SG11201601075PA - Electronic assembly with fiducial marks for precision registration during subsequent processing steps - Google Patents

Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Info

Publication number
SG11201601075PA
SG11201601075PA SG11201601075PA SG11201601075PA SG11201601075PA SG 11201601075P A SG11201601075P A SG 11201601075PA SG 11201601075P A SG11201601075P A SG 11201601075PA SG 11201601075P A SG11201601075P A SG 11201601075PA SG 11201601075P A SG11201601075P A SG 11201601075PA
Authority
SG
Singapore
Prior art keywords
processing steps
subsequent processing
during subsequent
electronic assembly
fiducial marks
Prior art date
Application number
SG11201601075PA
Other languages
English (en)
Inventor
Daniel J Theis
Ann M Gilman
Kim B Saulsbury
Matthew S Stay
Shawn C Dodds
Mikhail L Pekurovsky
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201601075PA publication Critical patent/SG11201601075PA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
SG11201601075PA 2013-08-28 2014-08-11 Electronic assembly with fiducial marks for precision registration during subsequent processing steps SG11201601075PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361871244P 2013-08-28 2013-08-28
PCT/US2014/050471 WO2015031033A1 (en) 2013-08-28 2014-08-11 Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Publications (1)

Publication Number Publication Date
SG11201601075PA true SG11201601075PA (en) 2016-03-30

Family

ID=52587201

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201601075PA SG11201601075PA (en) 2013-08-28 2014-08-11 Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Country Status (7)

Country Link
US (1) US9807871B2 (https=)
EP (1) EP3039949A4 (https=)
JP (1) JP6457528B2 (https=)
KR (1) KR102182751B1 (https=)
CN (1) CN105474760B (https=)
SG (1) SG11201601075PA (https=)
WO (1) WO2015031033A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5687175B2 (ja) * 2011-11-28 2015-03-18 有限会社 ナプラ 微細空間内に機能部分を形成する方法
KR102399443B1 (ko) * 2014-06-20 2022-05-19 쓰리엠 이노베이티브 프로퍼티즈 캄파니 후속 처리 동안 정밀 정합을 달성하기 위한 다수의 잉크들의 인쇄
TWI564762B (zh) * 2015-04-22 2017-01-01 恆顥科技股份有限公司 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片
US20170148152A1 (en) * 2015-11-25 2017-05-25 General Electric Company Systems and Methods for Monitoring Component Strain
GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
US11279859B2 (en) 2016-12-07 2022-03-22 3M Innovative Properties Company Methods of passivating adhesives
WO2020138064A1 (ja) * 2018-12-26 2020-07-02 日東電工株式会社 可剥離塗膜の剥離方法、及び物品
JPWO2020137797A1 (ja) * 2018-12-27 2021-11-11 富士フイルム株式会社 導電性転写材料、パターンつき基板の製造方法、積層体、及びタッチパネル
WO2020170817A1 (ja) * 2019-02-20 2020-08-27 日東電工株式会社 積層体
US12365174B2 (en) 2023-09-12 2025-07-22 Eastman Kodak Company Ink tray insert
WO2025058912A1 (en) 2023-09-12 2025-03-20 Eastman Kodak Company Inking system with segmented fountain roller
US12311652B2 (en) 2023-09-12 2025-05-27 Eastman Kodak Company Inking system with plurality of fountain roller elements
US12220904B1 (en) 2023-09-12 2025-02-11 Eastman Kodak Company Inking system with segmented fountain roller

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4165688A (en) 1977-04-14 1979-08-28 Magna-Graphics Corporation Ink dam for printing press
FR2421732A1 (fr) 1978-04-07 1979-11-02 Sarda Jean Lucien Procede et mecanisme d'encrage en une ou plusieurs couleurs pour impressions typographiques, offset ou autres
JPS5752021A (en) * 1980-09-12 1982-03-27 Citizen Watch Co Ltd Manufacture of liquid crystal display cell
DE3320638C2 (de) 1983-06-08 1986-10-16 Koenig & Bauer AG, 8700 Würzburg Farbabteileinrichtung an Farbkastenwalzen von Druckmaschinen
DE3505598C2 (de) 1984-10-30 1986-08-14 Windmöller & Hölscher, 4540 Lengerich Spülfarbwerk mit geteilter Farbkammerrakel
DE3709177A1 (de) 1987-03-20 1988-09-29 Leybold Ag Verfahren und vorrichtung zur regelung der reaktiven schichtabscheidung auf substraten mittels magnetronkatoden
US4796528A (en) 1987-05-29 1989-01-10 M.A.N. Roland Druckmaschinen Ag Separated ink fountain for a flexographic printing machine
US5012736A (en) 1987-09-21 1991-05-07 Paper Converting Machine Company Sealing assembly for liquid fountain
JPH05327178A (ja) * 1991-03-28 1993-12-10 Unitika Ltd 透明導電性基体の連続製造方法
US5150651A (en) 1991-06-10 1992-09-29 Flores Carlos R Doctor-blade assembly for flexographic press
US5243907A (en) 1992-01-22 1993-09-14 The Langston Corporation Divider seal for split-fountain chambered doctor blade for a flexographic printing press
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
JP3302296B2 (ja) 1997-05-30 2002-07-15 キヤノン株式会社 カラーフィルタの製造方法
KR100315911B1 (ko) * 1997-10-10 2002-09-25 삼성전자 주식회사 액정 표시 장치 패널, 그 제조 방법 및 정렬 방법
US6029574A (en) 1998-09-30 2000-02-29 Heidelberger Druckmaschinen Ag Dual ink supply system
US7052824B2 (en) 2000-06-30 2006-05-30 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
KR101223098B1 (ko) 2004-09-09 2013-01-17 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
US20060291481A1 (en) 2005-06-27 2006-12-28 Matsushita Electric Industrial Co., Ltd. Application session resumption in mobile environments
SG150514A1 (en) 2005-08-12 2009-03-30 Cambrios Technologies Corp Nanowires-based transparent conductors
JP4068635B2 (ja) * 2005-09-30 2008-03-26 松下電器産業株式会社 配線基板
CN101589473B (zh) 2006-10-12 2011-10-05 凯博瑞奥斯技术公司 基于纳米线的透明导体及其应用
EP2115543B1 (en) 2007-01-11 2012-10-31 3M Innovative Properties Company Web longitudinal position sensor
WO2008157588A2 (en) 2007-06-19 2008-12-24 3M Innovative Properties Company Systems and methods for fabricating displacement scales
KR20100049540A (ko) 2007-06-19 2010-05-12 쓰리엠 이노베이티브 프로퍼티즈 컴파니 내부 전반사 변위 스케일
KR101390767B1 (ko) 2007-08-31 2014-04-30 엘지디스플레이 주식회사 표시소자 제조방법
US7829168B2 (en) 2007-11-21 2010-11-09 Promos Technologies Pte. Ltd. Methods for inspecting and optionally reworking summed photolithography patterns resulting from plurally-overlaid patterning steps during mass production of semiconductor devices
JP2011513534A (ja) 2008-02-26 2011-04-28 カンブリオス テクノロジーズ コーポレイション 導電性特徴のインクジェット蒸着のための方法および組成物
JP2010021293A (ja) 2008-07-09 2010-01-28 Nec Electronics Corp 半導体装置および半導体装置の製造方法
JP4754613B2 (ja) * 2008-11-27 2011-08-24 日東電工株式会社 光電気混載基板およびその製造方法
EP2380067B1 (en) 2008-12-29 2019-06-26 3M Innovative Properties Company Method and system for determining a longitudinal position of an elongated web
WO2010077719A2 (en) 2008-12-30 2010-07-08 3M Innovative Properties Company Apparatus and method for making fiducials on a substrate
JP4966996B2 (ja) 2009-05-19 2012-07-04 東芝機械株式会社 レール支持装置およびシートの延伸方法
SG183319A1 (en) * 2010-03-12 2012-09-27 Sharp Kk Circuit board, substrate module, and display device
JP5664088B2 (ja) 2010-09-30 2015-02-04 大日本印刷株式会社 アライメントマーク基板、素子、および素子の製造方法
JP2012169060A (ja) * 2011-02-10 2012-09-06 Shin Etsu Polymer Co Ltd 導電パターン形成基板の製造方法
JP5774686B2 (ja) 2011-04-26 2015-09-09 日本メクトロン株式会社 透明プリント配線板の製造方法、および透明タッチパネルの製造方法
JP5866995B2 (ja) * 2011-11-16 2016-02-24 三菱電機株式会社 タッチパネル基板の製造方法
SG11201504125UA (en) 2012-12-07 2015-06-29 3M Innovative Properties Co Method of making transparent conductors on a substrate
BR112015015027A2 (pt) 2012-12-20 2017-07-11 3M Innovative Properties Co impressão de múltiplas tintas para conseguir registro de precisão durante processamento subsequente
CN103034366B (zh) 2012-12-21 2016-08-31 北京京东方光电科技有限公司 一种显示基板制作方法及黑矩阵、显示基板、显示装置

Also Published As

Publication number Publication date
WO2015031033A1 (en) 2015-03-05
CN105474760B (zh) 2019-03-08
US20160205772A1 (en) 2016-07-14
KR102182751B1 (ko) 2020-11-25
CN105474760A (zh) 2016-04-06
EP3039949A4 (en) 2017-04-19
US9807871B2 (en) 2017-10-31
JP2016534465A (ja) 2016-11-04
EP3039949A1 (en) 2016-07-06
KR20160048872A (ko) 2016-05-04
JP6457528B2 (ja) 2019-01-23

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