JP7311063B2 - パージ装置 - Google Patents
パージ装置 Download PDFInfo
- Publication number
- JP7311063B2 JP7311063B2 JP2023502157A JP2023502157A JP7311063B2 JP 7311063 B2 JP7311063 B2 JP 7311063B2 JP 2023502157 A JP2023502157 A JP 2023502157A JP 2023502157 A JP2023502157 A JP 2023502157A JP 7311063 B2 JP7311063 B2 JP 7311063B2
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- JP
- Japan
- Prior art keywords
- nozzle
- gas
- base
- container
- positioning pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010926 purge Methods 0.000 title claims description 85
- 239000007789 gas Substances 0.000 description 120
- 238000003860 storage Methods 0.000 description 67
- 238000009826 distribution Methods 0.000 description 17
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000000872 buffer Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002715 modification method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Separation Of Gases By Adsorption (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Water Treatment By Sorption (AREA)
- Processing Of Meat And Fish (AREA)
Description
Claims (5)
- パージ対象の容器を支持する位置決めピンが取り付けられる基台と、前記位置決めピンに支持された前記容器のガス注入口に接続されるノズルとを備えたパージ装置であって、
前記位置決めピンを介して前記基台上に取り付けられる本体部と、前記本体部に連結されると共に前記ノズルが設けられたガス導入部と、を有するノズルユニットを備えた、パージ装置。 - 前記本体部は、前記位置決めピンに支持された前記容器の底面と前記基台との間に配置される平板部材を含む、請求項1に記載のパージ装置。
- 前記ガス導入部は前記本体部に一体化されており、前記ノズルは前記位置決めピンに対して所定の位置に配置されて固定されている、請求項1又は2に記載のパージ装置。
- 前記ガス導入部は、前記ノズルの下側に配置されて前記ノズルを支持する弾性部材を含み、前記ノズルは前記弾性部材によって上方に付勢されると共に上下動自在である、請求項1又は2に記載のパージ装置。
- 前記ガス導入部は、水平に配置された回動軸を介して前記本体部に連結されると共に前記本体部に対して回動可能な回動アームを含み、前記回動アームは、前記回動軸が設けられた第1端と第1端とは反対側の第2端とを含み、
前記ノズルは前記第2端に設けられている、請求項4に記載のパージ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021027622 | 2021-02-24 | ||
JP2021027622 | 2021-02-24 | ||
PCT/JP2022/001117 WO2022181103A1 (ja) | 2021-02-24 | 2022-01-14 | パージ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022181103A1 JPWO2022181103A1 (ja) | 2022-09-01 |
JP7311063B2 true JP7311063B2 (ja) | 2023-07-19 |
Family
ID=83048869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023502157A Active JP7311063B2 (ja) | 2021-02-24 | 2022-01-14 | パージ装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20240128108A1 (ja) |
EP (1) | EP4290561A1 (ja) |
JP (1) | JP7311063B2 (ja) |
KR (1) | KR20230142623A (ja) |
CN (1) | CN116868325A (ja) |
IL (1) | IL305128A (ja) |
TW (1) | TW202243090A (ja) |
WO (1) | WO2022181103A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010182747A (ja) | 2009-02-03 | 2010-08-19 | Dan Takuma:Kk | 保管システムおよび保管方法 |
US20140360531A1 (en) | 2013-06-05 | 2014-12-11 | Global Foundries, Inc. | Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication |
WO2019239672A1 (ja) | 2018-06-15 | 2019-12-19 | 村田機械株式会社 | 保管棚 |
US20200168488A1 (en) | 2018-11-28 | 2020-05-28 | Brooks Automation, Inc. | Load port module |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101418812B1 (ko) | 2012-10-31 | 2014-07-16 | 크린팩토메이션 주식회사 | 웨이퍼 퍼지 가능한 천장 보관 장치 |
-
2022
- 2022-01-14 US US18/277,447 patent/US20240128108A1/en active Pending
- 2022-01-14 EP EP22759146.8A patent/EP4290561A1/en active Pending
- 2022-01-14 IL IL305128A patent/IL305128A/en unknown
- 2022-01-14 WO PCT/JP2022/001117 patent/WO2022181103A1/ja active Application Filing
- 2022-01-14 CN CN202280016031.9A patent/CN116868325A/zh active Pending
- 2022-01-14 KR KR1020237031351A patent/KR20230142623A/ko unknown
- 2022-01-14 JP JP2023502157A patent/JP7311063B2/ja active Active
- 2022-02-22 TW TW111106295A patent/TW202243090A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010182747A (ja) | 2009-02-03 | 2010-08-19 | Dan Takuma:Kk | 保管システムおよび保管方法 |
US20140360531A1 (en) | 2013-06-05 | 2014-12-11 | Global Foundries, Inc. | Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication |
WO2019239672A1 (ja) | 2018-06-15 | 2019-12-19 | 村田機械株式会社 | 保管棚 |
US20200168488A1 (en) | 2018-11-28 | 2020-05-28 | Brooks Automation, Inc. | Load port module |
Also Published As
Publication number | Publication date |
---|---|
US20240128108A1 (en) | 2024-04-18 |
KR20230142623A (ko) | 2023-10-11 |
JPWO2022181103A1 (ja) | 2022-09-01 |
WO2022181103A1 (ja) | 2022-09-01 |
IL305128A (en) | 2023-10-01 |
TW202243090A (zh) | 2022-11-01 |
EP4290561A1 (en) | 2023-12-13 |
CN116868325A (zh) | 2023-10-10 |
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