SG11201508921RA - Probe pin and electronic device using same - Google Patents
Probe pin and electronic device using sameInfo
- Publication number
- SG11201508921RA SG11201508921RA SG11201508921RA SG11201508921RA SG11201508921RA SG 11201508921R A SG11201508921R A SG 11201508921RA SG 11201508921R A SG11201508921R A SG 11201508921RA SG 11201508921R A SG11201508921R A SG 11201508921RA SG 11201508921R A SG11201508921R A SG 11201508921RA
- Authority
- SG
- Singapore
- Prior art keywords
- same
- electronic device
- probe pin
- probe
- pin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2471—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point pin shaped
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013171082A JP5985447B2 (ja) | 2013-08-21 | 2013-08-21 | プローブピン、および、これを用いた電子デバイス |
PCT/JP2014/069237 WO2015025662A1 (ja) | 2013-08-21 | 2014-07-18 | プローブピン、および、これを用いた電子デバイス |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201508921RA true SG11201508921RA (en) | 2015-11-27 |
Family
ID=52483444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201508921RA SG11201508921RA (en) | 2013-08-21 | 2014-07-18 | Probe pin and electronic device using same |
Country Status (8)
Country | Link |
---|---|
US (1) | US9595773B2 (ja) |
EP (1) | EP3037827B1 (ja) |
JP (1) | JP5985447B2 (ja) |
KR (1) | KR101779686B1 (ja) |
CN (1) | CN105190321B (ja) |
SG (1) | SG11201508921RA (ja) |
TW (1) | TWI569525B (ja) |
WO (1) | WO2015025662A1 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6269337B2 (ja) * | 2014-06-16 | 2018-01-31 | オムロン株式会社 | プローブピン、および、これを用いた電子デバイス |
JP6337633B2 (ja) * | 2014-06-16 | 2018-06-06 | オムロン株式会社 | プローブピン |
JP6531438B2 (ja) * | 2015-03-13 | 2019-06-19 | オムロン株式会社 | プローブピン、および、これを備えたプローブユニット |
US11187722B2 (en) | 2016-04-15 | 2021-11-30 | Omron Corporation | Probe pin and electronic device using the same |
JP6515877B2 (ja) * | 2016-06-17 | 2019-05-22 | オムロン株式会社 | プローブピン |
JP2018036129A (ja) * | 2016-08-31 | 2018-03-08 | オムロン株式会社 | プローブピン |
JP6352510B2 (ja) * | 2016-09-15 | 2018-07-04 | 株式会社Sdk | コンタクト装置および測定用ソケット |
JP6642359B2 (ja) * | 2016-09-21 | 2020-02-05 | オムロン株式会社 | プローブピンおよび検査ユニット |
KR101932509B1 (ko) * | 2016-12-12 | 2018-12-26 | 주식회사 오킨스전자 | 다 접점 에지 접촉으로 접촉 특성이 개선되는 fosp 핀, 및 이를 포함하는 테스트 소켓 |
KR101920824B1 (ko) * | 2017-02-02 | 2018-11-21 | 리노공업주식회사 | 검사용 프로브 및 소켓 |
JP6892277B2 (ja) * | 2017-02-10 | 2021-06-23 | 株式会社日本マイクロニクス | プローブ及び電気的接続装置 |
JP2018151316A (ja) * | 2017-03-14 | 2018-09-27 | オムロン株式会社 | プローブピンおよび検査ユニット |
KR101957717B1 (ko) * | 2017-08-01 | 2019-07-04 | 주식회사 오킨스전자 | 사다리꼴 형태로 접촉 수율이 개선되는 pion 핀, 및 이를 포함하는 테스트 소켓 |
KR101957715B1 (ko) * | 2017-08-01 | 2019-07-04 | 주식회사 오킨스전자 | 라운드 타입으로 접촉 수율이 개선되는 pion 핀 |
KR102013138B1 (ko) * | 2018-02-14 | 2019-08-22 | 주식회사 오킨스전자 | 탄성편을 포함하는 반도체 테스트 소켓용 핀 |
KR102003244B1 (ko) * | 2018-02-14 | 2019-07-24 | 주식회사 오킨스전자 | 스프링 가조립용 파단 돌기를 이용한 반도체 테스트 소켓용 핀의 조립 방법 |
KR102013137B1 (ko) * | 2018-02-14 | 2019-08-22 | 주식회사 오킨스전자 | 탄성편을 통하여 보조 핀의 콘택 특성이 개선되는 반도체 테스트 소켓용 핀 |
TWI690709B (zh) * | 2018-08-15 | 2020-04-11 | 萬潤科技股份有限公司 | 探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備 |
JP7274853B2 (ja) * | 2018-12-03 | 2023-05-17 | 株式会社エンプラス | コンタクトピンおよびソケット |
KR102126753B1 (ko) * | 2018-12-19 | 2020-06-25 | 주식회사 오킨스전자 | 단일 코일 스프링에 의하여 3개의 플런저가 독립적으로 슬라이드 동작하는 테스트 소켓에 있어서, 레일을 통하여 상기 슬라이드 동작이 제어되는 데스트 핀 |
KR102126752B1 (ko) * | 2018-12-19 | 2020-06-25 | 주식회사 오킨스전자 | 이중 코일 스프링에 의하여 3개의 플런저가 독립적으로 슬라이드 동작하는 테스트 소켓에 있어서, 레일을 통하여 콘택 특성이 개선되는 데스트 핀 |
TWI705248B (zh) * | 2019-02-15 | 2020-09-21 | 萬潤科技股份有限公司 | 探針驅動方法及裝置 |
CN110557877B (zh) * | 2019-09-11 | 2021-03-12 | 北京航空航天大学 | 朗缪尔探针、朗缪尔探针检测系统及检测方法 |
CN111579834B (zh) * | 2020-05-18 | 2023-03-31 | 武汉精毅通电子技术有限公司 | 一种适用于大电流高速信号测试的探针及连接器 |
KR102202827B1 (ko) * | 2020-10-27 | 2021-01-14 | (주) 네스텍코리아 | 프로브 핀 및 이를 적용한 동축 프로브 조립체 |
US11387587B1 (en) * | 2021-03-13 | 2022-07-12 | Plastronics Socket Partners, Ltd. | Self-retained slider contact pin |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6685492B2 (en) * | 2001-12-27 | 2004-02-03 | Rika Electronics International, Inc. | Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition |
KR100584225B1 (ko) | 2004-10-06 | 2006-05-29 | 황동원 | 전자장치용 콘택트 |
US7008270B1 (en) * | 2004-11-30 | 2006-03-07 | Delphi Technologies, Inc. | Cable connector |
EP1889080A2 (en) * | 2005-06-10 | 2008-02-20 | Delaware Capital Formation, Inc. | Electrical contact probe with compliant internal interconnect |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
JP4857046B2 (ja) * | 2006-08-02 | 2012-01-18 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
JP4943775B2 (ja) * | 2006-08-25 | 2012-05-30 | 株式会社エンプラス | 接触子配設ユニット及び電気部品用ソケット |
CN201029131Y (zh) * | 2007-03-02 | 2008-02-27 | 富士康(昆山)电脑接插件有限公司 | 电连接器端子 |
US7862391B2 (en) * | 2007-09-18 | 2011-01-04 | Delaware Capital Formation, Inc. | Spring contact assembly |
TWM350121U (en) * | 2008-06-30 | 2009-02-01 | Hon Hai Prec Ind Co Ltd | Electrical contact |
JP5166176B2 (ja) * | 2008-09-04 | 2013-03-21 | スリーエム イノベイティブ プロパティズ カンパニー | 電子デバイス用ソケット |
TWM366772U (en) * | 2009-04-03 | 2009-10-11 | Hon Hai Prec Ind Co Ltd | Electrical contact |
TWM376001U (en) * | 2009-08-05 | 2010-03-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US8808037B2 (en) * | 2009-10-12 | 2014-08-19 | Iwin Co., Ltd. | Slidable pogo pin |
TWM390564U (en) * | 2010-03-18 | 2010-10-11 | Hon Hai Prec Ind Co Ltd | Electrical contact |
JP4998838B2 (ja) * | 2010-04-09 | 2012-08-15 | 山一電機株式会社 | プローブピン及びそれを備えるicソケット |
KR101154519B1 (ko) * | 2010-05-27 | 2012-06-13 | 하이콘 주식회사 | 스프링 콘택트 구조 |
JP5960383B2 (ja) * | 2010-06-01 | 2016-08-02 | スリーエム イノベイティブ プロパティズ カンパニー | 接触子ホルダ |
TWM398701U (en) * | 2010-07-16 | 2011-02-21 | Hon Hai Prec Ind Co Ltd | Electrical contact |
-
2013
- 2013-08-21 JP JP2013171082A patent/JP5985447B2/ja active Active
-
2014
- 2014-07-07 TW TW103123250A patent/TWI569525B/zh not_active IP Right Cessation
- 2014-07-18 EP EP14838744.2A patent/EP3037827B1/en active Active
- 2014-07-18 KR KR1020157030889A patent/KR101779686B1/ko active IP Right Grant
- 2014-07-18 US US14/787,518 patent/US9595773B2/en active Active
- 2014-07-18 WO PCT/JP2014/069237 patent/WO2015025662A1/ja active Application Filing
- 2014-07-18 SG SG11201508921RA patent/SG11201508921RA/en unknown
- 2014-07-18 CN CN201480024211.7A patent/CN105190321B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
WO2015025662A1 (ja) | 2015-02-26 |
EP3037827B1 (en) | 2020-02-05 |
TW201509013A (zh) | 2015-03-01 |
JP5985447B2 (ja) | 2016-09-06 |
TWI569525B (zh) | 2017-02-01 |
US9595773B2 (en) | 2017-03-14 |
JP2015040734A (ja) | 2015-03-02 |
EP3037827A1 (en) | 2016-06-29 |
CN105190321B (zh) | 2018-02-13 |
CN105190321A (zh) | 2015-12-23 |
EP3037827A4 (en) | 2017-03-22 |
US20160072202A1 (en) | 2016-03-10 |
KR101779686B1 (ko) | 2017-09-18 |
KR20150138289A (ko) | 2015-12-09 |
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