SG108214A1 - Integrated processor mounting mechanism and heat sink - Google Patents

Integrated processor mounting mechanism and heat sink

Info

Publication number
SG108214A1
SG108214A1 SG9904838A SG1999004838A SG108214A1 SG 108214 A1 SG108214 A1 SG 108214A1 SG 9904838 A SG9904838 A SG 9904838A SG 1999004838 A SG1999004838 A SG 1999004838A SG 108214 A1 SG108214 A1 SG 108214A1
Authority
SG
Singapore
Prior art keywords
heat sink
mounting mechanism
integrated processor
processor mounting
integrated
Prior art date
Application number
SG9904838A
Other languages
English (en)
Inventor
T Wyler Gregory
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of SG108214A1 publication Critical patent/SG108214A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG9904838A 1998-10-09 1999-09-28 Integrated processor mounting mechanism and heat sink SG108214A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10366398P 1998-10-09 1998-10-09
US09/334,218 US6269863B1 (en) 1998-10-09 1999-06-16 Integrated processor mounting mechanism and heat sink

Publications (1)

Publication Number Publication Date
SG108214A1 true SG108214A1 (en) 2005-01-28

Family

ID=26800720

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9904838A SG108214A1 (en) 1998-10-09 1999-09-28 Integrated processor mounting mechanism and heat sink

Country Status (7)

Country Link
US (1) US6269863B1 (ko)
EP (1) EP0992875A1 (ko)
JP (2) JP2000124645A (ko)
KR (1) KR100330330B1 (ko)
CN (1) CN1251431A (ko)
SG (1) SG108214A1 (ko)
TW (1) TW449255U (ko)

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JP2001135755A (ja) * 1999-11-10 2001-05-18 Oki Electric Ind Co Ltd 放熱フィン構造
KR20010048362A (ko) * 1999-11-26 2001-06-15 박종섭 그라운드패턴을 이용한 피씨비 방열장치
WO2001056346A1 (en) * 2000-01-25 2001-08-02 Fujitsu Limited Retention module, heat sink and electronic device
US6369678B1 (en) * 2000-06-12 2002-04-09 Motorola, Inc. RF assembly with ground-plane slot between components and method therefor
US6683796B2 (en) 2002-01-09 2004-01-27 Sun Microsystems, Inc. Apparatus for containing electromagnetic interference
US20040012939A1 (en) * 2002-03-14 2004-01-22 Sun Microsystems, Inc. EMI shielding apparatus
US6668910B2 (en) * 2002-04-09 2003-12-30 Delphi Technologies, Inc. Heat sink with multiple surface enhancements
US6639800B1 (en) 2002-04-30 2003-10-28 Advanced Micro Devices, Inc. Heat sink subassembly
GB2389710B (en) * 2002-06-10 2006-02-08 Sun Microsystems Inc Electronics module
US20030227759A1 (en) * 2002-06-10 2003-12-11 Haworth Stephen Paul Electromagnetic interference gasket
JP2005531976A (ja) * 2002-06-28 2005-10-20 テレフオンアクチーボラゲット エル エム エリクソン（パブル） 一体化されたフィルタ構造物
US6944025B2 (en) * 2002-08-20 2005-09-13 Sun Microsystems, Inc. EMI shielding apparatus
US7115817B2 (en) * 2002-09-18 2006-10-03 Sun Microsystems, Inc. Heat sink and electromagnetic interference reduction device
US6714416B1 (en) * 2002-11-13 2004-03-30 Cisco Technology, Inc. Mechanisms and techniques for fastening a heat sink to a circuit board component
US6956285B2 (en) * 2003-01-15 2005-10-18 Sun Microsystems, Inc. EMI grounding pins for CPU/ASIC chips
US6943436B2 (en) * 2003-01-15 2005-09-13 Sun Microsystems, Inc. EMI heatspreader/lid for integrated circuit packages
KR100468783B1 (ko) * 2003-02-11 2005-01-29 삼성전자주식회사 반도체 모듈로부터 발생되는 열을 소산시키는 집게형 장치
US7139174B1 (en) 2003-10-29 2006-11-21 Cisco Technology, Inc. Techniques for attaching a heat sink assembly to a circuit board component
US6909043B1 (en) 2003-11-12 2005-06-21 Sun Microsystems, Inc. EMI seal for system chassis
US7164587B1 (en) 2004-01-14 2007-01-16 Sun Microsystems, Inc. Integral heatsink grounding arrangement
US7239507B1 (en) 2004-03-24 2007-07-03 Sun Microsystems, Inc. Slot frame with guide tabs for reducing EMI gaps
US7113406B1 (en) 2004-07-22 2006-09-26 Cisco Technology, Inc. Methods and apparatus for fastening a set of heatsinks to a circuit board
US7245485B1 (en) * 2004-11-15 2007-07-17 Utstarcom, Inc. Electronics cabinet with internal air-to-air heat exchanger
US7321493B2 (en) * 2004-12-01 2008-01-22 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US7324344B2 (en) * 2004-12-01 2008-01-29 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US7450400B2 (en) * 2004-12-08 2008-11-11 Hewlett-Packard Development Company, L.P. Electronic system and method
US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system
US7272009B2 (en) * 2005-06-02 2007-09-18 Dell Products L.P. Method and apparatus for heat sink and card retention
TW201235824A (en) * 2011-02-25 2012-09-01 Asia Vital Components Co Ltd Heat dissipating module and its manufacturing method
CN103378512A (zh) * 2012-04-25 2013-10-30 鸿富锦精密工业（深圳）有限公司 连接器固定结构及具有连接器的电子装置
JP5558613B2 (ja) * 2013-08-20 2014-07-23 三菱電機株式会社 誘導加熱調理器
JP5766850B2 (ja) * 2014-06-04 2015-08-19 三菱電機株式会社 誘導加熱調理器
USD806646S1 (en) * 2015-02-27 2018-01-02 Johnson Controls Technology Company Battery module cooling fins and footings
US10488028B2 (en) * 2017-05-03 2019-11-26 Fluence Bioengineering, Inc. Systems and methods for a heat sink
US10986756B2 (en) * 2017-12-28 2021-04-20 Hughes Network Systems Llc Cooling apparatus for an electrical component
CN111740262A (zh) * 2019-03-25 2020-10-02 泰科电子(上海)有限公司 连接器
USD933881S1 (en) * 2020-03-16 2021-10-19 Hgci, Inc. Light fixture having heat sink

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US5748446A (en) * 1996-12-11 1998-05-05 Intel Corporation Heat sink support

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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748446A (en) * 1996-12-11 1998-05-05 Intel Corporation Heat sink support
DE29719231U1 (de) * 1997-10-29 1997-12-04 Lin, Mike, Da-Lei Hsiang, Taichung CPU- und Kühlkörper-Befestigungsanordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, VOL. 38, NO. 03, MAR 1995, PGS 383-385, XP000508086 *

Also Published As

Publication number Publication date
CN1251431A (zh) 2000-04-26
KR100330330B1 (ko) 2002-04-01
US6269863B1 (en) 2001-08-07
JP2000124645A (ja) 2000-04-28
KR20000028919A (ko) 2000-05-25
EP0992875A1 (en) 2000-04-12
JP3090441U (ja) 2002-12-13
TW449255U (en) 2001-08-01

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