SG10202012033VA - Polishing method and polishing apparatus - Google Patents
Polishing method and polishing apparatusInfo
- Publication number
- SG10202012033VA SG10202012033VA SG10202012033VA SG10202012033VA SG10202012033VA SG 10202012033V A SG10202012033V A SG 10202012033VA SG 10202012033V A SG10202012033V A SG 10202012033VA SG 10202012033V A SG10202012033V A SG 10202012033VA SG 10202012033V A SG10202012033V A SG 10202012033VA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- polishing apparatus
- polishing method
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/23—Clustering techniques
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/045—Combinations of networks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Data Mining & Analysis (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Evolutionary Computation (AREA)
- Artificial Intelligence (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computational Linguistics (AREA)
- General Health & Medical Sciences (AREA)
- Software Systems (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Biophysics (AREA)
- Molecular Biology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Evolutionary Biology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Bioinformatics & Computational Biology (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019222892A JP7469032B2 (ja) | 2019-12-10 | 2019-12-10 | 研磨方法および研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202012033VA true SG10202012033VA (en) | 2021-07-29 |
Family
ID=76209431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202012033VA SG10202012033VA (en) | 2019-12-10 | 2020-12-02 | Polishing method and polishing apparatus |
Country Status (6)
Country | Link |
---|---|
US (2) | US11759913B2 (ja) |
JP (1) | JP7469032B2 (ja) |
KR (1) | KR20210073465A (ja) |
CN (1) | CN112936090A (ja) |
SG (1) | SG10202012033VA (ja) |
TW (1) | TW202138122A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022108789A (ja) * | 2021-01-14 | 2022-07-27 | 株式会社荏原製作所 | 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法 |
CN116713892B (zh) * | 2023-08-10 | 2023-11-10 | 北京特思迪半导体设备有限公司 | 用于晶圆薄膜磨削的终点检测方法及设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05128256A (ja) | 1991-10-31 | 1993-05-25 | Sumitomo Light Metal Ind Ltd | 欠陥画像処理装置及び静止画像取込装置 |
JPH07111721B2 (ja) | 1992-06-05 | 1995-11-29 | 日本アイ・ビー・エム株式会社 | 線要素データの3次元変換装置及び方法 |
JP3906230B2 (ja) | 2005-03-11 | 2007-04-18 | 株式会社東芝 | 音響信号処理装置、音響信号処理方法、音響信号処理プログラム、及び音響信号処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
KR101324644B1 (ko) * | 2005-08-22 | 2013-11-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
JP5376293B2 (ja) * | 2008-11-17 | 2013-12-25 | 株式会社ニコン | 終点検出装置および研磨装置 |
US8202738B2 (en) * | 2010-05-05 | 2012-06-19 | Applied Materials, Inc. | Endpoint method using peak location of modified spectra |
JP5980476B2 (ja) * | 2010-12-27 | 2016-08-31 | 株式会社荏原製作所 | ポリッシング装置およびポリッシング方法 |
US8547538B2 (en) | 2011-04-21 | 2013-10-01 | Applied Materials, Inc. | Construction of reference spectra with variations in environmental effects |
TWI635929B (zh) * | 2013-07-11 | 2018-09-21 | 日商荏原製作所股份有限公司 | 研磨裝置及研磨狀態監視方法 |
JP6215602B2 (ja) | 2013-07-11 | 2017-10-18 | 株式会社荏原製作所 | 研磨装置および研磨状態監視方法 |
JP2015126179A (ja) * | 2013-12-27 | 2015-07-06 | 株式会社荏原製作所 | 研磨終点検出方法、及び研磨終点検出装置 |
JP6595987B2 (ja) | 2014-04-22 | 2019-10-23 | 株式会社荏原製作所 | 研磨方法 |
-
2019
- 2019-12-10 JP JP2019222892A patent/JP7469032B2/ja active Active
-
2020
- 2020-12-02 SG SG10202012033VA patent/SG10202012033VA/en unknown
- 2020-12-03 US US17/110,797 patent/US11759913B2/en active Active
- 2020-12-04 KR KR1020200168165A patent/KR20210073465A/ko unknown
- 2020-12-08 TW TW109143142A patent/TW202138122A/zh unknown
- 2020-12-08 CN CN202011422501.0A patent/CN112936090A/zh active Pending
-
2023
- 2023-08-09 US US18/232,278 patent/US20230381919A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
TW202138122A (zh) | 2021-10-16 |
US20230381919A1 (en) | 2023-11-30 |
US11759913B2 (en) | 2023-09-19 |
US20210170544A1 (en) | 2021-06-10 |
JP2021091038A (ja) | 2021-06-17 |
KR20210073465A (ko) | 2021-06-18 |
CN112936090A (zh) | 2021-06-11 |
JP7469032B2 (ja) | 2024-04-16 |
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