SG11201407213TA - Wafer container with door mounted shipping cushions - Google Patents

Wafer container with door mounted shipping cushions

Info

Publication number
SG11201407213TA
SG11201407213TA SG11201407213TA SG11201407213TA SG11201407213TA SG 11201407213T A SG11201407213T A SG 11201407213TA SG 11201407213T A SG11201407213T A SG 11201407213TA SG 11201407213T A SG11201407213T A SG 11201407213TA SG 11201407213T A SG11201407213T A SG 11201407213TA
Authority
SG
Singapore
Prior art keywords
wafer
international
defining
cushion
grooves
Prior art date
Application number
SG11201407213TA
Inventor
Barry Gregerson
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of SG11201407213TA publication Critical patent/SG11201407213TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

Abstract

(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 7 November 2013 (07.11.2013) WIPOIPCT (10) International Publication Number WO 2013/166515 Al (51) International Patent Classification: H01L 21/673 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/US2013/039769 6 May 2013 (06.05.2013) English English (30) Priority Data: 61/643,158 4 May 2012 (04.05.2012) US (71) Applicant: ENTEGRIS, INC. [US/US]; 129 Concord Road, Billerica, MA 01821 (US). (72) Inventor: GREGERSON, Barry; 19550 Excelsior Boulevard, Deephaven, MN 55113 (US). (74) Agents: CHRISTENSEN, Douglas, J. et al.; Christensen Fonder P.A., 33 South Sixth Street, Suite 3940, Min­ neapolis, MN 55402 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) — before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h)) (54) Title: WAFER CONTAINER WITH DOOR MOUNTED SHIPPING CUSHIONS •H •- (57) Abstract: A cushioned wafer container sys­ tem having removable wafer cushions for trans­ porting large-diameter wafers. The system includes a wafer container enclosure defining a front open­ ing and comprising rear a wall, and a plurality of wafer supports defining a plurality of slots; a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side; a primary wafer cushion coupled to a rear side of the front door at a central portion of the front door, the primary wafer cushion defining a plurality of wafer grooves, each of the grooves of the primary wafer cushion aligned with a slot of the wafer supports; and a first removable wafer cushion attachable to the rear side of the front door adjacent the primary wafer cushion, the first re­ movable wafer cushion defining a plurality of wafer-receiving grooves in alignment with the grooves and slots.
SG11201407213TA 2012-05-04 2013-05-06 Wafer container with door mounted shipping cushions SG11201407213TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261643158P 2012-05-04 2012-05-04
PCT/US2013/039769 WO2013166515A1 (en) 2012-05-04 2013-05-06 Wafer container with door mounted shipping cushions

Publications (1)

Publication Number Publication Date
SG11201407213TA true SG11201407213TA (en) 2014-12-30

Family

ID=49514952

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407213TA SG11201407213TA (en) 2012-05-04 2013-05-06 Wafer container with door mounted shipping cushions

Country Status (8)

Country Link
US (1) US9633877B2 (en)
EP (1) EP2845224B1 (en)
JP (1) JP6220382B2 (en)
KR (1) KR102112659B1 (en)
CN (1) CN104471696B (en)
SG (1) SG11201407213TA (en)
TW (1) TWI568653B (en)
WO (1) WO2013166515A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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EP3234991B1 (en) * 2014-12-18 2021-07-07 Entegris, Inc. Wafer container with shock condition protection
KR102208275B1 (en) * 2016-02-05 2021-01-27 엔테그리스, 아이엔씨. Cushion retainer for substrate container
US10388554B2 (en) 2016-04-06 2019-08-20 Entegris, Inc. Wafer shipper with purge capability
JP6673185B2 (en) * 2016-12-22 2020-03-25 株式会社Sumco Cushioning material
WO2018154779A1 (en) * 2017-02-27 2018-08-30 ミライアル株式会社 Substrate housing container
US11587810B2 (en) * 2019-07-19 2023-02-21 Entegris, Inc. Wafer cushion
US11756816B2 (en) * 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
US11676838B2 (en) * 2021-02-26 2023-06-13 Visera Technologies Company Limiied Wafer cassette
CN116564867B (en) * 2023-05-05 2024-02-20 北京鑫跃微半导体技术有限公司 Wafer bearing device

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Also Published As

Publication number Publication date
CN104471696B (en) 2018-06-26
TWI568653B (en) 2017-02-01
EP2845224A4 (en) 2015-10-28
TW201408561A (en) 2014-03-01
CN104471696A (en) 2015-03-25
KR20150013655A (en) 2015-02-05
KR102112659B1 (en) 2020-05-19
JP6220382B2 (en) 2017-10-25
EP2845224B1 (en) 2020-07-01
WO2013166515A1 (en) 2013-11-07
JP2015517730A (en) 2015-06-22
US20150083639A1 (en) 2015-03-26
US9633877B2 (en) 2017-04-25
EP2845224A1 (en) 2015-03-11

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