SG11201407231PA - Replaceable wafer support backstop - Google Patents

Replaceable wafer support backstop

Info

Publication number
SG11201407231PA
SG11201407231PA SG11201407231PA SG11201407231PA SG11201407231PA SG 11201407231P A SG11201407231P A SG 11201407231PA SG 11201407231P A SG11201407231P A SG 11201407231PA SG 11201407231P A SG11201407231P A SG 11201407231PA SG 11201407231P A SG11201407231P A SG 11201407231PA
Authority
SG
Singapore
Prior art keywords
lllll
international
wafer
llll
backstop
Prior art date
Application number
SG11201407231PA
Other languages
English (en)
Inventor
Matthew Fuller
John Burns
Original Assignee
Entergris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entergris Inc filed Critical Entergris Inc
Publication of SG11201407231PA publication Critical patent/SG11201407231PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/4973—Replacing of defective part

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • User Interface Of Digital Computer (AREA)
SG11201407231PA 2012-05-04 2013-05-06 Replaceable wafer support backstop SG11201407231PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261643091P 2012-05-04 2012-05-04
PCT/US2013/039763 WO2013166512A1 (en) 2012-05-04 2013-05-06 Replaceable wafer support backstop

Publications (1)

Publication Number Publication Date
SG11201407231PA true SG11201407231PA (en) 2014-12-30

Family

ID=49514950

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407231PA SG11201407231PA (en) 2012-05-04 2013-05-06 Replaceable wafer support backstop

Country Status (8)

Country Link
US (1) US9343345B2 (zh)
EP (1) EP2845222B1 (zh)
JP (1) JP6214630B2 (zh)
KR (1) KR102117320B1 (zh)
CN (1) CN104662650B (zh)
SG (1) SG11201407231PA (zh)
TW (1) TWI591001B (zh)
WO (1) WO2013166512A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6772498B2 (ja) 2016-03-18 2020-10-21 株式会社Sumco 基板収納容器
CN110770889B (zh) * 2017-04-06 2023-10-27 未来儿股份有限公司 基板收纳容器
US20240162068A1 (en) * 2022-11-14 2024-05-16 Entegris, Inc. Semiconductor substrate carrying container with support wall formed with corrugation portions
CN116564867B (zh) * 2023-05-05 2024-02-20 北京鑫跃微半导体技术有限公司 晶圆承载装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4995430A (en) 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5575394A (en) 1994-07-15 1996-11-19 Fluoroware, Inc. Wafer shipper and package
US5785186A (en) * 1994-10-11 1998-07-28 Progressive System Technologies, Inc. Substrate housing and docking system
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
JP4090115B2 (ja) * 1998-06-09 2008-05-28 信越ポリマー株式会社 基板収納容器
JP3370279B2 (ja) * 1998-07-07 2003-01-27 信越ポリマー株式会社 精密基板収納容器
US6267245B1 (en) * 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
JP4372313B2 (ja) 2000-06-20 2009-11-25 信越ポリマー株式会社 基板収納容器
US6880718B2 (en) 2002-01-15 2005-04-19 Entegris, Inc. Wafer carrier door and spring biased latching mechanism
US7182203B2 (en) 2003-11-07 2007-02-27 Entegris, Inc. Wafer container and door with vibration dampening latching mechanism
JP2005268665A (ja) * 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
JP4667769B2 (ja) 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器
JP4540529B2 (ja) * 2005-04-18 2010-09-08 信越ポリマー株式会社 収納容器
JP4584023B2 (ja) 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法
JP4412235B2 (ja) * 2005-05-25 2010-02-10 信越ポリマー株式会社 基板収納容器
WO2007146936A2 (en) * 2006-06-13 2007-12-21 Entegris, Inc. Reusable resilient cushion for wafer container
US8356713B2 (en) 2007-11-09 2013-01-22 Shin-Etsu Polymer Co., Ltd. Retainer and substrate storage container
TWI469901B (zh) * 2008-01-13 2015-01-21 Entegris Inc 晶圓容置箱及其製造方法
KR101589325B1 (ko) * 2008-06-23 2016-01-27 신에츠 폴리머 가부시키가이샤 지지체 및 기판 수납 용기
TWI371076B (en) * 2008-08-27 2012-08-21 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
US8387799B2 (en) * 2008-08-27 2013-03-05 Gudeng Precision Industrial Co, Ltd. Wafer container with purgeable supporting module
JP2010182948A (ja) 2009-02-06 2010-08-19 Shin Etsu Polymer Co Ltd 基板収納容器
JP2011060877A (ja) * 2009-09-08 2011-03-24 Shin Etsu Polymer Co Ltd 基板用支持体及び基板収納容器
JP2011060994A (ja) * 2009-09-10 2011-03-24 Shin Etsu Polymer Co Ltd 基板収納容器及び基板の取り扱い方法
DE112010005511B4 (de) * 2010-04-20 2016-06-02 Miraial Co., Ltd. Substrataufbewahrungsbehälter mit beweglichen Stützstrukturen
CN102858653B (zh) * 2010-05-24 2014-09-10 未来儿株式会社 基板收纳容器
CN103262230B (zh) 2010-10-20 2016-05-11 恩特格里公司 具有门导件及密封件的晶片容器
JP5738118B2 (ja) * 2011-08-08 2015-06-17 信越ポリマー株式会社 基板収納容器

Also Published As

Publication number Publication date
US9343345B2 (en) 2016-05-17
EP2845222A1 (en) 2015-03-11
JP6214630B2 (ja) 2017-10-18
TWI591001B (zh) 2017-07-11
EP2845222B1 (en) 2020-07-01
CN104662650A (zh) 2015-05-27
WO2013166512A8 (en) 2015-03-26
TW201408563A (zh) 2014-03-01
US20150129459A1 (en) 2015-05-14
WO2013166512A1 (en) 2013-11-07
EP2845222A4 (en) 2015-12-16
KR102117320B1 (ko) 2020-06-01
JP2015520946A (ja) 2015-07-23
CN104662650B (zh) 2017-12-22
KR20150013653A (ko) 2015-02-05

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