HK1258949B - 樹脂清漆、預浸漬體、層叠板及印製線路板 - Google Patents
樹脂清漆、預浸漬體、層叠板及印製線路板Info
- Publication number
- HK1258949B HK1258949B HK19101429.8A HK19101429A HK1258949B HK 1258949 B HK1258949 B HK 1258949B HK 19101429 A HK19101429 A HK 19101429A HK 1258949 B HK1258949 B HK 1258949B
- Authority
- HK
- Hong Kong
- Prior art keywords
- prepreg
- laminate
- wiring board
- printed wiring
- resin varnish
- Prior art date
Links
Classifications
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
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PCT/JP2016/086456 WO2018105070A1 (ja) | 2016-12-07 | 2016-12-07 | 樹脂ワニス、プリプレグ、積層板及びプリント配線板 |
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HK19101429.8A HK1258949B (zh) | 2016-12-07 | 2019-01-28 | 樹脂清漆、預浸漬體、層叠板及印製線路板 |
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US (1) | US10940674B2 (zh) |
EP (1) | EP3360910B1 (zh) |
JP (1) | JP6454416B2 (zh) |
KR (3) | KR20190099091A (zh) |
CN (1) | CN108401433B (zh) |
HK (1) | HK1258949B (zh) |
TW (1) | TWI631194B (zh) |
WO (1) | WO2018105070A1 (zh) |
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KR102340799B1 (ko) * | 2018-09-20 | 2021-12-16 | 주식회사 엘지화학 | 금속 박막 코팅용 열경화성 수지 조성물, 이를 이용한 수지 코팅 금속 박막 및 금속박 적층판 |
JP7330725B2 (ja) * | 2019-03-19 | 2023-08-22 | キヤノン株式会社 | トナー用外添剤及びトナー |
CN110204862B (zh) * | 2019-05-31 | 2021-11-30 | 广东生益科技股份有限公司 | 树脂组合物、预浸料、层压板、覆金属箔层压板以及印刷线路板 |
CN115135830A (zh) * | 2020-02-19 | 2022-09-30 | 日信化学工业株式会社 | 无机纤维用粘结剂及无机纤维垫 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS535920B2 (zh) | 1974-06-03 | 1978-03-02 | ||
JPS56133355A (en) | 1980-03-24 | 1981-10-19 | Mitsubishi Gas Chem Co Inc | Curable polyphenylene ether resin composition |
JPS56141349A (en) | 1980-04-03 | 1981-11-05 | Mitsubishi Gas Chem Co Inc | Curable polyphenylene ether type resin composition |
JPS5869046A (ja) | 1981-10-21 | 1983-04-25 | 旭化成株式会社 | 積層板及びその成形法 |
JPS58164638A (ja) | 1982-03-25 | 1983-09-29 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
JPS6118937A (ja) | 1984-07-06 | 1986-01-27 | Mitsubishi Electric Corp | 工業用テレビカメラの照明装置 |
JPH0669746B2 (ja) | 1985-06-13 | 1994-09-07 | 松下電工株式会社 | 積層板およびその製法 |
JPS62148512A (ja) | 1985-12-23 | 1987-07-02 | Matsushita Electric Works Ltd | ポリフエニレンオキサイド固化物の改質法 |
JPH0726013B2 (ja) | 1989-02-08 | 1995-03-22 | 旭化成工業株式会社 | 硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体 |
JP3178925B2 (ja) | 1992-12-15 | 2001-06-25 | 旭化成株式会社 | 硬化性樹脂組成物 |
JP2011006683A (ja) | 2004-02-04 | 2011-01-13 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、印刷配線板 |
JP5040092B2 (ja) | 2005-10-04 | 2012-10-03 | 日立化成工業株式会社 | 安定性の優れた低誘電正接樹脂ワニスおよびそれを用いた配線板材料 |
WO2008041453A1 (fr) | 2006-09-29 | 2008-04-10 | Hitachi Chemical Company, Ltd. | Composition de résine thermodurcissable, pré-imprégné et stratifié obtenus avec celle-ci |
JP2008133353A (ja) | 2006-11-28 | 2008-06-12 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、この樹脂組成物を用いたプリプレグ及び積層板 |
JP5023877B2 (ja) | 2006-12-05 | 2012-09-12 | 日立化成工業株式会社 | 難燃性樹脂化合物、これを用いた熱硬化性樹脂組成物並びにプリプレグ及び積層板 |
JP5104507B2 (ja) | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
JP2009155399A (ja) * | 2007-12-25 | 2009-07-16 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
JP5473896B2 (ja) * | 2008-03-21 | 2014-04-16 | 昭和電工株式会社 | 樹脂組成物及びその硬化膜 |
CN103232682B (zh) | 2008-07-31 | 2016-03-02 | 积水化学工业株式会社 | 环氧树脂组合物、预浸料、固化物、片状成形体、叠层板及多层叠层板 |
JP2010053334A (ja) | 2008-07-31 | 2010-03-11 | Sekisui Chem Co Ltd | エポキシ系樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板 |
TWI506082B (zh) * | 2009-11-26 | 2015-11-01 | Ajinomoto Kk | Epoxy resin composition |
KR20180135079A (ko) * | 2011-01-18 | 2018-12-19 | 히타치가세이가부시끼가이샤 | 변성 실리콘 화합물, 이것을 이용한 열 경화성 수지 조성물, 프리프레그, 적층판 및 인쇄 배선판 |
JP5772189B2 (ja) | 2011-04-27 | 2015-09-02 | 日立化成株式会社 | 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及び配線板 |
WO2012164761A1 (ja) | 2011-05-31 | 2012-12-06 | 日立ビークルエナジー株式会社 | 電池システム監視装置 |
WO2013031844A1 (ja) * | 2011-08-30 | 2013-03-07 | 日立化成株式会社 | 液状インキ |
JP6314830B2 (ja) | 2012-10-19 | 2018-04-25 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、及びプリント配線板 |
JP6332036B2 (ja) * | 2012-11-28 | 2018-05-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、積層板、金属箔張積層板、及びプリント配線板 |
CN105358624B (zh) * | 2013-07-04 | 2017-06-06 | 松下知识产权经营株式会社 | 树脂组合物、预浸料和层压板 |
CN104629341B (zh) | 2013-11-08 | 2017-01-04 | 中山台光电子材料有限公司 | 低介电树脂组合物,应用其的半固化胶片、覆铜箔基板、电路板 |
JP6384711B2 (ja) | 2014-06-23 | 2018-09-05 | 日立化成株式会社 | 絶縁性樹脂組成物及びこれを用いたプリプレグ、プリント配線板用積層板 |
JP6443657B2 (ja) | 2014-07-04 | 2018-12-26 | 日立化成株式会社 | 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 |
US9300249B2 (en) * | 2014-07-22 | 2016-03-29 | Qualcomm Incorporated | Differential crystal oscillator circuit |
JP2016033195A (ja) | 2014-07-31 | 2016-03-10 | 日立化成株式会社 | 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及び多層プリント配線板 |
JP6428082B2 (ja) | 2014-09-16 | 2018-11-28 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
KR102375044B1 (ko) | 2015-01-16 | 2022-03-15 | 쇼와덴코머티리얼즈가부시끼가이샤 | 열경화성 수지 조성물, 층간 절연용 수지 필름, 복합 필름, 프린트 배선판 및 그의 제조 방법 |
WO2016175326A1 (ja) * | 2015-04-30 | 2016-11-03 | 日立化成株式会社 | 樹脂組成物、プリプレグ、積層板及び多層プリント配線板 |
JP6801652B2 (ja) * | 2015-06-02 | 2020-12-16 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
JP6701630B2 (ja) * | 2015-06-02 | 2020-05-27 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板 |
CN110982267B (zh) | 2016-12-07 | 2024-03-08 | 株式会社力森诺科 | 热固化性树脂组合物及其制造方法、预浸渍体、层叠板以及印制线路板 |
-
2016
- 2016-12-07 KR KR1020197023854A patent/KR20190099091A/ko active Application Filing
- 2016-12-07 CN CN201680005919.7A patent/CN108401433B/zh active Active
- 2016-12-07 WO PCT/JP2016/086456 patent/WO2018105070A1/ja active Application Filing
- 2016-12-07 JP JP2017522683A patent/JP6454416B2/ja active Active
- 2016-12-07 US US15/538,557 patent/US10940674B2/en active Active
- 2016-12-07 KR KR1020187012052A patent/KR102117173B1/ko active IP Right Grant
- 2016-12-07 KR KR1020177017961A patent/KR101855640B1/ko active IP Right Grant
- 2016-12-07 EP EP16880183.5A patent/EP3360910B1/en active Active
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2017
- 2017-05-03 TW TW106114608A patent/TWI631194B/zh active
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2019
- 2019-01-28 HK HK19101429.8A patent/HK1258949B/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP3360910B1 (en) | 2019-10-09 |
KR20180080208A (ko) | 2018-07-11 |
CN108401433A (zh) | 2018-08-14 |
TWI631194B (zh) | 2018-08-01 |
WO2018105070A1 (ja) | 2018-06-14 |
US10940674B2 (en) | 2021-03-09 |
CN108401433B (zh) | 2019-05-28 |
KR101855640B1 (ko) | 2018-05-04 |
JPWO2018105070A1 (ja) | 2018-12-06 |
US20190338093A1 (en) | 2019-11-07 |
TW201821560A (zh) | 2018-06-16 |
JP6454416B2 (ja) | 2019-01-16 |
EP3360910A4 (en) | 2018-08-15 |
EP3360910A1 (en) | 2018-08-15 |
KR102117173B1 (ko) | 2020-05-29 |
KR20190099091A (ko) | 2019-08-23 |
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