SG11201501598TA - Positive photosensitive resin composition - Google Patents
Positive photosensitive resin compositionInfo
- Publication number
- SG11201501598TA SG11201501598TA SG11201501598TA SG11201501598TA SG11201501598TA SG 11201501598T A SG11201501598T A SG 11201501598TA SG 11201501598T A SG11201501598T A SG 11201501598TA SG 11201501598T A SG11201501598T A SG 11201501598TA SG 11201501598T A SG11201501598T A SG 11201501598TA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- photosensitive resin
- positive photosensitive
- positive
- composition
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/074367 WO2014045434A1 (en) | 2012-09-24 | 2012-09-24 | Positive photosensitive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201501598TA true SG11201501598TA (en) | 2015-04-29 |
Family
ID=50340783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201501598TA SG11201501598TA (en) | 2012-09-24 | 2012-09-24 | Positive photosensitive resin composition |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150219991A1 (en) |
| EP (1) | EP2902846B1 (en) |
| JP (1) | JP6102736B2 (en) |
| KR (1) | KR101969197B1 (en) |
| CN (1) | CN104641291B (en) |
| PT (1) | PT2902846T (en) |
| SG (1) | SG11201501598TA (en) |
| WO (1) | WO2014045434A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014050558A1 (en) * | 2012-09-25 | 2014-04-03 | 東レ株式会社 | Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition |
| JP6801452B2 (en) | 2015-03-24 | 2020-12-16 | 東レ株式会社 | Photosensitive resin composition |
| CN107429058B (en) * | 2015-04-24 | 2020-08-07 | 东丽株式会社 | Resin composition, method for manufacturing semiconductor element using same, and semiconductor device |
| WO2017169009A1 (en) * | 2016-03-28 | 2017-10-05 | 東レ株式会社 | Resin composition, cured relief pattern thereof, and method for manufacturing semiconductor electronic component or semiconductor device using same |
| TW201821280A (en) | 2016-09-30 | 2018-06-16 | 日商富士軟片股份有限公司 | Laminate and manufacturing method for semiconductor element |
| JP6810677B2 (en) | 2017-12-05 | 2021-01-06 | 信越化学工業株式会社 | New tetracarboxylic dianhydride, polyimide resin and its manufacturing method, photosensitive resin composition, pattern forming method and cured film forming method, interlayer insulating film, surface protective film, electronic parts |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004109403A1 (en) * | 2003-06-02 | 2004-12-16 | Toray Industries, Inc. | Photosensitive resin composition, and electronic component and display using same |
| JP4918968B2 (en) | 2005-05-09 | 2012-04-18 | 日立化成デュポンマイクロシステムズ株式会社 | Positive photosensitive resin composition, pattern manufacturing method, and electronic component |
| JP4539505B2 (en) | 2005-09-12 | 2010-09-08 | 住友ベークライト株式会社 | Photosensitive resin composition |
| JP5386781B2 (en) | 2007-03-12 | 2014-01-15 | 日立化成デュポンマイクロシステムズ株式会社 | Photosensitive resin composition, method for producing patterned cured film using the resin composition, and electronic component |
| KR20120085313A (en) * | 2007-06-06 | 2012-07-31 | 히다치 가세고교 가부시끼가이샤 | Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor device |
| CN101910350B (en) * | 2008-01-16 | 2013-01-16 | 日立化成工业株式会社 | Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device |
| JP5353064B2 (en) * | 2008-02-19 | 2013-11-27 | 日立化成株式会社 | Photosensitive adhesive composition, adhesive film obtained using the same, adhesive sheet, adhesive pattern, and semiconductor device |
| JP5315754B2 (en) * | 2008-03-31 | 2013-10-16 | Ｊｓｒ株式会社 | Radiation sensitive resin composition |
| JP2009258471A (en) | 2008-04-18 | 2009-11-05 | Toray Ind Inc | Photosensitive resin composition film and method for forming resist using the same |
| JP5477527B2 (en) * | 2008-09-30 | 2014-04-23 | 日産化学工業株式会社 | Positive photosensitive resin composition containing terminal functional group-containing polyimide |
| CN102186904A (en) * | 2008-10-20 | 2011-09-14 | 日本化药株式会社 | Polyamide resin and composition thereof |
| JP5206977B2 (en) * | 2009-03-12 | 2013-06-12 | 信越化学工業株式会社 | Novel polyimide silicone, photosensitive resin composition containing the same, and pattern forming method |
| CN102449069B (en) * | 2009-05-29 | 2014-02-12 | Dic株式会社 | Thermosetting resin composite and cured product thereof |
| JP2011017898A (en) * | 2009-07-09 | 2011-01-27 | Toray Ind Inc | Photosensitive cover lay |
| JP5483315B2 (en) | 2009-07-09 | 2014-05-07 | Ｙｋｋ Ａｐ株式会社 | Hinged door |
| JP5732815B2 (en) * | 2009-10-30 | 2015-06-10 | 日立化成株式会社 | Photosensitive adhesive composition, film adhesive using the same, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, transparent substrate with adhesive layer, and semiconductor device. |
| KR101202012B1 (en) * | 2009-12-08 | 2012-11-20 | 주식회사 엘지화학 | Photo-sensitive Polyimide resin composition |
| JP5417623B2 (en) * | 2009-12-10 | 2014-02-19 | 信越化学工業株式会社 | Polyimide-based photocurable resin composition, pattern forming method, and film for protecting substrate |
| TWI516527B (en) * | 2009-12-10 | 2016-01-11 | 信越化學工業股份有限公司 | Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition |
| SG186462A1 (en) * | 2010-07-02 | 2013-01-30 | Toray Industries | Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film |
| JP5291744B2 (en) * | 2010-11-02 | 2013-09-18 | 富士フイルム株式会社 | Photosensitive resin composition for etching resist, pattern manufacturing method, MEMS structure and manufacturing method thereof, dry etching method, wet etching method, MEMS shutter device, and image display device |
| JP5742376B2 (en) * | 2011-03-30 | 2015-07-01 | 東レ株式会社 | Positive photosensitive resin composition |
-
2012
- 2012-09-24 JP JP2013506966A patent/JP6102736B2/en active Active
- 2012-09-24 PT PT128847555T patent/PT2902846T/en unknown
- 2012-09-24 SG SG11201501598TA patent/SG11201501598TA/en unknown
- 2012-09-24 US US14/422,572 patent/US20150219991A1/en not_active Abandoned
- 2012-09-24 KR KR1020157009233A patent/KR101969197B1/en active IP Right Grant
- 2012-09-24 EP EP12884755.5A patent/EP2902846B1/en active Active
- 2012-09-24 CN CN201280075939.3A patent/CN104641291B/en active Active
- 2012-09-24 WO PCT/JP2012/074367 patent/WO2014045434A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN104641291A (en) | 2015-05-20 |
| PT2902846T (en) | 2019-12-18 |
| EP2902846A1 (en) | 2015-08-05 |
| CN104641291B (en) | 2017-12-12 |
| US20150219991A1 (en) | 2015-08-06 |
| EP2902846B1 (en) | 2019-11-20 |
| JP6102736B2 (en) | 2017-03-29 |
| JPWO2014045434A1 (en) | 2016-08-18 |
| KR101969197B1 (en) | 2019-04-15 |
| WO2014045434A1 (en) | 2014-03-27 |
| EP2902846A4 (en) | 2016-06-01 |
| KR20150063424A (en) | 2015-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG10201706103VA (en) | Resin composition | |
| EP2829534A4 (en) | Novel compound and photosensitive resin composition | |
| EP2869126A4 (en) | Toner | |
| EP2799489A4 (en) | Resin composition | |
| EP2898373A4 (en) | Toner | |
| EP2837661A4 (en) | Resin composition | |
| EP2857428A4 (en) | Epoxy resin composition | |
| EP2810989A4 (en) | Polycarbonate resin composition | |
| EP2871215A4 (en) | Polycarbonate resin composition | |
| EP2918636A4 (en) | Methacrylic resin composition | |
| EP2949697A4 (en) | Resin composition | |
| EP2840117A4 (en) | Polycarbonate resin composition | |
| EP2832795A4 (en) | Resin composition | |
| EP2848646A4 (en) | Cellulose resin composition | |
| EP2921526A4 (en) | Thermosetting resin composition | |
| EP2891924A4 (en) | Toner | |
| EP2829574A4 (en) | Light-diffusible resin composition | |
| SG11201407090XA (en) | Positive photosensitive material | |
| EP2896658A4 (en) | Curable resin composition | |
| EP3015523A4 (en) | Resin composition | |
| EP2871197A4 (en) | Phenolic resin composition | |
| EP2868699A4 (en) | Resin composition | |
| EP2711774A4 (en) | Photosensitive resin composition | |
| EP2980157A4 (en) | Resin composition | |
| EP2891923A4 (en) | Toner |