SG11201407406RA - Ceiling storage device capable of wafer purging - Google Patents

Ceiling storage device capable of wafer purging

Info

Publication number
SG11201407406RA
SG11201407406RA SG11201407406RA SG11201407406RA SG11201407406RA SG 11201407406R A SG11201407406R A SG 11201407406RA SG 11201407406R A SG11201407406R A SG 11201407406RA SG 11201407406R A SG11201407406R A SG 11201407406RA SG 11201407406R A SG11201407406R A SG 11201407406RA
Authority
SG
Singapore
Prior art keywords
storage device
device capable
ceiling storage
wafer purging
purging
Prior art date
Application number
SG11201407406RA
Other languages
English (en)
Inventor
Jae Won Jang
Ho Geun Lee
Jun Pil Yun
Jung Young Lee
Sung Goo Choi
Original Assignee
Daifuku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daifuku Kk filed Critical Daifuku Kk
Publication of SG11201407406RA publication Critical patent/SG11201407406RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
SG11201407406RA 2012-10-31 2013-10-07 Ceiling storage device capable of wafer purging SG11201407406RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120122129A KR101418812B1 (ko) 2012-10-31 2012-10-31 웨이퍼 퍼지 가능한 천장 보관 장치
PCT/KR2013/008923 WO2014069804A1 (ko) 2012-10-31 2013-10-07 웨이퍼 퍼지 가능한 천장 보관 장치

Publications (1)

Publication Number Publication Date
SG11201407406RA true SG11201407406RA (en) 2015-03-30

Family

ID=50627655

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407406RA SG11201407406RA (en) 2012-10-31 2013-10-07 Ceiling storage device capable of wafer purging

Country Status (7)

Country Link
US (1) US9412631B2 (ko)
JP (1) JP6075461B2 (ko)
KR (1) KR101418812B1 (ko)
CN (1) CN104246970B (ko)
SG (1) SG11201407406RA (ko)
TW (1) TWI568508B (ko)
WO (1) WO2014069804A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101865091B1 (ko) * 2014-06-16 2018-06-07 무라다기카이가부시끼가이샤 퍼지 스토커 및 퍼지 방법
WO2016047260A1 (ja) 2014-09-25 2016-03-31 村田機械株式会社 パージ装置及びパージ方法
JP6311579B2 (ja) * 2014-11-12 2018-04-18 株式会社ダイフク 物品搬送設備
WO2017033546A1 (ja) * 2015-08-25 2017-03-02 村田機械株式会社 パージ装置、パージストッカ、及びパージ方法
DE102016205597B4 (de) * 2016-04-05 2022-06-23 Fabmatics Gmbh Purge-Messsystem für FOUPs
WO2017212841A1 (ja) 2016-06-08 2017-12-14 村田機械株式会社 容器保管装置及び容器保管方法
WO2020017137A1 (ja) * 2018-07-20 2020-01-23 村田機械株式会社 保管棚及び保管棚の設置方法
US10964570B2 (en) 2018-12-03 2021-03-30 Samsung Electronics Co., Ltd. Semiconductor wafer storage system and method of supplying fluid for semiconductor wafer storage
KR102195523B1 (ko) * 2019-10-10 2020-12-28 주식회사 아셀 Stb 인라인 기능검사 방법
WO2021090542A1 (ja) * 2019-11-05 2021-05-14 村田機械株式会社 搬送車システム
US20230134774A1 (en) * 2020-03-05 2023-05-04 Murata Machinery, Ltd. Storage shelf
KR102318029B1 (ko) * 2020-06-29 2021-10-27 주식회사 아셀 유량 테스트 수단을 포함하는 퍼지가스 공급장치
WO2022102264A1 (ja) * 2020-11-12 2022-05-19 村田機械株式会社 保管棚
JP7311063B2 (ja) 2021-02-24 2023-07-19 村田機械株式会社 パージ装置
KR20220127629A (ko) 2021-03-11 2022-09-20 세메스 주식회사 자재 보관 장치 및 이를 포함하는 물류 관리 설비
US20240180325A1 (en) * 2021-04-14 2024-06-06 Murata Machinery, Ltd. Storage rack

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JPH0383896A (ja) * 1989-08-25 1991-04-09 Sumitomo Metal Ind Ltd 気相エピタキシャル成長装置
JP2003092345A (ja) * 2001-07-13 2003-03-28 Semiconductor Leading Edge Technologies Inc 基板収納容器、基板搬送システム、保管装置及びガス置換方法
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
US20040237244A1 (en) * 2003-05-26 2004-12-02 Tdk Corporation Purge system for product container and interface seal used in the system
JP3983254B2 (ja) * 2005-06-24 2007-09-26 Ｔｄｋ株式会社 製品収容容器用パージシステム及び該パージシステムに供せられる台
JP2008024429A (ja) * 2006-07-20 2008-02-07 Toshiba Corp 電子装置の製造方法
JP4842771B2 (ja) * 2006-11-15 2011-12-21 東京エレクトロン株式会社 処理システムと処理方法および記録媒体
JP4670808B2 (ja) * 2006-12-22 2011-04-13 ムラテックオートメーション株式会社 コンテナの搬送システム及び測定用コンテナ
JP4688824B2 (ja) * 2007-01-12 2011-05-25 村田機械株式会社 天井走行車システム及び天井走行車システムの周囲の処理装置の搬出入方法
JP4389181B2 (ja) * 2007-03-07 2009-12-24 株式会社ダイフク 物品処理設備
JP5276338B2 (ja) * 2008-02-27 2013-08-28 東レエンジニアリング株式会社 塗布装置
JP5062485B2 (ja) * 2008-04-09 2012-10-31 株式会社ダイフク 物品搬送設備
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JP5440871B2 (ja) * 2010-08-20 2014-03-12 株式会社ダイフク 容器保管設備
KR101147192B1 (ko) * 2011-11-11 2012-05-25 주식회사 엘에스테크 웨이퍼 표면상의 증착 이물 제거 장치
JP5716968B2 (ja) * 2012-01-04 2015-05-13 株式会社ダイフク 物品保管設備
JP5700255B2 (ja) * 2012-03-27 2015-04-15 株式会社ダイフク 物品保管設備及び物品搬送設備
EP2889235B1 (en) * 2012-08-21 2020-08-05 Murata Machinery, Ltd. Stocker provided with purging functionality, stocker unit, and method for supplying cleaning gas
JP5884779B2 (ja) * 2013-06-26 2016-03-15 株式会社ダイフク 物品保管設備
JP5888287B2 (ja) * 2013-06-26 2016-03-16 株式会社ダイフク 処理設備

Also Published As

Publication number Publication date
CN104246970A (zh) 2014-12-24
US20150235884A1 (en) 2015-08-20
US9412631B2 (en) 2016-08-09
JP2015533026A (ja) 2015-11-16
KR20140055393A (ko) 2014-05-09
TWI568508B (zh) 2017-02-01
JP6075461B2 (ja) 2017-02-08
CN104246970B (zh) 2017-06-13
WO2014069804A1 (ko) 2014-05-08
TW201416142A (zh) 2014-05-01
KR101418812B1 (ko) 2014-07-16

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