SG108217A1 - Surface acoustic wave device - Google Patents

Surface acoustic wave device

Info

Publication number
SG108217A1
SG108217A1 SG9906654A SG1999006654A SG108217A1 SG 108217 A1 SG108217 A1 SG 108217A1 SG 9906654 A SG9906654 A SG 9906654A SG 1999006654 A SG1999006654 A SG 1999006654A SG 108217 A1 SG108217 A1 SG 108217A1
Authority
SG
Singapore
Prior art keywords
acoustic wave
surface acoustic
wave device
wave
acoustic
Prior art date
Application number
SG9906654A
Other languages
English (en)
Inventor
Kawase Minoru
Kuroda Yasushi
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of SG108217A1 publication Critical patent/SG108217A1/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H2009/0019—Surface acoustic wave multichip

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
SG9906654A 1998-12-29 1999-12-28 Surface acoustic wave device SG108217A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP37725698 1998-12-29
JP29474799 1999-10-18

Publications (1)

Publication Number Publication Date
SG108217A1 true SG108217A1 (en) 2005-01-28

Family

ID=26559973

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9906654A SG108217A1 (en) 1998-12-29 1999-12-28 Surface acoustic wave device

Country Status (5)

Country Link
US (1) US6339365B1 (de)
EP (1) EP1017169B1 (de)
KR (1) KR100418550B1 (de)
DE (1) DE69924225T2 (de)
SG (1) SG108217A1 (de)

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US6287850B1 (en) * 1995-06-07 2001-09-11 Affymetrix, Inc. Bioarray chip reaction apparatus and its manufacture
JP2001267881A (ja) * 2000-03-17 2001-09-28 Fujitsu Media Device Kk 弾性表面波デバイス及びこれを用いた通信装置、並びにアンテナデュプレクサ
JP3729081B2 (ja) * 2000-06-27 2005-12-21 株式会社村田製作所 弾性表面波装置
JP4049239B2 (ja) * 2000-08-30 2008-02-20 Ｔｄｋ株式会社 表面弾性波素子を含む高周波モジュール部品の製造方法
US8623709B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of top port surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
JP3747853B2 (ja) * 2002-01-08 2006-02-22 株式会社村田製作所 弾性表面波装置を備えた分波器
JP2003218150A (ja) * 2002-01-23 2003-07-31 Fujitsu Media Device Kk モジュール部品
US7312674B2 (en) * 2002-08-06 2007-12-25 The Charles Stark Draper Laboratory, Inc. Resonator system with a plurality of individual mechanically coupled resonators and method of making same
US6975180B2 (en) * 2002-08-08 2005-12-13 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave filter, and antenna duplexer and communication equipment using the same
JP3764731B2 (ja) * 2002-10-18 2006-04-12 富士通メディアデバイス株式会社 多重モード弾性表面波フィルタ及び分波器
JP4207836B2 (ja) * 2003-07-25 2009-01-14 株式会社村田製作所 弾性表面波分波器
US8222721B2 (en) * 2003-09-15 2012-07-17 Silicon Laboratories Inc. Integrated circuit suitable for use in radio receivers
JP2005159896A (ja) * 2003-11-27 2005-06-16 Sanyo Electric Co Ltd アンテナ共用器
US7446629B2 (en) * 2004-08-04 2008-11-04 Matsushita Electric Industrial Co., Ltd. Antenna duplexer, and RF module and communication apparatus using the same
DE102004037819B4 (de) * 2004-08-04 2021-12-16 Snaptrack, Inc. Elektroakustisches Bauelement mit geringen Verlusten
JP4518870B2 (ja) * 2004-08-24 2010-08-04 京セラ株式会社 弾性表面波装置および通信装置
KR100691160B1 (ko) * 2005-05-06 2007-03-09 삼성전기주식회사 적층형 표면탄성파 패키지 및 그 제조방법
US8258674B2 (en) * 2008-11-03 2012-09-04 Viorel Olariu Surface acoustic wave sensor and system
JP5240793B2 (ja) * 2009-03-09 2013-07-17 日本電波工業株式会社 デュプレクサ
JP5029704B2 (ja) * 2010-01-20 2012-09-19 株式会社村田製作所 弾性波デュプレクサ
JP5333403B2 (ja) 2010-10-12 2013-11-06 株式会社村田製作所 弾性表面波フィルタ装置
JP2012182604A (ja) * 2011-03-01 2012-09-20 Panasonic Corp 弾性波フィルタ部品
CN103999484B (zh) 2011-11-04 2017-06-30 美商楼氏电子有限公司 作为声学设备中的屏障的嵌入式电介质和制造方法
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
KR101616639B1 (ko) * 2014-11-11 2016-04-28 삼성전기주식회사 표면 탄성파 소자 및 그 실장 장치, 이를 이용한 측정 센서
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
TWI677951B (zh) * 2018-11-09 2019-11-21 恆勁科技股份有限公司 表面聲波濾波器封裝結構及其製作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737742A (en) * 1986-01-28 1988-04-12 Alps Electric Co., Ltd. Unit carrying surface acoustic wave devices
EP0794616A2 (de) * 1996-03-08 1997-09-10 Matsushita Electric Industrial Co., Ltd. Elektronisches Bauteil und Herstellungsverfahren

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1089544A (en) * 1976-11-09 1980-11-11 Sadao Takahashi Elastic surface wave device
CA1281810C (en) * 1984-02-20 1991-03-19 Stephen P. Rogerson Mounting of saw devices
JPS61285814A (ja) 1985-06-12 1986-12-16 Toyo Commun Equip Co Ltd 縦型２重モ−ドｓａｗフイルタ
JP2555072B2 (ja) 1987-05-11 1996-11-20 株式会社日立製作所 固体電子装置
JP3386806B2 (ja) 1989-10-13 2003-03-17 株式会社日立製作所 通信装置
US5202652A (en) * 1989-10-13 1993-04-13 Hitachi, Ltd. Surface acoustic wave filter device formed on a plurality of piezoelectric substrates
JP2673993B2 (ja) * 1990-07-02 1997-11-05 日本無線株式会社 表面弾性波装置
JPH04170811A (ja) * 1990-11-05 1992-06-18 Fujitsu Ltd 弾性表面波デバイス
JPH0590873A (ja) 1991-09-28 1993-04-09 Murata Mfg Co Ltd 弾性表面波装置
US5459368A (en) * 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
KR0171921B1 (ko) * 1993-09-13 1999-03-30 모리시타 요이찌 전자부품과 그 제조방법
JPH07283682A (ja) 1994-04-13 1995-10-27 Murata Mfg Co Ltd 弾性表面波共振子フィルタ
JP3198252B2 (ja) 1995-05-31 2001-08-13 富士通株式会社 分波器及びその製造方法
JPH09232904A (ja) * 1996-02-28 1997-09-05 Oki Electric Ind Co Ltd Ｓａｗフィルタ用セラミックパッケージ
JPH1040435A (ja) 1996-07-25 1998-02-13 Toshiba Corp 硬貨識別装置
JP3735418B2 (ja) * 1996-08-28 2006-01-18 日本無線株式会社 弾性表面波デバイスおよびこれを使用する通信装置
JP3196693B2 (ja) * 1997-08-05 2001-08-06 日本電気株式会社 表面弾性波装置およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737742A (en) * 1986-01-28 1988-04-12 Alps Electric Co., Ltd. Unit carrying surface acoustic wave devices
EP0794616A2 (de) * 1996-03-08 1997-09-10 Matsushita Electric Industrial Co., Ltd. Elektronisches Bauteil und Herstellungsverfahren

Also Published As

Publication number Publication date
EP1017169B1 (de) 2005-03-16
EP1017169A2 (de) 2000-07-05
DE69924225D1 (de) 2005-04-21
KR100418550B1 (ko) 2004-02-11
US6339365B1 (en) 2002-01-15
EP1017169A3 (de) 2002-05-08
DE69924225T2 (de) 2006-03-30
KR20000052590A (ko) 2000-08-25

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