SG11201407231PA - Replaceable wafer support backstop - Google Patents

Replaceable wafer support backstop

Info

Publication number
SG11201407231PA
SG11201407231PA SG11201407231PA SG11201407231PA SG11201407231PA SG 11201407231P A SG11201407231P A SG 11201407231PA SG 11201407231P A SG11201407231P A SG 11201407231PA SG 11201407231P A SG11201407231P A SG 11201407231PA SG 11201407231P A SG11201407231P A SG 11201407231PA
Authority
SG
Singapore
Prior art keywords
lllll
international
wafer
llll
backstop
Prior art date
Application number
SG11201407231PA
Inventor
Matthew Fuller
John Burns
Original Assignee
Entergris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entergris Inc filed Critical Entergris Inc
Publication of SG11201407231PA publication Critical patent/SG11201407231PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/4973—Replacing of defective part

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • User Interface Of Digital Computer (AREA)

Abstract

(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 7 November 2013 (07.11.2013) WIPOIPCT (10) International Publication Number WO 2013/166512 A1 (51) International Patent Classification: H01L 21/673 (2006.01) B65D 85/38 (2006.01) B65D 85/86 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/US2013/039763 6 May 2013 (06.05.2013) English (30) Priority Data: 61/643,091 4 May 2012 (04.05.2012) English US (71) Applicant: ENTERGRIS, INC. [US/US]; 129 Concord Road, Billerica, MA 01821 (US). (72) Inventors: FULLER, Matthew; 1731 North Nevada Av­ enue, Colorado Springs, CO 80907 (US). BURNS, John; 6046 Bow Ridge Drive, Colorado Springs, CO 80918 (US). (74) Agent: CHRISTEN SEN, Douglas J.; CHRISTENSEN FONDER P.A., 33 South Sixth Street, Suite 3940, Min­ neapolis, Minnesota 55402 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) [Continued on next page] (54) Title: REPLACEABLE WAFER SUPPORT BACKSTOP CJ i-H Fig. 2 102--' \ \ -• \ V_126 11 V -114 (57) Abstract: A wafer container an enclos­ ure portion including a top wall, a bottom wall, a pair of side walls, a back wall, and a door frame opposite the back wall, the door frame defining a front opening, and wafer a support structure including two side wafer supports 5 each side wafer support including a removable backstop. The invention includes maintaining wafer containers by replacing the removable backstop. The invention includes converting shipping containers that ship large diameter wafers vertically to containers to be used in fabrication facilities that store wafers horizontally for robotic pickup for pro­ cessing. i-H o CJ o & WO 2013/166512 A11 lllll llllllll II llllll III lllll lllll III III III lllll lllll lllll lllll lllll llll llll lllllll llll llll — before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h))
SG11201407231PA 2012-05-04 2013-05-06 Replaceable wafer support backstop SG11201407231PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261643091P 2012-05-04 2012-05-04
PCT/US2013/039763 WO2013166512A1 (en) 2012-05-04 2013-05-06 Replaceable wafer support backstop

Publications (1)

Publication Number Publication Date
SG11201407231PA true SG11201407231PA (en) 2014-12-30

Family

ID=49514950

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201407231PA SG11201407231PA (en) 2012-05-04 2013-05-06 Replaceable wafer support backstop

Country Status (8)

Country Link
US (1) US9343345B2 (en)
EP (1) EP2845222B1 (en)
JP (1) JP6214630B2 (en)
KR (1) KR102117320B1 (en)
CN (1) CN104662650B (en)
SG (1) SG11201407231PA (en)
TW (1) TWI591001B (en)
WO (1) WO2013166512A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6772498B2 (en) 2016-03-18 2020-10-21 株式会社Sumco Board storage container
KR102605057B1 (en) * 2017-04-06 2023-11-24 미라이얼 가부시키가이샤 Substrate storage container
WO2024107365A1 (en) * 2022-11-14 2024-05-23 Entegris, Inc. Semiconductor substrate carrying container with support wall formed with corrugation portions
CN116564867B (en) * 2023-05-05 2024-02-20 北京鑫跃微半导体技术有限公司 Wafer bearing device

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US4995430A (en) 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5575394A (en) 1994-07-15 1996-11-19 Fluoroware, Inc. Wafer shipper and package
US5785186A (en) * 1994-10-11 1998-07-28 Progressive System Technologies, Inc. Substrate housing and docking system
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
JP4090115B2 (en) * 1998-06-09 2008-05-28 信越ポリマー株式会社 Substrate storage container
JP3370279B2 (en) * 1998-07-07 2003-01-27 信越ポリマー株式会社 Precision substrate storage container
US6267245B1 (en) 1998-07-10 2001-07-31 Fluoroware, Inc. Cushioned wafer container
JP4372313B2 (en) 2000-06-20 2009-11-25 信越ポリマー株式会社 Substrate storage container
US6880718B2 (en) 2002-01-15 2005-04-19 Entegris, Inc. Wafer carrier door and spring biased latching mechanism
US7182203B2 (en) 2003-11-07 2007-02-27 Entegris, Inc. Wafer container and door with vibration dampening latching mechanism
JP2005268665A (en) * 2004-03-19 2005-09-29 Fujimi Inc Polishing composition
JP4667769B2 (en) 2004-06-11 2011-04-13 信越ポリマー株式会社 Substrate storage container
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KR101395467B1 (en) * 2006-06-13 2014-05-14 엔테그리스, 아이엔씨. Reusable resilient cushion for wafer container
JP5253410B2 (en) 2007-11-09 2013-07-31 信越ポリマー株式会社 Retainer and substrate storage container
CN101981684B (en) * 2008-01-13 2013-01-30 诚实公司 Methods and apparatuses for large diameter wafer handling
JP5269077B2 (en) * 2008-06-23 2013-08-21 信越ポリマー株式会社 Support and substrate storage container
TWI371076B (en) * 2008-08-27 2012-08-21 Gudeng Prec Industral Co Ltd A wafer container with at least one supporting module having a long slot
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JP6114193B2 (en) 2010-10-20 2017-04-12 インテグリス・インコーポレーテッド Wafer container with door guide and seal
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Also Published As

Publication number Publication date
TWI591001B (en) 2017-07-11
EP2845222B1 (en) 2020-07-01
EP2845222A1 (en) 2015-03-11
CN104662650A (en) 2015-05-27
US20150129459A1 (en) 2015-05-14
JP6214630B2 (en) 2017-10-18
CN104662650B (en) 2017-12-22
US9343345B2 (en) 2016-05-17
EP2845222A4 (en) 2015-12-16
KR20150013653A (en) 2015-02-05
WO2013166512A8 (en) 2015-03-26
KR102117320B1 (en) 2020-06-01
JP2015520946A (en) 2015-07-23
WO2013166512A1 (en) 2013-11-07
TW201408563A (en) 2014-03-01

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