG 11201708850VA SG 11201708850V A SG11201708850V A SG 11201708850VA SG 11201708850V A SG11201708850V A SG 11201708850VA
- Authority
- SG
- Singapore
- Prior art keywords
- tape
- metal layer
- semiconductor processing
- adhesive layer
- semiconductor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09J171/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015255312 | 2015-12-25 | ||
PCT/JP2016/079626 WO2017110202A1 (ja) | 2015-12-25 | 2016-10-05 | 半導体加工用テープ |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201708850VA true SG11201708850VA (en) | 2018-07-30 |
Family
ID=59089986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201708850VA SG11201708850VA (en) | 2015-12-25 | 2016-10-05 | Tape for semiconductor processing |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6757743B2 (ja) |
KR (1) | KR102580602B1 (ja) |
CN (1) | CN107614641B (ja) |
MY (1) | MY184346A (ja) |
PH (1) | PH12017502122B1 (ja) |
SG (1) | SG11201708850VA (ja) |
TW (1) | TWI636886B (ja) |
WO (1) | WO2017110202A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102561868B1 (ko) * | 2017-07-25 | 2023-07-31 | 세키스이가가쿠 고교가부시키가이샤 | 반도체 보호용 점착 테이프 및 반도체를 처리하는 방법 |
CN109454955B (zh) * | 2018-12-19 | 2021-07-06 | 广东生益科技股份有限公司 | 一种封装载带基材及其制备方法 |
JP7512848B2 (ja) | 2020-11-02 | 2024-07-09 | 大日本印刷株式会社 | 積層体および積層体の製造方法 |
CN115410927A (zh) * | 2022-09-29 | 2022-11-29 | 北京超材信息科技有限公司 | 半导体器件的切割方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1167699A (ja) * | 1997-08-13 | 1999-03-09 | Texas Instr Japan Ltd | 半導体装置の製造方法 |
JP3071764B2 (ja) * | 1998-08-31 | 2000-07-31 | 京セラ株式会社 | 金属箔付きフィルム及びそれを用いた配線基板の製造方法 |
JP2003298230A (ja) * | 2002-03-28 | 2003-10-17 | Tokai Rubber Ind Ltd | フレキシブルプリント配線板用基材 |
JP2004189981A (ja) * | 2002-12-13 | 2004-07-08 | Kanegafuchi Chem Ind Co Ltd | 熱可塑性ポリイミド樹脂材料および積層体およびプリント配線板の製造方法 |
JP2006103108A (ja) * | 2004-10-04 | 2006-04-20 | Sekisui Chem Co Ltd | 金属箔付フィルム |
JP4865312B2 (ja) | 2005-12-05 | 2012-02-01 | 古河電気工業株式会社 | チップ用保護膜形成用シート |
JP2007235022A (ja) | 2006-03-03 | 2007-09-13 | Mitsui Chemicals Inc | 接着フィルム |
JP4849993B2 (ja) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | 粘着シート、その製造方法および積層セラミックシートの切断方法 |
JP5298913B2 (ja) * | 2009-02-12 | 2013-09-25 | 信越化学工業株式会社 | 接着剤組成物およびそれを用いた半導体ウエハ用保護シート |
JP5486831B2 (ja) * | 2009-03-19 | 2014-05-07 | 積水化学工業株式会社 | ダイシングテープ及び半導体チップの製造方法 |
JP5681374B2 (ja) * | 2010-04-19 | 2015-03-04 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム |
JP5356326B2 (ja) * | 2010-07-20 | 2013-12-04 | 日東電工株式会社 | 半導体装置の製造方法 |
JP5419226B2 (ja) * | 2010-07-29 | 2014-02-19 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム及びその用途 |
JP6144868B2 (ja) * | 2010-11-18 | 2017-06-07 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法 |
JP6007576B2 (ja) * | 2012-05-09 | 2016-10-12 | 日立化成株式会社 | 半導体装置の製造方法 |
JP6213055B2 (ja) * | 2013-08-26 | 2017-10-18 | 日立化成株式会社 | ウェハ加工用テープ |
JP2015129247A (ja) * | 2014-01-09 | 2015-07-16 | 住友ベークライト株式会社 | 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、ダイシングテープ兼バックグラインドテープ一体型接着シート、および、電子装置 |
JP6229528B2 (ja) * | 2014-02-17 | 2017-11-15 | 日立化成株式会社 | 半導体装置の製造方法、半導体装置及び接着剤組成物 |
TWI653312B (zh) * | 2014-03-11 | 2019-03-11 | 日商味之素股份有限公司 | 接著薄膜 |
JP6299315B2 (ja) * | 2014-03-20 | 2018-03-28 | 日立化成株式会社 | ウエハ加工用テープ |
JP6078578B2 (ja) * | 2015-04-22 | 2017-02-08 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム及びその用途 |
-
2016
- 2016-10-05 CN CN201680032247.9A patent/CN107614641B/zh active Active
- 2016-10-05 KR KR1020177034527A patent/KR102580602B1/ko active IP Right Grant
- 2016-10-05 MY MYPI2017001618A patent/MY184346A/en unknown
- 2016-10-05 JP JP2017557750A patent/JP6757743B2/ja active Active
- 2016-10-05 SG SG11201708850VA patent/SG11201708850VA/en unknown
- 2016-10-05 WO PCT/JP2016/079626 patent/WO2017110202A1/ja active Application Filing
- 2016-12-22 TW TW105142784A patent/TWI636886B/zh active
-
2017
- 2017-11-21 PH PH12017502122A patent/PH12017502122B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2017110202A1 (ja) | 2017-06-29 |
PH12017502122A1 (en) | 2018-05-28 |
CN107614641B (zh) | 2021-07-09 |
PH12017502122B1 (en) | 2018-05-28 |
TWI636886B (zh) | 2018-10-01 |
KR102580602B1 (ko) | 2023-09-20 |
TW201728443A (zh) | 2017-08-16 |
MY184346A (en) | 2021-04-01 |
KR20180097445A (ko) | 2018-08-31 |
JP6757743B2 (ja) | 2020-09-23 |
JPWO2017110202A1 (ja) | 2018-10-11 |
CN107614641A (zh) | 2018-01-19 |
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