SG10201900307RA - Molding die, resin molding apparatus, and method for producing a resin molded product - Google Patents

Molding die, resin molding apparatus, and method for producing a resin molded product

Info

Publication number
SG10201900307RA
SG10201900307RA SG10201900307RA SG10201900307RA SG10201900307RA SG 10201900307R A SG10201900307R A SG 10201900307RA SG 10201900307R A SG10201900307R A SG 10201900307RA SG 10201900307R A SG10201900307R A SG 10201900307RA SG 10201900307R A SG10201900307R A SG 10201900307RA
Authority
SG
Singapore
Prior art keywords
lower die
die
molding
resin
producing
Prior art date
Application number
SG10201900307RA
Other languages
English (en)
Inventor
Onishi Yohei
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG10201900307RA publication Critical patent/SG10201900307RA/en

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
SG10201900307RA 2018-01-22 2019-01-14 Molding die, resin molding apparatus, and method for producing a resin molded product SG10201900307RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018008487A JP6876637B2 (ja) 2018-01-22 2018-01-22 成形型、樹脂成形装置及び樹脂成形品の製造方法

Publications (1)

Publication Number Publication Date
SG10201900307RA true SG10201900307RA (en) 2019-08-27

Family

ID=67365880

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900307RA SG10201900307RA (en) 2018-01-22 2019-01-14 Molding die, resin molding apparatus, and method for producing a resin molded product

Country Status (5)

Country Link
JP (1) JP6876637B2 (enExample)
KR (1) KR102192243B1 (enExample)
CN (1) CN110065191B (enExample)
SG (1) SG10201900307RA (enExample)
TW (1) TWI718447B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112428501B (zh) * 2020-10-29 2022-09-23 台州耘智科技有限公司 一种节能橡胶成型机
JP7560059B2 (ja) * 2021-10-08 2024-10-02 株式会社神戸製鋼所 金属樹脂複合体を製造するための装置、金型セット、および方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3994705B2 (ja) * 2001-09-13 2007-10-24 松下電工株式会社 メモリーカードの製造方法
JP4953619B2 (ja) 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP5539814B2 (ja) * 2010-08-30 2014-07-02 Ｔｏｗａ株式会社 基板露出面を備えた樹脂封止成形品の製造方法及び装置
JP5237346B2 (ja) 2010-10-14 2013-07-17 Ｔｏｗａ株式会社 半導体チップの圧縮成形方法及び圧縮成形型
JP5799422B2 (ja) 2011-02-14 2015-10-28 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP5682033B2 (ja) 2011-03-14 2015-03-11 アピックヤマダ株式会社 樹脂封止装置
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
WO2014192456A1 (ja) * 2013-05-29 2014-12-04 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP5694486B2 (ja) * 2013-11-12 2015-04-01 アピックヤマダ株式会社 樹脂封止装置
JP6307374B2 (ja) 2014-07-22 2018-04-04 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
KR102455987B1 (ko) * 2014-07-22 2022-10-18 아피쿠 야마다 가부시키가이샤 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법
JP6525580B2 (ja) * 2014-12-24 2019-06-05 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
WO2017010319A1 (ja) * 2015-07-15 2017-01-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置
JP6438913B2 (ja) * 2015-07-15 2018-12-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置
JP6506680B2 (ja) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP2017177554A (ja) * 2016-03-30 2017-10-05 株式会社ケーヒン 回路装置、回路装置の製造装置及びその製造方法
JP2017212419A (ja) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 樹脂封止品製造方法及び樹脂封止装置

Also Published As

Publication number Publication date
TW201932273A (zh) 2019-08-16
TWI718447B (zh) 2021-02-11
JP2019126927A (ja) 2019-08-01
JP6876637B2 (ja) 2021-05-26
CN110065191B (zh) 2021-12-03
KR102192243B1 (ko) 2020-12-16
KR20190089711A (ko) 2019-07-31
CN110065191A (zh) 2019-07-30

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