SG11201407090XA - Positive photosensitive material - Google Patents

Positive photosensitive material

Info

Publication number
SG11201407090XA
SG11201407090XA SG11201407090XA SG11201407090XA SG11201407090XA SG 11201407090X A SG11201407090X A SG 11201407090XA SG 11201407090X A SG11201407090X A SG 11201407090XA SG 11201407090X A SG11201407090X A SG 11201407090XA SG 11201407090X A SG11201407090X A SG 11201407090XA
Authority
SG
Singapore
Prior art keywords
photosensitive material
positive photosensitive
positive
photosensitive
Prior art date
Application number
SG11201407090XA
Inventor
Weihong Liu
Pinghung Lu
Chunwei Chen
Stephen Meyer
Medhat A Toukhy
Sookme Lai
Original Assignee
Az Electronic Materials Luxembourg S À R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Az Electronic Materials Luxembourg S À R L filed Critical Az Electronic Materials Luxembourg S À R L
Publication of SG11201407090XA publication Critical patent/SG11201407090XA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
SG11201407090XA 2012-06-15 2013-05-13 Positive photosensitive material SG11201407090XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/524,790 US9012126B2 (en) 2012-06-15 2012-06-15 Positive photosensitive material
PCT/EP2013/059771 WO2013185989A1 (en) 2012-06-15 2013-05-13 Positive photosensitive material

Publications (1)

Publication Number Publication Date
SG11201407090XA true SG11201407090XA (en) 2014-11-27

Family

ID=48444373

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407090XA SG11201407090XA (en) 2012-06-15 2013-05-13 Positive photosensitive material

Country Status (8)

Country Link
US (1) US9012126B2 (en)
EP (1) EP2862024B1 (en)
JP (1) JP6157605B2 (en)
KR (1) KR101942137B1 (en)
CN (1) CN104380198B (en)
SG (1) SG11201407090XA (en)
TW (1) TWI569102B (en)
WO (1) WO2013185989A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8906594B2 (en) 2012-06-15 2014-12-09 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working thick film photoresist
JP6175226B2 (en) * 2012-09-28 2017-08-02 富士フイルム株式会社 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition for semiconductor production, and method for producing electronic device
JP6778989B2 (en) * 2015-03-31 2020-11-04 東京応化工業株式会社 Chemically amplified positive photosensitive resin composition
US20170176856A1 (en) * 2015-12-21 2017-06-22 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working photoresist compositions for laser ablation and use thereof
TWI731961B (en) * 2016-04-19 2021-07-01 德商馬克專利公司 Positive working photosensitive material and method of forming a positive relief image
WO2019054805A1 (en) * 2017-09-15 2019-03-21 주식회사 엘지화학 Chemically amplified photoresist composition, photoresist pattern, and method for generating photoresist pattern
KR102146095B1 (en) 2017-09-15 2020-08-19 주식회사 엘지화학 Photoacid generator and photoresist composition for thick layer comprising the same
KR20240112923A (en) * 2018-09-05 2024-07-19 메르크 파텐트 게엠베하 Positive working photosensitive material
JP7475111B2 (en) 2018-11-14 2024-04-26 東京応化工業株式会社 Method for forming resist pattern, resist composition and method for producing same
TW202124569A (en) * 2019-11-13 2021-07-01 德商馬克專利公司 Positive working photosensitive material
KR20220101662A (en) 2019-11-14 2022-07-19 메르크 파텐트 게엠베하 DNQ-type photoresist composition comprising alkali-soluble acrylic resin
CN118284852A (en) 2021-11-17 2024-07-02 默克专利股份有限公司 Composition and method for improving metal structure fabrication by wet chemical etching

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3953408A (en) 1970-12-26 1976-04-27 Asahi Kasei Kogyo Kabushiki Kaisha Addition polymerizable polymeric compounds
US4251665A (en) 1978-05-22 1981-02-17 King Industries, Inc. Aromatic sulfonic acid oxa-azacyclopentane adducts
US4200729A (en) 1978-05-22 1980-04-29 King Industries, Inc Curing amino resins with aromatic sulfonic acid oxa-azacyclopentane adducts
DE3619130A1 (en) 1986-06-06 1987-12-10 Basf Ag LIGHT SENSITIVE RECORDING ELEMENT
US5187019A (en) 1991-09-06 1993-02-16 King Industries, Inc. Latent catalysts
JPH0878318A (en) 1994-09-08 1996-03-22 Japan Synthetic Rubber Co Ltd Alkali development type photo-resist composition
KR100256392B1 (en) 1996-09-30 2000-05-15 겐지 아이다 Photosensitive resin coloring composition for color filter, color filter formed therefrom, new anthraquinone compound and preparing method thereof
SG85613A1 (en) 1998-02-06 2002-01-15 Morton Int Inc Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers
US6210846B1 (en) 1999-08-13 2001-04-03 Advanced Micro Devices, Inc. Exposure during rework for enhanced resist removal
EP1150165A1 (en) 2000-04-25 2001-10-31 JSR Corporation Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element
US20020058198A1 (en) * 2000-09-08 2002-05-16 Shipley Company, L.L.C. Fluorinated phenolic polymers and photoresist compositions comprising same
JP4190167B2 (en) 2000-09-26 2008-12-03 富士フイルム株式会社 Positive resist composition
KR20040029977A (en) 2001-05-11 2004-04-08 쉬플리 캄파니, 엘.엘.씨. Thick film photoresists and methods for use thereof
JP3894001B2 (en) 2001-09-06 2007-03-14 住友化学株式会社 Chemically amplified positive resist composition
JP2003114520A (en) 2001-10-05 2003-04-18 Fuji Photo Film Co Ltd Photopolymerizable composition and recording material using the same
JP2003287890A (en) 2002-01-23 2003-10-10 Toray Ind Inc Positive radiation-sensitive composition and method for producing resist pattern using the same
JP4048791B2 (en) 2002-02-18 2008-02-20 Jsr株式会社 Radiation sensitive resin composition
JP4184813B2 (en) 2002-02-19 2008-11-19 コダックグラフィックコミュニケーションズ株式会社 Photosensitive composition, photosensitive lithographic printing plate and method for producing lithographic printing plate using the same
US20030235775A1 (en) 2002-06-13 2003-12-25 Munirathna Padmanaban Photoresist composition for deep ultraviolet lithography comprising a mixture of photoactive compounds
US7083892B2 (en) * 2002-06-28 2006-08-01 Fuji Photo Film Co., Ltd. Resist composition
JP3895269B2 (en) 2002-12-09 2007-03-22 富士通株式会社 Resist pattern forming method, semiconductor device, and manufacturing method thereof
JP4393861B2 (en) 2003-03-14 2010-01-06 東京応化工業株式会社 Magnetic film pattern formation method
US7358408B2 (en) 2003-05-16 2008-04-15 Az Electronic Materials Usa Corp. Photoactive compounds
US20040265733A1 (en) 2003-06-30 2004-12-30 Houlihan Francis M. Photoacid generators
TW589516B (en) * 2003-07-22 2004-06-01 Ind Tech Res Inst Positive photo resist with uniform reactivity and patterning process using the same
JP4384570B2 (en) 2003-12-01 2009-12-16 東京応化工業株式会社 Photoresist composition for thick film and method for forming resist pattern
KR100564597B1 (en) 2003-12-20 2006-03-28 삼성전자주식회사 Photomask and fabricating method the same
EP1729176B1 (en) * 2004-03-24 2017-06-28 JSR Corporation Positive radiation-sensitive resin composition
US20050271974A1 (en) 2004-06-08 2005-12-08 Rahman M D Photoactive compounds
US7255970B2 (en) * 2005-07-12 2007-08-14 Az Electronic Materials Usa Corp. Photoresist composition for imaging thick films
US7601482B2 (en) 2006-03-28 2009-10-13 Az Electronic Materials Usa Corp. Negative photoresist compositions
KR101474900B1 (en) 2006-09-27 2014-12-19 후지필름 가부시키가이샤 Compound or its tautomer, metal complex compound, colored photosensitive curing composition, color filter, and production
KR101242332B1 (en) * 2006-10-17 2013-03-12 신에쓰 가가꾸 고교 가부시끼가이샤 Resist Composition and Patterning Process
WO2008065827A1 (en) 2006-11-28 2008-06-05 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified positive-type photoresist composition for thick film, chemically amplified dry film for thick film, and method for production of thick film resist pattern
EP2177952A4 (en) * 2007-08-10 2011-05-04 Fujifilm Corp Positive working resist composition and method for pattern formation using the positive working resist composition
JP2009063823A (en) 2007-09-06 2009-03-26 Tokyo Ohka Kogyo Co Ltd Positive photoresist composition, laminate, and pattern forming method
JP2009063824A (en) 2007-09-06 2009-03-26 Tokyo Ohka Kogyo Co Ltd Positive photoresist composition, laminate, and pattern forming method
US8715918B2 (en) * 2007-09-25 2014-05-06 Az Electronic Materials Usa Corp. Thick film resists
KR101430533B1 (en) 2008-01-04 2014-08-22 솔브레인 주식회사 Negative photoresist composition and method of manufacturing array substrate using the same
WO2009110848A1 (en) 2008-03-04 2009-09-11 Agency For Science, Technology And Research Low shrinkage multifunctional ssq resins
JP5216573B2 (en) * 2008-03-31 2013-06-19 富士フイルム株式会社 Actinic ray or radiation sensitive resin composition and pattern forming method using the same
JP5721992B2 (en) 2009-10-14 2015-05-20 富士フイルム株式会社 Colored curable composition, resist solution, ink-jet ink, color filter, method for producing color filter, solid-state imaging device, liquid crystal display, organic EL display, image display device, and dye compound
JP2012014021A (en) 2010-07-01 2012-01-19 Fujifilm Corp Photosensitive composition, pattern forming material, and photosensitive film, pattern forming method, patterned film, antireflection film, insulating film, optical device and electronic device using the composition
JP2012012602A (en) 2010-07-05 2012-01-19 Lg Chem Ltd Alkali-soluble resin polymer and negative photosensitive resin composition containing the same
JP5749631B2 (en) * 2010-12-07 2015-07-15 東京応化工業株式会社 Chemically amplified positive photoresist composition for thick film and method for producing thick film resist pattern
JP6195445B2 (en) * 2012-02-27 2017-09-13 東京応化工業株式会社 POSITIVE PHOTORESIST COMPOSITION, PHOTORESIST LAMINATE, PHOTORESIST PATTERN MANUFACTURING METHOD, AND CONNECTION TERMINAL MANUFACTURING METHOD
US8906594B2 (en) 2012-06-15 2014-12-09 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working thick film photoresist

Also Published As

Publication number Publication date
TW201403240A (en) 2014-01-16
EP2862024B1 (en) 2021-12-01
KR20150032523A (en) 2015-03-26
JP6157605B2 (en) 2017-07-05
CN104380198B (en) 2018-09-21
KR101942137B1 (en) 2019-01-24
US9012126B2 (en) 2015-04-21
CN104380198A (en) 2015-02-25
EP2862024A1 (en) 2015-04-22
WO2013185989A1 (en) 2013-12-19
TWI569102B (en) 2017-02-01
US20130337380A1 (en) 2013-12-19
JP2015526752A (en) 2015-09-10

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