SG10201710235VA - Optoelectronic modules having a silicon substrate, and fabrication methods for such modules - Google Patents
Optoelectronic modules having a silicon substrate, and fabrication methods for such modulesInfo
- Publication number
- SG10201710235VA SG10201710235VA SG10201710235VA SG10201710235VA SG10201710235VA SG 10201710235V A SG10201710235V A SG 10201710235VA SG 10201710235V A SG10201710235V A SG 10201710235VA SG 10201710235V A SG10201710235V A SG 10201710235VA SG 10201710235V A SG10201710235V A SG 10201710235VA
- Authority
- SG
- Singapore
- Prior art keywords
- modules
- silicon substrate
- fabrication methods
- optoelectronic
- optoelectronic modules
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000005693 optoelectronics Effects 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Lens Barrels (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462039028P | 2014-08-19 | 2014-08-19 | |
| US201462056897P | 2014-09-29 | 2014-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201710235VA true SG10201710235VA (en) | 2018-01-30 |
Family
ID=55348956
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201700690VA SG11201700690VA (en) | 2014-08-19 | 2015-08-18 | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
| SG10201710235VA SG10201710235VA (en) | 2014-08-19 | 2015-08-18 | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201700690VA SG11201700690VA (en) | 2014-08-19 | 2015-08-18 | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US9711552B2 (ko) |
| EP (1) | EP3183745B1 (ko) |
| JP (2) | JP2017531310A (ko) |
| KR (1) | KR102434816B1 (ko) |
| CN (1) | CN106796916B (ko) |
| SG (2) | SG11201700690VA (ko) |
| TW (1) | TWI702717B (ko) |
| WO (1) | WO2016028227A1 (ko) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106715552A (zh) * | 2014-09-30 | 2017-05-24 | 积水化学工业株式会社 | 电子设备用导热性发泡体片 |
| US20160307881A1 (en) * | 2015-04-20 | 2016-10-20 | Advanced Semiconductor Engineering, Inc. | Optical sensor module and method for manufacturing the same |
| EP3104190B1 (en) * | 2015-06-08 | 2024-04-17 | ams AG | Optical sensor arrangement |
| CN109287131B (zh) * | 2016-03-23 | 2022-07-19 | 赫普塔冈微光有限公司 | 光电模块组件和制造方法 |
| US10204947B2 (en) * | 2016-09-09 | 2019-02-12 | Omnivision Technologies, Inc. | Cover-glass-free array camera with individually light-shielded cameras |
| DE102016118990A1 (de) | 2016-10-06 | 2018-04-12 | Osram Opto Semiconductors Gmbh | Sensor |
| DE102016118996A1 (de) * | 2016-10-06 | 2018-04-12 | Osram Opto Semiconductors Gmbh | Herstellung von sensoren |
| EP3547376B1 (en) * | 2016-11-24 | 2023-05-17 | Lg Innotek Co., Ltd. | Semiconductor device and display device comprising same |
| WO2020027724A1 (en) * | 2018-07-30 | 2020-02-06 | Ams Sensors Singapore Pte. Ltd. | Low-height optoelectronic modules and packages |
| US10707195B2 (en) * | 2018-10-09 | 2020-07-07 | Waymo Llc | Multichannel monostatic rangefinder |
| CN113646902A (zh) * | 2019-03-28 | 2021-11-12 | ams传感器新加坡私人有限公司 | 光电模块 |
| US11269376B2 (en) * | 2020-06-11 | 2022-03-08 | Apple Inc. | Electronic device |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3619773B2 (ja) * | 2000-12-20 | 2005-02-16 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP4750983B2 (ja) * | 2001-09-21 | 2011-08-17 | シチズン電子株式会社 | 双方向光伝送デバイス |
| JP2004006753A (ja) * | 2002-04-05 | 2004-01-08 | Canon Inc | 光半導体用パッケージ |
| JP2006245118A (ja) * | 2005-03-01 | 2006-09-14 | Konica Minolta Opto Inc | 撮像装置及び撮像装置の製造方法 |
| US7692256B2 (en) | 2007-03-23 | 2010-04-06 | Heptagon Oy | Method of producing a wafer scale package |
| JP2008283002A (ja) * | 2007-05-10 | 2008-11-20 | Sharp Corp | 撮像素子モジュールおよびその製造方法 |
| TW200937642A (en) * | 2007-12-19 | 2009-09-01 | Heptagon Oy | Wafer stack, integrated optical device and method for fabricating the same |
| JP5554957B2 (ja) * | 2009-10-09 | 2014-07-23 | オリンパス株式会社 | 撮像ユニット |
| JP5356980B2 (ja) * | 2009-11-06 | 2013-12-04 | シャープ株式会社 | 電子素子モジュールおよびその製造方法、電子素子ウエハモジュールおよびその製造方法、並びに電子情報機器 |
| JP2011180293A (ja) * | 2010-02-26 | 2011-09-15 | Fujifilm Corp | レンズアレイ |
| US9237264B2 (en) * | 2010-08-17 | 2016-01-12 | Heptagon Micro Optics Pte. Ltd. | Method of manufacturing a plurality of optical devices for cameras |
| KR101262470B1 (ko) | 2011-01-31 | 2013-05-08 | 엘지이노텍 주식회사 | 렌즈 어셈블리 및 카메라 모듈 |
| WO2013010285A1 (en) * | 2011-07-19 | 2013-01-24 | Heptagon Micro Optics Pte. Ltd. | Method for manufacturing passive optical components, and devices comprising the same |
| SG10201601911PA (en) | 2011-07-19 | 2016-04-28 | Heptagon Micro Optics Pte Ltd | Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same |
| KR101890457B1 (ko) * | 2011-08-10 | 2018-08-21 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 광전자 모듈 및 그것을 제조하기 위한 방법 |
| TW201310102A (zh) | 2011-08-17 | 2013-03-01 | Pixart Imaging Inc | 鏡頭模組及其製造方法 |
| WO2013026174A2 (en) * | 2011-08-25 | 2013-02-28 | Heptagon Micro Optics Pte. Ltd. | Wafer-level fabrication of optical devices. in particular of modules for computational cameras |
| SG10201605065QA (en) | 2011-12-22 | 2016-08-30 | Heptagon Micro Optics Pte Ltd | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
| US9063005B2 (en) * | 2012-04-05 | 2015-06-23 | Heptagon Micro Optics Pte. Ltd. | Reflowable opto-electronic module |
| US9570648B2 (en) * | 2012-06-15 | 2017-02-14 | Intersil Americas LLC | Wafer level optical proximity sensors and systems including wafer level optical proximity sensors |
| NL2009740C2 (en) | 2012-11-01 | 2014-05-06 | Ihc Holland Ie Bv | Device for and method of transferring personnel, equipment and/or structural elements from a surface vessel to an offshore structure. |
| US9595553B2 (en) * | 2012-11-02 | 2017-03-14 | Heptagon Micro Optics Pte. Ltd. | Optical modules including focal length adjustment and fabrication of the optical modules |
| US9094593B2 (en) | 2013-07-30 | 2015-07-28 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
| US9123735B2 (en) * | 2013-07-31 | 2015-09-01 | Infineon Technologies Austria Ag | Semiconductor device with combined passive device on chip back side |
| TWI667767B (zh) * | 2014-03-31 | 2019-08-01 | 菱生精密工業股份有限公司 | Package structure of integrated optical module |
-
2015
- 2015-08-11 US US14/823,174 patent/US9711552B2/en active Active
- 2015-08-18 CN CN201580048491.XA patent/CN106796916B/zh active Active
- 2015-08-18 KR KR1020177007206A patent/KR102434816B1/ko active IP Right Grant
- 2015-08-18 SG SG11201700690VA patent/SG11201700690VA/en unknown
- 2015-08-18 SG SG10201710235VA patent/SG10201710235VA/en unknown
- 2015-08-18 EP EP15833195.9A patent/EP3183745B1/en active Active
- 2015-08-18 TW TW104126868A patent/TWI702717B/zh active
- 2015-08-18 JP JP2017509730A patent/JP2017531310A/ja active Pending
- 2015-08-18 WO PCT/SG2015/050264 patent/WO2016028227A1/en active Application Filing
-
2017
- 2017-06-14 US US15/622,813 patent/US10283542B2/en active Active
-
2019
- 2019-03-19 US US16/357,627 patent/US10680023B2/en active Active
- 2019-11-28 JP JP2019215475A patent/JP2020038998A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP3183745A1 (en) | 2017-06-28 |
| TWI702717B (zh) | 2020-08-21 |
| TW201620124A (zh) | 2016-06-01 |
| SG11201700690VA (en) | 2017-03-30 |
| US10283542B2 (en) | 2019-05-07 |
| US20160056194A1 (en) | 2016-02-25 |
| KR20170045259A (ko) | 2017-04-26 |
| KR102434816B1 (ko) | 2022-08-19 |
| JP2017531310A (ja) | 2017-10-19 |
| US20170287963A1 (en) | 2017-10-05 |
| EP3183745A4 (en) | 2018-08-15 |
| US9711552B2 (en) | 2017-07-18 |
| US20190326340A1 (en) | 2019-10-24 |
| JP2020038998A (ja) | 2020-03-12 |
| EP3183745B1 (en) | 2019-11-13 |
| US10680023B2 (en) | 2020-06-09 |
| CN106796916B (zh) | 2019-11-08 |
| WO2016028227A1 (en) | 2016-02-25 |
| CN106796916A (zh) | 2017-05-31 |
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