SG11201700896XA - Copper-nickel alloy electroplating bath - Google Patents
Copper-nickel alloy electroplating bathInfo
- Publication number
- SG11201700896XA SG11201700896XA SG11201700896XA SG11201700896XA SG11201700896XA SG 11201700896X A SG11201700896X A SG 11201700896XA SG 11201700896X A SG11201700896X A SG 11201700896XA SG 11201700896X A SG11201700896X A SG 11201700896XA SG 11201700896X A SG11201700896X A SG 11201700896XA
- Authority
- SG
- Singapore
- Prior art keywords
- copper
- nickel alloy
- electroplating bath
- alloy electroplating
- bath
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014162802A JP6439172B2 (ja) | 2014-08-08 | 2014-08-08 | 銅−ニッケル合金電気めっき浴 |
| PCT/JP2015/069944 WO2016021369A1 (ja) | 2014-08-08 | 2015-07-10 | 銅－ニッケル合金電気めっき浴 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201700896XA true SG11201700896XA (en) | 2017-03-30 |
Family
ID=55263643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201700896XA SG11201700896XA (en) | 2014-08-08 | 2015-07-10 | Copper-nickel alloy electroplating bath |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US10316421B2 (ja) |
| EP (1) | EP3178968B1 (ja) |
| JP (1) | JP6439172B2 (ja) |
| KR (1) | KR102001322B1 (ja) |
| CN (1) | CN106574387B (ja) |
| BR (1) | BR112017002269A2 (ja) |
| MX (1) | MX2017001680A (ja) |
| PH (1) | PH12017500218B1 (ja) |
| RU (1) | RU2666391C1 (ja) |
| SG (1) | SG11201700896XA (ja) |
| TW (1) | TWI652378B (ja) |
| WO (1) | WO2016021369A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110062820B (zh) * | 2016-12-16 | 2021-07-20 | 柯尼卡美能达株式会社 | 透明导电膜的形成方法以及电镀用镀敷液 |
| KR102388225B1 (ko) * | 2018-02-22 | 2022-04-18 | 코니카 미놀타 가부시키가이샤 | 패턴 형성 방법 |
| RU2694398C1 (ru) * | 2018-12-14 | 2019-07-12 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Елецкий государственный университет им. И.А. Бунина" | Электролит для получения сплавов железо-никель |
| CN111321437B (zh) * | 2020-03-31 | 2021-04-27 | 安徽铜冠铜箔集团股份有限公司 | 铜镍合金箔及其电沉积制备方法 |
| AU2021297185A1 (en) * | 2020-06-22 | 2023-02-16 | Offgrid Energy Labs Inc. | Novel eutectic solvent |
| KR102587490B1 (ko) * | 2022-12-05 | 2023-10-11 | 동국제강 주식회사 | 내식성이 우수한 클래드 후강판용 슬래브의 도금 방법 및 이 도금 방법으로 제조된 내식성이 우수한 클래드 후강판용 슬래브 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1837835A (en) * | 1926-12-20 | 1931-12-22 | Gen Spring Bumper Corp | Process for electrodepositing bright nickel |
| US3833481A (en) | 1972-12-18 | 1974-09-03 | Buckbel Mears Co | Electroforming nickel copper alloys |
| JPS58133392A (ja) * | 1982-02-01 | 1983-08-09 | Oosakashi | 光沢銅−ニツケル−コバルト合金電気めつき浴 |
| JPS58133391A (ja) * | 1982-02-01 | 1983-08-09 | Oosakashi | 光沢銅−ニツケル合金電気めつき浴 |
| JPH02285091A (ja) | 1989-04-26 | 1990-11-22 | Kobe Steel Ltd | ニッケル―銅合金めっき浴 |
| JPH04198499A (ja) * | 1990-07-20 | 1992-07-17 | Asahi Glass Co Ltd | 電位調節機構を有する銅溶解槽 |
| JPH0598488A (ja) * | 1991-06-05 | 1993-04-20 | Daiwa Kasei Kenkyusho:Kk | 銅−ニツケル合金電気メツキ浴 |
| RU2106436C1 (ru) * | 1996-07-22 | 1998-03-10 | Тюменский государственный нефтегазовый университет | Электролит для осаждения сплава медь - никель |
| RU2365683C1 (ru) * | 2008-09-30 | 2009-08-27 | Государственное образовательное учреждение высшего профессионального образования "Пензенский государственный университет" (ПГУ) | Сульфосалицилатный электролит для осаждения сплава медь-никель |
| KR101077890B1 (ko) * | 2008-12-26 | 2011-10-31 | 주식회사 포스코 | 아연-니켈 전기 도금액용 첨가제 조성물, 이를 포함하는 아연-니켈 전기 도금액 조성물 및 이를 이용한 아연-니켈전기도금강판의 제조방법 |
| KR101649435B1 (ko) * | 2012-04-19 | 2016-08-19 | 딥솔 가부시키가이샤 | 구리-니켈 합금 전기 도금 욕 및 도금 방법 |
| CN104233302B (zh) * | 2014-09-15 | 2016-09-14 | 南通万德科技有限公司 | 一种蚀刻液及其应用 |
-
2014
- 2014-08-08 JP JP2014162802A patent/JP6439172B2/ja active Active
-
2015
- 2015-07-10 SG SG11201700896XA patent/SG11201700896XA/en unknown
- 2015-07-10 US US15/502,197 patent/US10316421B2/en active Active
- 2015-07-10 WO PCT/JP2015/069944 patent/WO2016021369A1/ja active Application Filing
- 2015-07-10 BR BR112017002269-9A patent/BR112017002269A2/ja not_active IP Right Cessation
- 2015-07-10 MX MX2017001680A patent/MX2017001680A/es unknown
- 2015-07-10 EP EP15829590.7A patent/EP3178968B1/en active Active
- 2015-07-10 KR KR1020177006127A patent/KR102001322B1/ko active IP Right Grant
- 2015-07-10 RU RU2017107186A patent/RU2666391C1/ru not_active IP Right Cessation
- 2015-07-10 CN CN201580041242.8A patent/CN106574387B/zh active Active
- 2015-07-22 TW TW104123663A patent/TWI652378B/zh active
-
2017
- 2017-02-06 PH PH12017500218A patent/PH12017500218B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6439172B2 (ja) | 2018-12-19 |
| MX2017001680A (es) | 2017-05-09 |
| US20170241031A1 (en) | 2017-08-24 |
| WO2016021369A1 (ja) | 2016-02-11 |
| EP3178968A1 (en) | 2017-06-14 |
| EP3178968B1 (en) | 2019-09-04 |
| US10316421B2 (en) | 2019-06-11 |
| BR112017002269A2 (ja) | 2018-01-16 |
| JP2016037649A (ja) | 2016-03-22 |
| CN106574387A (zh) | 2017-04-19 |
| EP3178968A4 (en) | 2018-01-17 |
| RU2666391C1 (ru) | 2018-09-07 |
| TWI652378B (zh) | 2019-03-01 |
| PH12017500218A1 (en) | 2017-07-10 |
| PH12017500218B1 (en) | 2017-07-10 |
| TW201610241A (zh) | 2016-03-16 |
| KR20170038918A (ko) | 2017-04-07 |
| CN106574387B (zh) | 2019-10-18 |
| KR102001322B1 (ko) | 2019-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| HK1243742A1 (zh) | 含銅金屬合金 | |
| EP3042985A4 (en) | ZINKLEGIERUNGSPLATTIERUNGSVERFAHREN | |
| PL3186414T3 (pl) | Powłoki elektrolityczne | |
| AU362192S (en) | Bath | |
| EP3042984A4 (en) | ZINKLEGIERUNGSPLATTIERUNGSVERFAHREN | |
| HK1200506A1 (en) | Cyanide-free electroplating solution and application thereof | |
| TWD174559S (zh) | 浴缸之部分 | |
| SG11201700896XA (en) | Copper-nickel alloy electroplating bath | |
| SG10201504959UA (en) | Plating method | |
| HUE049929T2 (hu) | Elektrolit galvanizáláshoz | |
| EP3212823A4 (en) | Plating bath solutions | |
| GB201421949D0 (en) | Alloy | |
| GB201617227D0 (en) | Nickel alloy | |
| SG11201703049XA (en) | Copper-Nickel Alloy Electroplating Apparatus | |
| HK1232261A1 (zh) | 銅-錫合金鍍敷浴 | |
| GB201408299D0 (en) | An alloy | |
| GB201401906D0 (en) | Alloy | |
| GB2542519B (en) | Low ductility alloy | |
| PL3440022T3 (pl) | Stop miedzi | |
| ZA201503920B (en) | Direct electrowinning of nickel | |
| TWM489874U (en) | Electroplating fixture | |
| GB201414431D0 (en) | Improved electrodeposition | |
| SG10201407143TA (en) | Plating rack | |
| ZA201705111B (en) | Alloys | |
| GB201615166D0 (en) | Nickel alloy plating |