SG11201501598TA - Positive photosensitive resin composition - Google Patents
Positive photosensitive resin compositionInfo
- Publication number
- SG11201501598TA SG11201501598TA SG11201501598TA SG11201501598TA SG11201501598TA SG 11201501598T A SG11201501598T A SG 11201501598TA SG 11201501598T A SG11201501598T A SG 11201501598TA SG 11201501598T A SG11201501598T A SG 11201501598TA SG 11201501598T A SG11201501598T A SG 11201501598TA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- photosensitive resin
- positive photosensitive
- positive
- composition
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/074367 WO2014045434A1 (ja) | 2012-09-24 | 2012-09-24 | ポジ型感光性樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201501598TA true SG11201501598TA (en) | 2015-04-29 |
Family
ID=50340783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201501598TA SG11201501598TA (en) | 2012-09-24 | 2012-09-24 | Positive photosensitive resin composition |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150219991A1 (zh) |
| EP (1) | EP2902846B1 (zh) |
| JP (1) | JP6102736B2 (zh) |
| KR (1) | KR101969197B1 (zh) |
| CN (1) | CN104641291B (zh) |
| PT (1) | PT2902846T (zh) |
| SG (1) | SG11201501598TA (zh) |
| WO (1) | WO2014045434A1 (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014050558A1 (ja) * | 2012-09-25 | 2014-04-03 | 東レ株式会社 | ポジ型感光性樹脂組成物、それを用いた硬化膜を含む半導体装置の製造方法 |
| JP6801452B2 (ja) | 2015-03-24 | 2020-12-16 | 東レ株式会社 | 感光性樹脂組成物 |
| CN107429058B (zh) * | 2015-04-24 | 2020-08-07 | 东丽株式会社 | 树脂组合物、使用其的半导体元件的制造方法及半导体器件 |
| WO2017169009A1 (ja) * | 2016-03-28 | 2017-10-05 | 東レ株式会社 | 樹脂組成物、その硬化レリーフパターン、およびそれを用いた半導体電子部品または半導体装置の製造方法 |
| TW201821280A (zh) | 2016-09-30 | 2018-06-16 | 日商富士軟片股份有限公司 | 積層體以及半導體元件的製造方法 |
| JP6810677B2 (ja) | 2017-12-05 | 2021-01-06 | 信越化学工業株式会社 | 新規テトラカルボン酸二無水物、ポリイミド樹脂及びその製造方法、感光性樹脂組成物、パターン形成方法及び硬化被膜形成方法、層間絶縁膜、表面保護膜、電子部品 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004109403A1 (ja) * | 2003-06-02 | 2004-12-16 | Toray Industries, Inc. | 感光性樹脂組成物およびそれを用いた電子部品ならびに表示装置 |
| JP4918968B2 (ja) | 2005-05-09 | 2012-04-18 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
| JP4539505B2 (ja) | 2005-09-12 | 2010-09-08 | 住友ベークライト株式会社 | 感光性樹脂組成物 |
| JP5386781B2 (ja) | 2007-03-12 | 2014-01-15 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
| KR20120085313A (ko) * | 2007-06-06 | 2012-07-31 | 히다치 가세고교 가부시끼가이샤 | 감광성 접착제 조성물, 필름상 접착제, 접착 시트, 접착제 패턴의 형성방법, 접착제층 부착 반도체 웨이퍼, 반도체 장치, 및, 반도체 장치의 제조방법 |
| CN101910350B (zh) * | 2008-01-16 | 2013-01-16 | 日立化成工业株式会社 | 感光性粘接剂组合物、膜状粘接剂、粘接片、粘接剂图案、带有粘接剂层的半导体晶片、半导体装置及半导体装置的制造方法 |
| JP5353064B2 (ja) * | 2008-02-19 | 2013-11-27 | 日立化成株式会社 | 感光性接着剤組成物、これを用いて得られる接着フィルム、接着シート、接着剤パターン、及び半導体装置 |
| JP5315754B2 (ja) * | 2008-03-31 | 2013-10-16 | Ｊｓｒ株式会社 | 感放射線性樹脂組成物 |
| JP2009258471A (ja) | 2008-04-18 | 2009-11-05 | Toray Ind Inc | 感光性樹脂組成物フィルムおよびそれを用いたレジスト形成方法 |
| JP5477527B2 (ja) * | 2008-09-30 | 2014-04-23 | 日産化学工業株式会社 | 末端官能基含有ポリイミドを含むポジ型感光性樹脂組成物 |
| CN102186904A (zh) * | 2008-10-20 | 2011-09-14 | 日本化药株式会社 | 聚酰亚胺树脂及其组合物 |
| JP5206977B2 (ja) * | 2009-03-12 | 2013-06-12 | 信越化学工業株式会社 | 新規ポリイミドシリコーン及びこれを含有する感光性樹脂組成物並びにパターン形成方法 |
| CN102449069B (zh) * | 2009-05-29 | 2014-02-12 | Dic株式会社 | 热固性树脂组合物及其固化物 |
| JP2011017898A (ja) * | 2009-07-09 | 2011-01-27 | Toray Ind Inc | 感光性カバーレイ |
| JP5483315B2 (ja) | 2009-07-09 | 2014-05-07 | Ｙｋｋ Ａｐ株式会社 | 開き戸 |
| JP5732815B2 (ja) * | 2009-10-30 | 2015-06-10 | 日立化成株式会社 | 感光性接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ、接着剤層付透明基板、及び半導体装置。 |
| KR101202012B1 (ko) * | 2009-12-08 | 2012-11-20 | 주식회사 엘지화학 | 감광성 폴리이미드 수지 조성물 |
| JP5417623B2 (ja) * | 2009-12-10 | 2014-02-19 | 信越化学工業株式会社 | ポリイミド系光硬化性樹脂組成物、パターン形成方法及び基板保護用皮膜 |
| TWI516527B (zh) * | 2009-12-10 | 2016-01-11 | 信越化學工業股份有限公司 | 光固化性樹脂組成物，圖案形成法和基板保護膜，以及使用該組成物之膜狀黏著劑及黏著片 |
| SG186462A1 (en) * | 2010-07-02 | 2013-01-30 | Toray Industries | Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film |
| JP5291744B2 (ja) * | 2010-11-02 | 2013-09-18 | 富士フイルム株式会社 | エッチングレジスト用感光性樹脂組成物、パターン作製方法、ｍｅｍｓ構造体及びその作製方法、ドライエッチング方法、ウェットエッチング方法、ｍｅｍｓシャッターデバイス、並びに、画像表示装置 |
| JP5742376B2 (ja) * | 2011-03-30 | 2015-07-01 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
-
2012
- 2012-09-24 JP JP2013506966A patent/JP6102736B2/ja active Active
- 2012-09-24 PT PT128847555T patent/PT2902846T/pt unknown
- 2012-09-24 SG SG11201501598TA patent/SG11201501598TA/en unknown
- 2012-09-24 US US14/422,572 patent/US20150219991A1/en not_active Abandoned
- 2012-09-24 KR KR1020157009233A patent/KR101969197B1/ko active IP Right Grant
- 2012-09-24 EP EP12884755.5A patent/EP2902846B1/en active Active
- 2012-09-24 CN CN201280075939.3A patent/CN104641291B/zh active Active
- 2012-09-24 WO PCT/JP2012/074367 patent/WO2014045434A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN104641291A (zh) | 2015-05-20 |
| PT2902846T (pt) | 2019-12-18 |
| EP2902846A1 (en) | 2015-08-05 |
| CN104641291B (zh) | 2017-12-12 |
| US20150219991A1 (en) | 2015-08-06 |
| EP2902846B1 (en) | 2019-11-20 |
| JP6102736B2 (ja) | 2017-03-29 |
| JPWO2014045434A1 (ja) | 2016-08-18 |
| KR101969197B1 (ko) | 2019-04-15 |
| WO2014045434A1 (ja) | 2014-03-27 |
| EP2902846A4 (en) | 2016-06-01 |
| KR20150063424A (ko) | 2015-06-09 |
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