SG11201401899YA - Ferromagnetic material sputtering target containing chrome oxide - Google Patents

Ferromagnetic material sputtering target containing chrome oxide

Info

Publication number
SG11201401899YA
SG11201401899YA SG11201401899YA SG11201401899YA SG11201401899YA SG 11201401899Y A SG11201401899Y A SG 11201401899YA SG 11201401899Y A SG11201401899Y A SG 11201401899YA SG 11201401899Y A SG11201401899Y A SG 11201401899YA SG 11201401899Y A SG11201401899Y A SG 11201401899YA
Authority
SG
Singapore
Prior art keywords
sputtering target
ferromagnetic material
target containing
chrome oxide
material sputtering
Prior art date
Application number
SG11201401899YA
Other languages
English (en)
Inventor
Hideo Takami
Atsutoshi Arakawa
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201401899YA publication Critical patent/SG11201401899YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)
  • Magnetic Record Carriers (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Thin Magnetic Films (AREA)
SG11201401899YA 2012-02-23 2013-01-28 Ferromagnetic material sputtering target containing chrome oxide SG11201401899YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012037263 2012-02-23
PCT/JP2013/051695 WO2013125296A1 (ja) 2012-02-23 2013-01-28 クロム酸化物を含有する強磁性材スパッタリングターゲット

Publications (1)

Publication Number Publication Date
SG11201401899YA true SG11201401899YA (en) 2014-10-30

Family

ID=49005489

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201401899YA SG11201401899YA (en) 2012-02-23 2013-01-28 Ferromagnetic material sputtering target containing chrome oxide

Country Status (7)

Country Link
US (1) US9773653B2 (zh)
JP (1) JP5654121B2 (zh)
CN (1) CN104126026B (zh)
MY (1) MY170298A (zh)
SG (1) SG11201401899YA (zh)
TW (1) TWI582250B (zh)
WO (1) WO2013125296A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013125259A1 (ja) * 2012-02-23 2013-08-29 Jx日鉱日石金属株式会社 クロム酸化物を含有する強磁性材スパッタリングターゲット
JP6005767B2 (ja) * 2014-01-17 2016-10-12 Ｊｘ金属株式会社 磁性記録媒体用スパッタリングターゲット
CN104060229A (zh) * 2014-06-20 2014-09-24 贵研铂业股份有限公司 一种CoCrPt-氧化物磁记录靶材、薄膜及其制备方法
JP7317741B2 (ja) * 2020-02-07 2023-07-31 Ｊｘ金属株式会社 スパッタリングターゲット、磁性膜、及びスパッタリングターゲット作製用の原料混合粉末

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005083148A1 (ja) 2004-03-01 2005-09-09 Nippon Mining & Metals Co., Ltd. 表面欠陥の少ないスパッタリングターゲット及びその表面加工方法
WO2005093124A1 (ja) 2004-03-26 2005-10-06 Nippon Mining & Metals Co., Ltd. Ｃｏ-Ｃｒ-Ｐｔ-Ｂ系合金スパッタリングターゲット
US7494617B2 (en) 2005-04-18 2009-02-24 Heraeus Inc. Enhanced formulation of cobalt alloy matrix compositions
CN1854318A (zh) * 2005-04-18 2006-11-01 黑罗伊斯有限公司 钴合金基体组合物的增强制剂
US20060234091A1 (en) * 2005-04-19 2006-10-19 Heraeus, Inc. Enhanced multi-component oxide-containing sputter target alloy compositions
JP4727664B2 (ja) 2005-06-15 2011-07-20 Ｊｘ日鉱日石金属株式会社 スパッタリングターゲット用酸化クロム粉末及びスパッタリングターゲット
JP4553136B2 (ja) * 2005-07-29 2010-09-29 三菱マテリアル株式会社 パーティクル発生の少ない磁気記録膜形成用スパッタリングターゲット
WO2007080781A1 (ja) 2006-01-13 2007-07-19 Nippon Mining & Metals Co., Ltd. 非磁性材粒子分散型強磁性材スパッタリングターゲット
WO2007116834A1 (ja) 2006-03-31 2007-10-18 Mitsubishi Materials Corporation パーティクル発生の少ない磁気記録膜形成用Ｃｏ基焼結合金スパッタリングターゲットの製造方法、および磁気記録膜形成用Ｃｏ基焼結合金スパッタリングターゲット
CN101405429A (zh) * 2006-03-31 2009-04-08 三菱麻铁里亚尔株式会社 颗粒产生少的磁记录膜形成用Co基烧结合金溅射靶的制造方法、及磁记录膜形成用Co基烧结合金溅射靶
JP5024661B2 (ja) * 2007-03-26 2012-09-12 三菱マテリアル株式会社 パーティクル発生の少ない磁気記録膜形成用Ｃｏ基焼結合金スパッタリングターゲット
JP2009197310A (ja) * 2008-02-25 2009-09-03 Kobe Steel Ltd スパッタリングターゲット
JP2009215617A (ja) 2008-03-11 2009-09-24 Mitsui Mining & Smelting Co Ltd コバルト、クロム、および白金からなるマトリックス相と酸化物相とを含有するスパッタリングターゲット材およびその製造方法
CN101981224B (zh) 2008-03-28 2012-08-22 Jx日矿日石金属株式会社 非磁性材料粒子分散型强磁性材料溅射靶
JP5301531B2 (ja) 2008-04-03 2013-09-25 Ｊｘ日鉱日石金属株式会社 パーティクルの発生の少ないスパッタリングターゲット
CN102224276B (zh) 2009-03-03 2014-02-19 吉坤日矿日石金属株式会社 溅射靶及其制造方法
SG172790A1 (en) * 2009-03-27 2011-08-29 Jx Nippon Mining & Metals Corp Ferromagnetic-material sputtering target of nonmagnetic-material particle dispersion type
CN102482764B (zh) 2009-08-06 2014-06-18 吉坤日矿日石金属株式会社 无机物粒子分散型溅射靶
MY149640A (en) 2009-12-11 2013-09-13 Jx Nippon Mining & Metals Corp Sputtering target comprising oxide phase dispersed in co or co alloy phase, magnetic thin film made of co or co alloy phase and oxide phase, and magnetic recording medium using the said thin film
WO2011070860A1 (ja) 2009-12-11 2011-06-16 Jx日鉱日石金属株式会社 磁性材スパッタリングターゲット
MY153939A (en) 2009-12-25 2015-04-15 Jx Nippon Mining & Metals Corp Sputtering target with reduced particle generation and method of producing said target
MY149437A (en) 2010-01-21 2013-08-30 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
SG185768A1 (en) 2010-07-20 2013-01-30 Jx Nippon Mining & Metals Corp Sputtering target of ferromagnetic material with low generation of particles
CN102482765B (zh) 2010-07-20 2014-03-26 吉坤日矿日石金属株式会社 粉粒产生少的强磁性材料溅射靶
MY165512A (en) 2010-07-29 2018-03-28 Jx Nippon Mining & Metals Corp Sputtering target for magnetic recording film, and process for producing same
JP4871406B1 (ja) * 2010-08-06 2012-02-08 田中貴金属工業株式会社 マグネトロンスパッタリング用ターゲットおよびその製造方法
US20130134038A1 (en) 2010-09-03 2013-05-30 Jx Nippon Mining & Metals Corporation Ferromagnetic Material Sputtering Target
TWI374444B (en) * 2010-11-05 2012-10-11 Solar Applied Mat Tech Corp Sputtering targets and recording materials for hard disk formed by the sputtering target
CN103080368B (zh) 2010-12-09 2014-08-27 吉坤日矿日石金属株式会社 强磁性材料溅射靶
US20130175167A1 (en) 2010-12-15 2013-07-11 Jx Nippon Mining & Metals Corporation Ferromagnetic sputtering target and method for manufacturing same
SG188603A1 (en) 2010-12-17 2013-04-30 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
WO2012081340A1 (ja) 2010-12-17 2012-06-21 Jx日鉱日石金属株式会社 磁気記録膜用スパッタリングターゲット及びその製造方法
CN103261469A (zh) 2010-12-17 2013-08-21 吉坤日矿日石金属株式会社 强磁性材料溅射靶
SG189202A1 (en) 2010-12-22 2013-05-31 Jx Nippon Mining & Metals Corp Ferromagnetic sputtering target
WO2012086388A1 (ja) 2010-12-22 2012-06-28 Jx日鉱日石金属株式会社 焼結体スパッタリングターゲット
SG10201500148WA (en) 2011-08-23 2015-03-30 Jx Nippon Mining & Metals Corp Ferromagnetic sputtering target with less particle generation

Also Published As

Publication number Publication date
JP5654121B2 (ja) 2015-01-14
US9773653B2 (en) 2017-09-26
MY170298A (en) 2019-07-17
TWI582250B (zh) 2017-05-11
TW201335397A (zh) 2013-09-01
CN104126026A (zh) 2014-10-29
CN104126026B (zh) 2016-03-23
US20140360870A1 (en) 2014-12-11
JPWO2013125296A1 (ja) 2015-07-30
WO2013125296A1 (ja) 2013-08-29

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