SG11201605980SA - Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board - Google Patents
Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring boardInfo
- Publication number
- SG11201605980SA SG11201605980SA SG11201605980SA SG11201605980SA SG11201605980SA SG 11201605980S A SG11201605980S A SG 11201605980SA SG 11201605980S A SG11201605980S A SG 11201605980SA SG 11201605980S A SG11201605980S A SG 11201605980SA SG 11201605980S A SG11201605980S A SG 11201605980SA
- Authority
- SG
- Singapore
- Prior art keywords
- wiring board
- printed wiring
- prepreg
- metal foil
- composite sheet
- Prior art date
Links
- 239000000805 composite resin Substances 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014019555 | 2014-02-04 | ||
PCT/JP2015/053017 WO2015119121A1 (ja) | 2014-02-04 | 2015-02-03 | プリント配線板用樹脂組成物、プリプレグ、金属箔張り積層板、樹脂複合シート、及びプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201605980SA true SG11201605980SA (en) | 2016-09-29 |
Family
ID=53777925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201605980SA SG11201605980SA (en) | 2014-02-04 | 2015-02-03 | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board |
Country Status (8)
Country | Link |
---|---|
US (1) | US10034371B2 (ko) |
EP (1) | EP3103825B1 (ko) |
JP (1) | JP6465362B2 (ko) |
KR (1) | KR102258869B1 (ko) |
CN (1) | CN105960427B (ko) |
SG (1) | SG11201605980SA (ko) |
TW (1) | TWI636084B (ko) |
WO (1) | WO2015119121A1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3312213B1 (en) * | 2015-06-17 | 2020-01-01 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board |
KR20170117879A (ko) * | 2016-04-14 | 2017-10-24 | 스미또모 가가꾸 가부시끼가이샤 | 적층 필름, 적층 필름의 제조 방법 및 led 탑재 기판 |
WO2018139368A1 (ja) * | 2017-01-26 | 2018-08-02 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
WO2018190292A1 (ja) * | 2017-04-10 | 2018-10-18 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
CN110997755B (zh) * | 2017-08-21 | 2022-05-03 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板、树脂片及印刷布线板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931545A (en) | 1989-05-03 | 1990-06-05 | Hi-Tek Polymers, Inc. | Flame retardant polycyanate ester blend |
JPH06271669A (ja) | 1993-03-19 | 1994-09-27 | Sumitomo Bakelite Co Ltd | 難燃性低誘電率熱硬化性樹脂組成物 |
JPH11124433A (ja) | 1997-10-22 | 1999-05-11 | Mitsubishi Gas Chem Co Inc | フェノールノボラック型シアン酸エステルプレポリマー |
JP2000191776A (ja) | 1998-12-24 | 2000-07-11 | Mitsubishi Gas Chem Co Inc | シアン酸エステル・コ−プレポリマー |
JP3081996U (ja) | 2001-05-22 | 2001-11-22 | 日本ザンパック株式会社 | 冷凍固形食品用容器 |
JP2004175925A (ja) * | 2002-11-27 | 2004-06-24 | Mitsubishi Gas Chem Co Inc | プリプレグ及び積層板 |
JP2004182850A (ja) * | 2002-12-03 | 2004-07-02 | Mitsubishi Gas Chem Co Inc | 特性バランスに優れるプリプレグ及び積層板 |
CN1184247C (zh) | 2003-07-08 | 2005-01-12 | 北京玻璃钢研究设计院 | 酚醛氰酸酯树脂及其合成方法以及酚醛氰酸酯烧蚀材料组合物 |
JP5170493B2 (ja) * | 2005-10-14 | 2013-03-27 | エア・ウォーター株式会社 | フェノール系重合体、その製法及びその用途 |
JP5850228B2 (ja) * | 2011-11-24 | 2016-02-03 | Dic株式会社 | 硬化性樹脂組成物、その硬化物、シアン酸エステル樹脂、半導体封止材料、プリプレグ、回路基板、及び、ビルドアップフィルム |
JP2014019815A (ja) * | 2012-07-20 | 2014-02-03 | Mitsubishi Gas Chemical Co Inc | 硬化性樹脂組成物、およびその硬化物 |
-
2015
- 2015-02-03 EP EP15746398.5A patent/EP3103825B1/en active Active
- 2015-02-03 JP JP2015560990A patent/JP6465362B2/ja active Active
- 2015-02-03 SG SG11201605980SA patent/SG11201605980SA/en unknown
- 2015-02-03 US US15/112,251 patent/US10034371B2/en active Active
- 2015-02-03 KR KR1020167018804A patent/KR102258869B1/ko active IP Right Grant
- 2015-02-03 CN CN201580007108.6A patent/CN105960427B/zh active Active
- 2015-02-03 WO PCT/JP2015/053017 patent/WO2015119121A1/ja active Application Filing
- 2015-02-04 TW TW104103649A patent/TWI636084B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP3103825B1 (en) | 2021-03-24 |
US20160345433A1 (en) | 2016-11-24 |
TWI636084B (zh) | 2018-09-21 |
EP3103825A4 (en) | 2017-11-22 |
CN105960427B (zh) | 2018-04-06 |
WO2015119121A1 (ja) | 2015-08-13 |
KR102258869B1 (ko) | 2021-05-31 |
TW201534643A (zh) | 2015-09-16 |
KR20160118229A (ko) | 2016-10-11 |
JP6465362B2 (ja) | 2019-02-06 |
CN105960427A (zh) | 2016-09-21 |
US10034371B2 (en) | 2018-07-24 |
EP3103825A1 (en) | 2016-12-14 |
JPWO2015119121A1 (ja) | 2017-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201708802VA (en) | Resin composition, prepreg, laminate and multilayer printed wiring board | |
SG11201509490PA (en) | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same | |
EP3216834A4 (en) | Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board | |
EP2947122A4 (en) | RESIN COMPOSITION, PREPREG, LAMINATE, LAMINATE COVERED WITH METAL SHEET, AND CIRCUIT BOARD | |
SG11201606644SA (en) | Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board | |
SG11201610849XA (en) | Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board | |
EP2860219A4 (en) | RESIN COMPOSITION, PRE-IMPREGNATED, LAMINATE OF METALLIC SHEET-SHEATH AND CIRCUIT BOARD | |
SG11201708808SA (en) | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | |
SG11201404327PA (en) | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same | |
SG11201509672RA (en) | Resin composition, prepreg, resin sheet and metal foil-clad laminate | |
EP2910587A4 (en) | RESIN COMPOSITION, PRE-IMPREGNATED, LAMINATE PLATE, LAMINATE PLATE COATED WITH METAL SHEET, AND PRINTED BOARD | |
EP3321322A4 (en) | Resin composition, prepreg, resin sheet, metal foil-clad laminate sheet, and printed wiring board | |
SG11201600586XA (en) | Prepreg, metal foil-clad laminate, and printed wiring board | |
EP3375822A4 (en) | RESIN COMPOSITION, PREPREG, LAMINATED PLATE OF METAL SHEET, RESIN SHEET AND CIRCUIT BOARD | |
EP3321325A4 (en) | RESIN COMPOSITION, PRE-IMPREGNATED, LAMINATE COMPRISING METAL SHEET COATING AND CIRCUIT BOARD | |
IL262895A (en) | Resin composition, substitute, sheet metal with resin, lamination, printed wire panel, and method for producing resin composition | |
EP3521337A4 (en) | RESIN COMPOSITION, PREimpregnated, LAMINATED PANEL PLATED WITH METAL SHEET, RESIN SHEET AND PRINTED CIRCUIT BOARD | |
EP3321326A4 (en) | RESIN COMPOSITION, PREPREG, RESIN FOIL, LAMINATE COATED WITH METAL FOIL AND LADDER PLATE | |
EP3272782A4 (en) | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board | |
HK1258949B (zh) | 樹脂清漆、預浸漬體、層叠板及印製線路板 | |
EP3279266A4 (en) | Resin composition for printed wiring board, prepreg, resin composite sheet, and metal foil-clad laminate plate | |
SG11201605980SA (en) | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | |
EP3321289A4 (en) | Resin composition; PREPREG OR RESIN FOIL USING THE SAID RESIN COMPOSITION; LAMINATE PLATE USING THE SAID PREPREG OR RESIN FOIL AND PCB | |
SG11201700803VA (en) | Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | |
EP3321319A4 (en) | RESIN COMPOSITION, PRE-IMPREGNATED, RESIN SHEET, LAMINATE PLATE, AND PRINTED CIRCUIT BOARD |